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1. 发明授权

US07770500B2 Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method 失效
标题翻译：基板分割系统，基板制造设备，基板划线方法和基板分割方法
公开(公告)号：US07770500B2
公开(公告)日：2010-08-10
申请号：US10598878
申请日：2005-03-14
申请人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
发明人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
IPC分类号： B26D3/08 , B26D5/04 , B26F3/00
CPC分类号： B28D1/047 , B27B5/063 , B28D5/024 , B65G49/064 , B65G49/065 , B65G49/067 , B65G2249/04 , C03B33/023 , C03B33/027 , C03B33/03 , C03B2225/02 , Y10T83/0333 , Y10T83/0356 , Y10T83/4617 , Y10T83/6606 , Y10T225/12 , Y10T225/321 , Y10T225/336 , Y10T225/357
摘要： A substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate is disclosed. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50.
摘要翻译：公开了一种基板切割系统，其需要小的占地面积以致紧凑，并且还能够有效地切割基板。一对基板切割装置设置在切割装置引导体30中，以便能够沿着与夹紧装置50的移动方向垂直的方向移动，该对基板切割装置从每个上表面切割母基板以及由夹持装置50夹紧的母基板的底面。

2. 发明申请

US20070281444A1 Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method 失效
标题翻译：基板分割系统，基板制造设备，基板划线方法和基板划分方法
公开(公告)号：US20070281444A1
公开(公告)日：2007-12-06
申请号：US10598878
申请日：2005-03-14
申请人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
发明人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
IPC分类号： H01L21/78 , B26F3/00
CPC分类号： B28D1/047 , B27B5/063 , B28D5/024 , B65G49/064 , B65G49/065 , B65G49/067 , B65G2249/04 , C03B33/023 , C03B33/027 , C03B33/03 , C03B2225/02 , Y10T83/0333 , Y10T83/0356 , Y10T83/4617 , Y10T83/6606 , Y10T225/12 , Y10T225/321 , Y10T225/336 , Y10T225/357
摘要： The objective of the present invention is to provide a substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate. Clamp devices 50 are attached to the substrate cutting system. The clamp devices can hold at least one part of a side edge of the mother substrate to be carried-in a mounting base 10 in a hollow rectangular parallelepiped and reciprocate along one side of the mounting base 10 in a hollow rectangular parallelepiped. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50. When the clamp devices 50 holding the mother substrate are moved, a substrate supporting device supports the mother substrate without rubbing against the mother substrate.
摘要翻译：本发明的目的是提供一种基板切割系统，其需要小的占地面积以致紧凑，并且还能够有效地切割基板。夹持装置50附接到基板切割系统。夹持装置可以将母体基板的侧边缘的至少一部分保持在安装基座10中，该中心长方体平行六面体并沿着安装基座10的一侧在中空的长方体内往复运动。一对基板切割装置设置在切割装置引导体30中，以便能够沿着与夹紧装置50的移动方向垂直的方向移动，该对基板切割装置从每个上表面切割母基板以及由夹持装置50夹紧的母基板的底面。当保持母基板的夹持装置50移动时，基板支撑装置不会摩擦母体基板而支撑母基板。

3. 发明申请

US20060137504A1 Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method 有权
标题翻译：基板切割系统，基板制造装置，基板划线方法和基板切割方法
公开(公告)号：US20060137504A1
公开(公告)日：2006-06-29
申请号：US10535871
申请日：2003-09-24
申请人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Onari , Kazuhiro Yoshimoto
发明人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Onari , Kazuhiro Yoshimoto
IPC分类号： B28D5/00 , C03B33/03 , C03B33/023
CPC分类号： B65G49/064 , B28D1/226 , B28D5/0082 , B65G49/061 , B65G49/067 , B65G2249/04 , C03B33/023 , C03B33/027 , C03B33/03 , C03B33/09 , Y10T83/0304 , Y10T83/0341 , Y10T83/0378 , Y10T83/4617 , Y10T83/6606 , Y10T225/321
摘要： A clamping device (50) is installed on a stand (10) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand (10) is clamped. A pair of substrate-cutting devices for cutting the mother substrate, clamped by the clamping device (50), from its upper face and lower face is provided on a scribing device guide body (30). The scribing device guide body (30) is reciprocally movable along one side of the hollow rectangular parallelepiped. The pair of substrate-cutting devices is installed so as to be movable along the direction perpendicular to the movement direction of the scribing device guide body (30). The mother substrate clamped by the clamping device is supported by a substrate-supporting device (20).
摘要翻译：夹持装置（50）安装在具有中空长方体形状的支架（10）上，使得在支架（10）中运送的母板的侧边缘部分的至少一个位置被夹紧。在划线装置引导体（30）上设置有用于切割母基板的一对基板切割装置，其由夹紧装置（50）从其上表面和下表面夹紧。划线装置引导体30可沿中空长方体的一侧往复运动。一对基板切断装置安装成能够沿着与划线装置引导体（30）的移动方向垂直的方向移动。由夹持装置夹持的母体衬底由衬底支撑装置（20）支撑。

4. 发明申请

US20070214925A1 SUBSTRATE DICING SYSTEM, SUBSTRATE MANUFACTURING APPARATUS, AND SUBSTRATE DICING METHOD 审中-公开
标题翻译：基板定位系统，基板制造装置和基板定位方法
公开(公告)号：US20070214925A1
公开(公告)日：2007-09-20
申请号：US10595201
申请日：2004-09-24
申请人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Onari , Kazuhiro Yoshimoto
发明人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Onari , Kazuhiro Yoshimoto
IPC分类号： B26D7/06 , B26D5/08 , B26D9/00
CPC分类号： C03B33/027 , B28D1/226 , B28D5/0011 , B28D5/0094 , B28D7/046 , B65G49/061 , B65G49/065 , B65G49/067 , B65G49/068 , B65G2249/04 , B65G2249/045 , C03B33/03 , C03B33/033 , C03B2225/02 , Y10T83/647 , Y10T83/6667 , Y10T83/819 , Y10T83/8742
摘要： The objective of the present invention is to make an entire system compact and provide a substrate cutting system capable of efficiently cutting a variety of substrates. A substrate cutting system according to the present invention includes: pair of scribing line forming means arranged facing each other; pair of scribing devices for supporting the pair of scribing forming line means such that one of the pair of scribing forming line means moves on a first surface of a substrate in an X axial direction and the other of the pair of scribing forming means moves on a second surface of the substrate in the X axial direction; a scribing device guide body for supporting the pair of scribing devices such that the pair of scribing devices moves in a Y axial direction; and a substrate supporting means for supporting the substrate in an X-Y plane such that the pair of scribing forming line means scribes the first surface of the substrate and the second surface of the substrate.
摘要翻译：本发明的目的是使整个系统紧凑并且提供能够有效地切割各种基板的基板切割系统。根据本发明的基板切割系统包括：相对布置的一对划线生成装置; 一对划线装置，用于支撑一对划线成形线装置，使得一对划线形成线装置中的一个在X轴方向上在基板的第一表面上移动，并且一对划线形成装置中的另一个在一个 X轴方向上的基板的第二表面; 划线装置引导体，用于支撑所述一对划线装置，使得所述一对划线装置沿Y轴方向移动; 以及用于将基板支撑在X-Y平面中的基板支撑装置，使得一对划线形成线装置划刻基板的第一表面和基板的第二表面。

5. 发明授权

US07426883B2 Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method 有权
标题翻译：基板切割系统，基板制造装置，基板划线方法和基板切割方法
公开(公告)号：US07426883B2
公开(公告)日：2008-09-23
申请号：US10535871
申请日：2003-09-24
申请人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Onari , Kazuhiro Yoshimoto
发明人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Onari , Kazuhiro Yoshimoto
IPC分类号： B28D5/04 , B26D3/08
CPC分类号： B65G49/064 , B28D1/226 , B28D5/0082 , B65G49/061 , B65G49/067 , B65G2249/04 , C03B33/023 , C03B33/027 , C03B33/03 , C03B33/09 , Y10T83/0304 , Y10T83/0341 , Y10T83/0378 , Y10T83/4617 , Y10T83/6606 , Y10T225/321
摘要： A clamping device (50) is installed on a stand (10) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand (10) is clamped. A pair of substrate-cutting devices for cutting the mother substrate, clamped by the clamping device (50), from its upper face and lower face is provided on a scribing device guide body (30). The scribing device guide body (30) is reciprocally movable along one side of the hollow rectangular parallelepiped. The pair of substrate-cutting devices is installed so as to be movable along the direction perpendicular to the movement direction of the scribing device guide body (30). The mother substrate clamped by the clamping device is supported by a substrate-supporting device (20).
摘要翻译：夹持装置（50）安装在具有中空长方体形状的支架（10）上，使得在支架（10）中运送的母板的侧边缘部分的至少一个位置被夹紧。在划线装置引导体（30）上设置有用于切割母基板的一对基板切割装置，其由夹紧装置（50）从其上表面和下表面夹紧。划线装置引导体30可沿中空长方体的一侧往复运动。一对基板切断装置安装成能够沿着与划线装置引导体（30）的移动方向垂直的方向移动。由夹持装置夹持的母体衬底由衬底支撑装置（20）支撑。

6. 发明申请

US20050229755A1 Pasted base board cutting system and base board cutting method 审中-公开
标题翻译：基板切割系统和基板切割方法
公开(公告)号：US20050229755A1
公开(公告)日：2005-10-20
申请号：US10519754
申请日：2003-07-02
申请人： Yasutomo Okajima , Yoshitaka Nishio
发明人： Yasutomo Okajima , Yoshitaka Nishio
IPC分类号： B28D5/00 , B65G49/06 , C03B33/02 , C03B33/027 , C03B33/03 , C03B33/033 , C03B33/07 , B26D1/00 , B26D3/00
CPC分类号： C03B33/0207 , B28D5/0011 , B65G49/061 , B65G49/067 , B65G2249/04 , C03B33/027 , C03B33/03 , C03B33/033 , C03B33/07 , Y10T83/04 , Y10T83/9372
摘要： A cutting apparatus 400 has a first cutting device 410 located so as to face a first substrate and a second cutting device 420 located so as to face the second substrate. A cutting unit 411 includes a cutter wheel 412 for forming scribing lines on the first substrate and a breaking roller 416 which let the scribing lines penetrate through the thickness direction of the first substrate. The second cutting device 430 also includes a cutter wheel 412 for forming scribing lines on the second substrate and a breaking roller 416 which let the scribing lines penetrate through the thickness direction of the second substrate. The first cutting device 410 includes a back up roller 414 which opposes the breaking roller 416 of the second cutting device 430 and is pressed onto a surface of the first substrate. The second cutting device 430 also has a similar back up roller.
摘要翻译：切割装置400具有第一切割装置410，第一切割装置410定位成面对第一基底和第二切割装置420，第二切割装置420定位成面对第二基底。切割单元411包括用于在第一基板上形成划线的切割轮412和允许划线穿过第一基板的厚度方向的断开辊416。第二切割装置430还包括用于在第二基板上形成划线的切割轮412和允许划线穿过第二基板的厚度方向的断开辊416。第一切割装置410包括与第二切割装置430的断裂辊416相对并被压在第一基板的表面上的支撑辊414。第二切割装置430也具有类似的备用辊。

7. 发明申请

US20090236384A1 METHOD FOR PROCESSING SUBSTRATE, APPARATUS FOR PROCESSING SUBSTRATE, METHOD FOR CONVEYING SUBSTRATE AND MECHANISM FOR CONVEYING SUBSTRATE 失效
标题翻译：用于处理基板的方法，用于处理基板的装置，用于输送基板的方法和用于输送基板的机构
公开(公告)号：US20090236384A1
公开(公告)日：2009-09-24
申请号：US12476336
申请日：2009-06-02
申请人： Yasutomo Okajima , Katsuyoshi Nakata
发明人： Yasutomo Okajima , Katsuyoshi Nakata
IPC分类号： B26F3/00 , H01L21/78 , B65G47/248
CPC分类号： B65G49/066 , B65G49/061 , B65G2249/04 , C03B33/027 , C03B33/03 , C03B33/033 , Y10T225/12 , Y10T225/30 , Y10T225/321 , Y10T225/325 , Y10T225/336
摘要： A method and an apparatus process a substrate to divide a mother substrate into unit substrates. The apparatus is provided with a scribing portion for drawing a scribe line on a mother substrate, a breaking portion for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate has a number of rotational supports and with a suction surface for sucking and holding each substrate from a main surface, rotational supports and have rotational axes, as well as suction members for respectively sucking and rotating a substrate which rotates substrates around rotational axes approximately simultaneously in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.
摘要翻译：一种方法和装置处理基板以将母基板划分成单元基板。该设备设置有用于在母基板上绘制划线的划线部分，用于沿着形成的划线将母基板断开的断开部分和用于输送母基板或单元基板的基板的部分至少在上述各部分之间，其中用于输送基板的部分具有多个旋转支撑件，并且具有用于从主表面吸取和保持每个基板的抽吸表面，旋转支撑并具有旋转轴线以及用于分别吸附的吸附构件以及旋转基板，使基板围绕旋转轴大致同时旋转，使得每个基板的至少两个主表面在上下方向上翻转。

8. 发明申请

US20080190981A1 Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate 审中-公开
标题翻译：基板处理方法，基板处理装置，输送基板方法及输送基板机构
公开(公告)号：US20080190981A1
公开(公告)日：2008-08-14
申请号：US10581557
申请日：2004-12-03
申请人： Yasutomo Okajima , Katsuyoshi Nakata
发明人： Yasutomo Okajima , Katsuyoshi Nakata
IPC分类号： B65H35/10 , B26D7/01 , B26D7/27 , B26F3/00
CPC分类号： B65G49/066 , B65G49/061 , B65G2249/04 , C03B33/027 , C03B33/03 , C03B33/033 , Y10T225/12 , Y10T225/30 , Y10T225/321 , Y10T225/325 , Y10T225/336
摘要： A method for processing a substrate and an apparatus for processing a substrate are provided, where a substrate can be prevented from being damaged during conveyance of the substrate, including turning over of the substrate, and the apparatus for processing a substrate having this mechanism for conveying a substrate is miniaturized, so that the area for installment can be reduced.[Means for Achieving Object] An apparatus for processing a substrate which divides a mother substrate into unit substrates is provided with a scribing portion 3 for drawing a scribe line on a mother substrate, a breaking portion 4 for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate 2 for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate 2 has a number of rotational supports 51 and 73 with a suction surface for sucking and holding each substrate from a main surface, rotational supports 51 and 73 have rotational axes 52 and 72, respectively, as well as means for respectively sucking and rotating a substrate which rotates substrates around rotational axes 52 and 72, approximately simultaneously in a state where the substrates are sucked and held in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.
摘要翻译：提供一种处理基板的方法和用于处理基板的设备，其中可以防止基板在输送基板期间被损坏，包括翻转基板，以及用于处理具有该输送机构的基板的设备基板小型化，从而可以减少安装区域。实现对象的手段将母基板分割成单位基板的基板的处理装置设置有用于在母基板上绘制划线的划刻部分3，用于沿着形成的划线部分断母基板的断开部分4 以及用于输送至少在上述各部分之间输送母基板或单元基板的基板2的部分，其中用于输送基板2的部分具有多个旋转支撑件51和73，其具有用于吸入的吸力表面并且从主表面保持每个基板，旋转支撑件51和73分别具有旋转轴线52和72，以及用于分别吸附和旋转基板的装置，所述基板围绕旋转轴线52和72近似旋转基板，基板被吸附并保持为使得每个基板的至少两个主表面向上翻转a 向下方向。

9. 发明授权

US07845529B2 Method for processing substrate, apparatus for processing substrate, method for conveying substrate and mechanism for conveying substrate 失效
标题翻译：基板的处理方法，基板的处理装置，输送基板的方法和输送基板的机构
公开(公告)号：US07845529B2
公开(公告)日：2010-12-07
申请号：US12476336
申请日：2009-06-02
申请人： Yasutomo Okajima , Katsuyoshi Nakata
发明人： Yasutomo Okajima , Katsuyoshi Nakata
IPC分类号： B26F3/00
CPC分类号： B65G49/066 , B65G49/061 , B65G2249/04 , C03B33/027 , C03B33/03 , C03B33/033 , Y10T225/12 , Y10T225/30 , Y10T225/321 , Y10T225/325 , Y10T225/336
摘要： A method and an apparatus process a substrate to divide a mother substrate into unit substrates. The apparatus is provided with a scribing portion for drawing a scribe line on a mother substrate, a breaking portion for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate has a number of rotational supports and with a suction surface for sucking and holding each substrate from a main surface, rotational supports and have rotational axes, as well as suction members for respectively sucking and rotating a substrate which rotates substrates around rotational axes approximately simultaneously in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.
摘要翻译：一种方法和装置处理基板以将母基板划分成单元基板。该设备设置有用于在母基板上绘制划线的划线部分，用于沿着形成的划线将母基板断开的断开部分和用于输送母基板或单元基板的基板的部分至少在上述各部分之间，其中用于输送基板的部分具有多个旋转支撑件，并且具有用于从主表面吸取和保持每个基板的抽吸表面，旋转支撑并具有旋转轴线以及用于分别吸附的吸附构件以及旋转基板，使基板围绕旋转轴大致同时旋转，使得每个基板的至少两个主表面在上下方向上翻转。

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