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1. 发明授权

US06217987B1 Solder resist composition and printed circuit boards 失效
标题翻译：阻焊剂组合物和印刷电路板
公开(公告)号：US06217987B1
公开(公告)日：2001-04-17
申请号：US08931364
申请日：1997-09-16
申请人： Yoshitaka Ono , Akihiko Goto , Ayao Niki , Motoo Asai
发明人： Yoshitaka Ono , Akihiko Goto , Ayao Niki , Motoo Asai
IPC分类号： B32B300
CPC分类号： H05K3/244 , G03F7/032 , G03F7/0388 , H05K1/112 , H05K3/184 , H05K3/28 , H05K3/287 , H05K3/3457 , H05K3/384 , H05K3/4644 , H05K2201/09472 , H05K2201/09509 , H05K2203/0307 , H05K2203/0392 , H05K2203/072 , Y10S428/901 , Y10T428/24917
摘要： A solder resist composition comprises an acrylate of novolac type epoxy resin and an imidazole curing agent and has a viscosity of 0.5-10 Pa·s adjusted with glycol ether type solvent. A printed circuit board is formed by using such a solder resist composition.
摘要翻译：阻焊剂组合物包含酚醛清漆型环氧树脂的丙烯酸酯和咪唑固化剂，并且用乙二醇醚型溶剂调节粘度为0.5-10Pa·s。通过使用这种阻焊剂组合物形成印刷电路板。

2. 发明授权

US07916492B1 Multilayered printed circuit board 有权
标题翻译：多层印刷电路板
公开(公告)号：US07916492B1
公开(公告)日：2011-03-29
申请号：US10049270
申请日：2000-07-28
申请人： Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
发明人： Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K3/285 , H01L2924/15311 , H01L2924/15312 , H05K3/4602
摘要： The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
摘要翻译：本发明是提供一种不存在由于阻焊层与另一部分之间的热膨胀差异而引起的裂纹的多层印刷电路板和本发明的多层印刷电路板，其特征在于，包括：导体电路和串联形成在所述多层印刷电路板上的树脂绝缘层基板以重复的方式和形成为最外层的阻焊层，并且阻焊层包含无机填料。

3. 发明申请

US20080041615A1 Multilayered printed circuit board, solder resist composition, multilayered printed circuit board manufacturing method, and semiconductor device 有权
标题翻译：多层印刷电路板，阻焊剂组合物，多层印刷电路板制造方法和半导体器件
公开(公告)号：US20080041615A1
公开(公告)日：2008-02-21
申请号：US11838365
申请日：2007-08-14
申请人： Hui ZHONG , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
发明人： Hui ZHONG , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
IPC分类号： H05K1/03
CPC分类号： H05K3/285 , H01L2924/15311 , H01L2924/15312 , H05K3/4602
摘要： The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
摘要翻译：本发明是提供一种不存在由于阻焊层与另一部分之间的热膨胀差异而引起的裂纹的多层印刷电路板和本发明的多层印刷电路板，其特征在于，包括：导体电路和串联形成在所述多层印刷电路板上的树脂绝缘层基板以重复的方式和形成为最外层的阻焊层，并且阻焊层包含无机填料。

4. 发明授权

US07910836B2 Multilayered printed circuit board, solder resist composition, and semiconductor device 有权
标题翻译：多层印刷电路板，阻焊剂组合物和半导体器件
公开(公告)号：US07910836B2
公开(公告)日：2011-03-22
申请号：US11838365
申请日：2007-08-14
申请人： Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
发明人： Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
IPC分类号： H05K1/03
CPC分类号： H05K3/285 , H01L2924/15311 , H01L2924/15312 , H05K3/4602
摘要： The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
摘要翻译：本发明是提供一种不存在由于阻焊层与另一部分之间的热膨胀差异而引起的裂纹的多层印刷电路板和本发明的多层印刷电路板，其特征在于，包括：导体电路和串联形成在所述多层印刷电路板上的树脂绝缘层基板以重复的方式和形成为最外层的阻焊层，并且阻焊层包含无机填料。

5. 发明授权

US06261671B1 Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board 有权
标题翻译：用于化学镀的粘合剂，用于制备用于化学镀的粘合剂的原料组合物和印刷线路板
公开(公告)号：US06261671B1
公开(公告)日：2001-07-17
申请号：US09402475
申请日：1999-10-12
申请人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
发明人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
IPC分类号： B32B300
CPC分类号： H05K3/4676 , C23C18/1608 , C23C18/1651 , C23C18/1653 , C23C18/1844 , C23C18/24 , C23C18/405 , C23C18/50 , C23C18/54 , H05K3/4673 , H05K2201/0212 , H05K2201/0269 , H05K2203/0773 , Y10S428/901 , Y10T428/24893 , Y10T428/24917
摘要： The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.
摘要翻译：公开了用于化学镀的粘合剂，其有利于确保线间和层之间的绝缘可靠性同时保持实用的剥离强度，并且使用粘合剂的印刷电路板。粘合剂通过将可溶于酸或氧化剂的固化的耐热树脂颗粒通过固化处理分解为难溶于酸或氧化剂的未固化的耐热树脂基体而形成，其中耐热树脂颗粒的平均粒径为不超过1.5个妈妈。

6. 发明授权

US06248428B1 Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board 有权
标题翻译：化学镀用粘合剂，化学镀用粘合剂用原料组合物及印刷线路板
公开(公告)号：US06248428B1
公开(公告)日：2001-06-19
申请号：US09402477
申请日：1999-10-12
申请人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
发明人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
IPC分类号： B32B300
CPC分类号： H05K3/4661 , H05K3/387 , H05K3/4602 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , Y10S428/901 , Y10T428/24893 , Y10T428/24917 , Y10T428/2804
摘要： Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 &mgr;m, and comprised of rough particles and fine particles.
摘要翻译：用于化学镀的粘合剂粘合剂确保了线之间和层之间的绝缘可靠性，同时保持实际的剥离强度，并且公开了使用该粘合剂的印刷电路板。粘合剂通过将可溶于酸或氧化剂的固化的耐热树脂颗粒通过固化处理分解为难溶于酸或氧化剂的未固化的耐热树脂基体而形成，其中耐热树脂颗粒的平均粒径为不超过2毫米，由粗颗粒和细颗粒组成。

7. 发明申请

US20100163288A1 MULTILAYERED PRINTED CIRCUIT BOARD 审中-公开
标题翻译：多层印刷电路板
公开(公告)号：US20100163288A1
公开(公告)日：2010-07-01
申请号：US12685190
申请日：2010-01-11
申请人： Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
发明人： Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
IPC分类号： H05K1/03
CPC分类号： H05K3/285 , H01L2924/15311 , H01L2924/15312 , H05K3/4602
摘要： The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
摘要翻译：本发明是提供一种不存在由于阻焊层与另一部分之间的热膨胀差异而引起的裂纹的多层印刷电路板和本发明的多层印刷电路板，其特征在于，包括：导体电路和串联形成在所述多层印刷电路板上的树脂绝缘层基板以重复的方式和形成为最外层的阻焊层，并且阻焊层包含无机填料。

8. 发明授权

US6010823A Resist compositions for plating 失效
标题翻译：电镀抗蚀组合物
公开(公告)号：US6010823A
公开(公告)日：2000-01-04
申请号：US813985
申请日：1997-03-10
申请人： Akihiko Goto , Yoshitaka Ono
发明人： Akihiko Goto , Yoshitaka Ono
IPC分类号： G03F7/032 , G03F7/038 , H05K3/18 , G03C1/73
CPC分类号： G03F7/0388 , G03F7/032 , G03F7/0385 , H05K3/184
摘要： A resist composition for plating comprises a partial-acrylated, uncured novolac type epoxy resin as a photosensitive resin ingredient and an imidazole curing agent as a curing agent, wherein the imidazole curing agent is liquid at 25.degree. C. or the composition contains an acrylic ester polymer having a molecular weight of 500-5000. By using such a resist composition can be provided a printed wiring board having excellent conduction reliability and heat cycle property.
摘要翻译：电镀抗蚀剂组合物包含作为感光性树脂成分的部分丙烯酸酯化的未固化的酚醛清漆型环氧树脂和作为固化剂的咪唑固化剂，其中咪唑固化剂在25℃下为液体，或者该组合物含有丙烯酸酯聚合物的分子量为500-5000。通过使用这种抗蚀剂组合物，可以提供具有优异的导电可靠性和热循环特性的印刷线路板。

9. 发明授权

US09755243B2 Electrode catalyst layer for fuel cells, electrode for fuel cells, membrane electrode assembly for fuel cells, and fuel cell 有权
公开(公告)号：US09755243B2
公开(公告)日：2017-09-05
申请号：US14240653
申请日：2012-08-14
申请人： Tetsuya Mashio , Atsushi Ohma , Yoshitaka Ono , Hiroshi Iden
发明人： Tetsuya Mashio , Atsushi Ohma , Yoshitaka Ono , Hiroshi Iden
IPC分类号： H01M4/86 , B01J23/42 , H01M4/92 , B01J35/00 , H01M8/1007 , H01M8/1018
CPC分类号： H01M4/8663 , B01J23/42 , B01J35/0033 , B01J35/0053 , H01M4/8605 , H01M4/8668 , H01M4/92 , H01M4/925 , H01M8/1007 , H01M2008/1095
摘要： This electrode catalyst layer for fuel cells is provided with: an electrode catalyst that comprises a conductive carrier and platinum-containing metal particles supported on the surface of the conductive carrier; and an ionomer that covers the electrode catalyst. This electrode catalyst layer for fuel cells is characterized in that the average thickness of the ionomer is 2.4 nm or less. This electrode catalyst layer for fuel cells is capable of having a good balance between proton transport properties and transport properties for a gas such as an oxidant gas or a fuel gas even in cases where the amount of supported platinum is decreased. In addition, an electrode for fuel cells, a membrane electrode assembly for fuel cells, and a fuel cell, each having good current-voltage characteristics, can be obtained using the above-described electrode catalyst layer for fuel cells.

10. 发明申请

US20120020197A1 OPTICAL PICKUP DEVICE 失效
标题翻译：光学拾取器件
公开(公告)号：US20120020197A1
公开(公告)日：2012-01-26
申请号：US13260969
申请日：2009-03-30
申请人： Norio Matsuda , Yoshitaka Ono
发明人： Norio Matsuda , Yoshitaka Ono
IPC分类号： G11B7/135
CPC分类号： G11B7/1362 , G11B7/121 , G11B7/1359
摘要： An optical pickup device, which can effectively prevent occurrence of trouble in recording and reproducing of information due to the fact that an objective lens for each optical beam is contaminated while not adding unnecessary parts and while reducing a cost, is provided. An optical pickup device (P1) which performs the recording or reproducing of information in or from an optical disc (13) by using an optical beam (B) or (D), comprises: objective lenses (11) and (12) on which cleaning films which are activated by radiation of the optical beam (B) and clean their surfaces are formed in an optical path, and a control unit (15) for setting an optical path of the optical beam (B) in such a way that the optical beam (B) reflected by the optical disc (13) is radiated on the objective lens (12).
摘要翻译：提供了一种光拾取装置，其可以有效地防止由于每个光束的物镜被污染而不增加不必要的部分并且同时降低成本的事实而在信息的记录和再现中出现问题。通过使用光束（B）或（D）执行信息记录或从光盘（13）的记录或再现的光学拾取装置（P1）包括：物镜（11）和（12）通过光束（B）的辐射激活并清洁它们的表面的清洁膜被形成在光路中;以及控制单元（15），用于设置光束（B）的光路，使得由光盘（13）反射的光束（B）被辐射在物镜（12）上。

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