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1. 发明授权

US09060459B2 Printed wiring board and method for manufacturing same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US09060459B2
公开(公告)日：2015-06-16
申请号：US13434960
申请日：2012-03-30
申请人： Ayao Niki , Kazuhisa Kitajima
发明人： Ayao Niki , Kazuhisa Kitajima
IPC分类号： H05K7/10 , H05K3/46 , H05K3/00 , H05K1/11 , H05K3/02 , H05K3/06 , H05K3/10
CPC分类号： H05K3/4682 , H05K1/113 , H05K3/0058 , H05K3/025 , H05K3/06 , H05K3/108 , H05K2201/096 , H05K2203/0152 , H05K2203/0156 , H05K2203/0228 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.
摘要翻译：印刷布线板包括具有导电电路的多个导电层，具有开口的多个树脂绝缘层，并且包括位于树脂绝缘层的最外层的最上层的树脂绝缘层，分别形成在开口中的多个通孔导体，并将导电导电层中的电路，以及由铜箔形成并定位成装载电子元件的多个元件负载焊盘。交替层叠树脂绝缘层和导电层，并且在最上层的树脂绝缘层上形成元件负荷垫。

2. 发明授权

US08238114B2 Printed wiring board and method for manufacturing same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08238114B2
公开(公告)日：2012-08-07
申请号：US12188795
申请日：2008-08-08
申请人： Ayao Niki , Kazuhisa Kitajima
发明人： Ayao Niki , Kazuhisa Kitajima
IPC分类号： H05K7/10
CPC分类号： H05K3/4682 , H05K1/113 , H05K3/0058 , H05K3/025 , H05K3/06 , H05K3/108 , H05K2201/096 , H05K2203/0152 , H05K2203/0156 , H05K2203/0228 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.
摘要翻译：印刷布线板包括具有导电电路的多个导电层，具有开口的多个树脂绝缘层，并且包括位于树脂绝缘层的最外层的最上层的树脂绝缘层，分别形成在开口中的多个通孔导体，并将导电导电层中的电路，以及由铜箔形成并定位成装载电子元件的多个元件负载焊盘。交替层叠树脂绝缘层和导电层，并且在最上层的树脂绝缘层上形成元件负荷垫。

3. 发明授权

US06217987B1 Solder resist composition and printed circuit boards 失效
标题翻译：阻焊剂组合物和印刷电路板
公开(公告)号：US06217987B1
公开(公告)日：2001-04-17
申请号：US08931364
申请日：1997-09-16
申请人： Yoshitaka Ono , Akihiko Goto , Ayao Niki , Motoo Asai
发明人： Yoshitaka Ono , Akihiko Goto , Ayao Niki , Motoo Asai
IPC分类号： B32B300
CPC分类号： H05K3/244 , G03F7/032 , G03F7/0388 , H05K1/112 , H05K3/184 , H05K3/28 , H05K3/287 , H05K3/3457 , H05K3/384 , H05K3/4644 , H05K2201/09472 , H05K2201/09509 , H05K2203/0307 , H05K2203/0392 , H05K2203/072 , Y10S428/901 , Y10T428/24917
摘要： A solder resist composition comprises an acrylate of novolac type epoxy resin and an imidazole curing agent and has a viscosity of 0.5-10 Pa·s adjusted with glycol ether type solvent. A printed circuit board is formed by using such a solder resist composition.
摘要翻译：阻焊剂组合物包含酚醛清漆型环氧树脂的丙烯酸酯和咪唑固化剂，并且用乙二醇醚型溶剂调节粘度为0.5-10Pa·s。通过使用这种阻焊剂组合物形成印刷电路板。

4. 发明授权

US08563873B2 Substrate with metal film and method for manufacturing the same 有权
标题翻译：金属薄膜基板及其制造方法
公开(公告)号：US08563873B2
公开(公告)日：2013-10-22
申请号：US12607666
申请日：2009-10-28
申请人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H05K1/11 , C08F2/46 , C08J7/18
CPC分类号： H05K3/4661 , H05K3/0035 , H05K3/387 , H05K3/422 , H05K3/4682 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/09581 , H05K2201/09827 , H05K2203/1168
摘要： A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.
摘要翻译：一种用金属膜制造衬底的方法包括制备具有第一和第二表面的第一绝缘层，在第一绝缘层的第一表面上形成第一导电电路，在第一绝缘层的第一表面上形成第一绝缘层，第一导电电路，具有第一和第二表面的第二绝缘层，在所述第二绝缘层中形成从所述第一表面向所述第一导电电路渐缩的穿透孔，在所述穿透孔的内壁上形成含有聚合引发剂和聚合性化合物，通过照射该组合物，在该聚合物上涂布电镀催化剂，在该贯通孔的内壁上形成聚合物，在该贯通孔的内壁上形成电镀金属膜。第一绝缘层的第一表面面向第二绝缘层的第二表面。

5. 发明授权

US08085546B2 Multilayer printed wiring board for semiconductor devices and method for manufacturing the board 有权
标题翻译：用于半导体器件的多层印刷线路板及其制造方法
公开(公告)号：US08085546B2
公开(公告)日：2011-12-27
申请号：US12901104
申请日：2010-10-08
申请人： Ayao Niki
发明人： Ayao Niki
IPC分类号： H05K7/00
CPC分类号： H05K1/115 , H05K3/421 , H05K3/4644 , H05K2201/0352 , H05K2201/0394 , H05K2201/09527 , H05K2201/09563 , H05K2201/096 , H05K2203/0554 , Y10T29/49124 , Y10T29/49155 , Y10T29/49162
摘要： A coreless multilayer printed wiring board including a coreless layer having an opening, a conductive film formed on an upper surface of the coreless layer and closing one end of the opening of the coreless layer, a via-hole formed in the opening of the coreless layer, a first resin layer formed on the coreless layer and the conductive film and having an opening reaching to the conductive film, a via-hole formed in the opening of the first resin layer, a second resin layer formed on the upper surface of the first resin layer and having an opening, a via-hole formed in the opening of the second resin layer. The via-holes formed in the first and second resin layers are open in the direction opposite to the direction in which the via-hole formed in the coreless layer is open.
摘要翻译：一种无芯多层印刷线路板，包括具有开口的无芯层，形成在无芯层的上表面上并封闭无芯层的开口的一端的导电膜，形成在无芯层的开口中的通孔形成在无芯层和导电膜上并具有到达导电膜的开口的第一树脂层，形成在第一树脂层的开口中的通孔，形成在第一树脂层的上表面上的第二树脂层树脂层并具有开口，形成在第二树脂层的开口中的通孔。形成在第一和第二树脂层中的通孔在与形成在无芯层中的通孔开放的方向相反的方向上是开放的。

6. 发明授权

US08027169B2 Multilayer printed wiring board for semiconductor devices and method for manufacturing the board 有权
标题翻译：用于半导体器件的多层印刷线路板及其制造方法
公开(公告)号：US08027169B2
公开(公告)日：2011-09-27
申请号：US11555881
申请日：2006-11-02
申请人： Ayao Niki
发明人： Ayao Niki
IPC分类号： H05K7/00
CPC分类号： H05K1/115 , H05K3/421 , H05K3/4644 , H05K2201/0352 , H05K2201/0394 , H05K2201/09527 , H05K2201/09563 , H05K2201/096 , H05K2203/0554 , Y10T29/49124 , Y10T29/49155 , Y10T29/49162
摘要： A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes.
摘要翻译：多层印刷线路板包括一个或多个具有通孔的树脂层和具有通孔的芯层。在一个或多个树脂层中形成的通孔在与芯层中形成的通路孔打开的方向相反的方向上开口。一种制造多层印刷线路板的方法包括制备单面或双面覆铜层压板的步骤; 通过加工覆铜层压板来形成焊盘的步骤; 在覆铜层压板的上表面上形成树脂层的步骤，在树脂层中形成通孔的开口，然后形成通孔; 以及在覆铜层压板的下表面中形成用于通孔的开口，然后形成通孔的步骤。

7. 发明申请

US20110085306A1 MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD 有权
标题翻译：用于半导体器件的多层印刷接线板及其制造方法
公开(公告)号：US20110085306A1
公开(公告)日：2011-04-14
申请号：US12901104
申请日：2010-10-08
申请人： Ayao NIKI
发明人： Ayao NIKI
IPC分类号： H05K1/02
CPC分类号： H05K1/115 , H05K3/421 , H05K3/4644 , H05K2201/0352 , H05K2201/0394 , H05K2201/09527 , H05K2201/09563 , H05K2201/096 , H05K2203/0554 , Y10T29/49124 , Y10T29/49155 , Y10T29/49162
摘要： A coreless multilayer printed wiring board including a coreless layer having an opening, a conductive film formed on an upper surface of the coreless layer and closing one end of the opening of the coreless layer, a via-hole formed in the opening of the coreless layer, a first resin layer formed on the coreless layer and the conductive film and having an opening reaching to the conductive film, a via-hole formed in the opening of the first resin layer, a second resin layer formed on the upper surface of the first resin layer and having an opening, a via-hole formed in the opening of the second resin layer. The via-holes formed in the first and second resin layers are open in the direction opposite to the direction in which the via-hole formed in the coreless layer is open.
摘要翻译：一种无芯多层印刷线路板，包括具有开口的无芯层，形成在无芯层的上表面上并封闭无芯层的开口的一端的导电膜，形成在无芯层的开口中的通孔形成在无芯层和导电膜上并具有到达导电膜的开口的第一树脂层，形成在第一树脂层的开口中的通孔，形成在第一树脂层的上表面上的第二树脂层树脂层并具有开口，形成在第二树脂层的开口中的通孔。形成在第一和第二树脂层中的通孔在与形成在无芯层中的通孔开放的方向相反的方向上是开放的。

8. 发明申请

US20100116529A1 PRINTED WIRING BOARD HAVING A STIFFENER 有权
标题翻译：印刷布线板
公开(公告)号：US20100116529A1
公开(公告)日：2010-05-13
申请号：US12505032
申请日：2009-07-17
申请人： Ayao Niki
发明人： Ayao Niki
IPC分类号： H05K1/09 , H05K1/03 , B23K31/00 , B23K20/10 , B23K31/10
CPC分类号： B23K1/0016 , B23K3/0623 , B23K20/103 , B23K26/389 , B23K2101/40 , B23K2101/42 , B23K2103/42 , B23K2103/50 , H01L21/4857 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L24/81 , H01L2221/68345 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/81801 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K1/0271 , H05K3/025 , H05K3/4682 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009 , Y10T29/49149 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To provide a novel multilayer printed wiring board in which a conductor on the outermost resin layer is positioned properly. Furthermore, to provide a novel multilayer printed wiring board in which productivity is enhanced when forming solder bumps on the pads for mounting a semiconductor element. In multilayer printed wiring board, multiple pads for connection with a semiconductor chip are formed on one surface, and on its opposite surface, external connection terminals for connection with another substrate are formed. The pads for connection with a semiconductor chip are formed in the central region of one surface, stiffener is formed in the peripheral region surrounding the pads for connection with a semiconductor chip, pads for connection with a semiconductor chip and stiffener are formed with the same material and are set to be the same height, and the actual area of the stiffener is determined according to the total area of the multiple pads for connection with a semiconductor chip.
摘要翻译：提供一种新颖的多层印刷线路板，其中最外层树脂层上的导体正确定位。此外，提供一种新颖的多层印刷线路板，其中在用于安装半导体元件的焊盘上形成焊料凸块时，其生产率得到提高。在多层印刷布线板中，在一个表面上形成用于与半导体芯片连接的多个焊盘，并且在其相对表面上形成用于与另一基板连接的外部连接端子。用于与半导体芯片连接的焊盘形成在一个表面的中心区域中，在围绕焊盘的周边区域中形成加强件以与半导体芯片连接，用于与半导体芯片和加强件连接的焊盘用相同的材料形成并且被设定为相同的高度，并且根据用于与半导体芯片连接的多个焊盘的总面积来确定加强件的实际面积。

9. 发明申请

US20090078451A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20090078451A1
公开(公告)日：2009-03-26
申请号：US12188795
申请日：2008-08-08
申请人： Ayao Niki , Kazuhisa Kitajima
发明人： Ayao Niki , Kazuhisa Kitajima
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K3/4682 , H05K1/113 , H05K3/0058 , H05K3/025 , H05K3/06 , H05K3/108 , H05K2201/096 , H05K2203/0152 , H05K2203/0156 , H05K2203/0228 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.
摘要翻译：印刷布线板包括具有导电电路的多个导电层，具有开口的多个树脂绝缘层，并且包括位于树脂绝缘层的最外层的最上层的树脂绝缘层，分别形成在开口中的多个通孔导体，并将导电导电层中的电路，以及由铜箔形成并定位成装载电子元件的多个元件负载焊盘。交替层叠树脂绝缘层和导电层，并且在最上层的树脂绝缘层上形成元件负荷垫。

10. 发明授权

US08237056B2 Printed wiring board having a stiffener 有权
标题翻译：具有加强件的印刷电路板
公开(公告)号：US08237056B2
公开(公告)日：2012-08-07
申请号：US12505032
申请日：2009-07-17
申请人： Ayao Niki
发明人： Ayao Niki
IPC分类号： H05K1/03
CPC分类号： B23K1/0016 , B23K3/0623 , B23K20/103 , B23K26/389 , B23K2101/40 , B23K2101/42 , B23K2103/42 , B23K2103/50 , H01L21/4857 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L24/81 , H01L2221/68345 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/81801 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K1/0271 , H05K3/025 , H05K3/4682 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009 , Y10T29/49149 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To provide a novel multilayer printed wiring board in which a conductor on the outermost resin layer is positioned properly. Furthermore, to provide a novel multilayer printed wiring board in which productivity is enhanced when forming solder bumps on the pads for mounting a semiconductor element. In multilayer printed wiring board, multiple pads for connection with a semiconductor chip are formed on one surface, and on its opposite surface, external connection terminals for connection with another substrate are formed. The pads for connection with a semiconductor chip are formed in the central region of one surface, stiffener is formed in the peripheral region surrounding the pads for connection with a semiconductor chip, pads for connection with a semiconductor chip and stiffener are formed with the same material and are set to be the same height, and the actual area of the stiffener is determined according to the total area of the multiple pads for connection with a semiconductor chip.
摘要翻译：提供一种新颖的多层印刷线路板，其中最外层树脂层上的导体正确定位。此外，提供一种新颖的多层印刷线路板，其中在用于安装半导体元件的焊盘上形成焊料凸块时，其生产率得到提高。在多层印刷布线板中，在一个表面上形成用于与半导体芯片连接的多个焊盘，并且在其相对表面上形成用于与另一基板连接的外部连接端子。用于与半导体芯片连接的焊盘形成在一个表面的中心区域中，在围绕焊盘的周边区域中形成加强件以与半导体芯片连接，用于与半导体芯片和加强件连接的焊盘用相同的材料形成并且被设定为相同的高度，并且根据用于与半导体芯片连接的多个焊盘的总面积来确定加强件的实际面积。

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