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1. 发明授权

US08345303B2 Image processing apparatus 有权
标题翻译：图像处理装置
公开(公告)号：US08345303B2
公开(公告)日：2013-01-01
申请号：US12618334
申请日：2009-11-13
申请人： Kazuhiro Yoshimoto
发明人： Kazuhiro Yoshimoto
IPC分类号： G06K15/00 , G06F3/12
CPC分类号： H04N1/0035 , H04N1/00453 , H04N1/00461 , H04N1/2158 , H04N2201/0094
摘要： An image processing apparatus has a function of printing pieces of image data to be printed arranging them on one printing paper sheet. In a preview display screen of the image processing apparatus, when a specific piece of image data is selected by a user's operation from a plural piece of image data, the specific piece of image data is displayed being distinguished. Pieces of image data in the same shooting orientation as that of the specific piece of image data are searched for and their display is similarly varied. At this time, when rotation of the images is selected using a dialogue, the orientation of the pieces of image data is rotated at once by 180°. Thereby, the orientations of pieces of image data shot in a portrait-like posture may easily be adjusted to be the same and their images may be printed according to the preview display.
摘要翻译：图像处理装置具有将要印刷的图像数据打印在一个打印纸上的功能。在图像处理装置的预览显示画面中，当通过用户的操作从多张图像数据中选择特定图像数据时，区分特定的图像数据片段。搜索与特定图像数据的拍摄方向相同的图像数据的片段，并且它们的显示类似地变化。此时，当使用对话来选择图像的旋转时，图像数据的方向一度旋转180°。由此，以纵向状态拍摄的图像数据的方向可以容易地被调整为相同，并且可以根据预览显示打印它们的图像。

2. 发明申请

US20110011919A1 BONDING APPARATUS AND BONDING METHOD 审中-公开
标题翻译：粘接装置和粘接方法
公开(公告)号：US20110011919A1
公开(公告)日：2011-01-20
申请号：US12888972
申请日：2010-09-23
申请人： Kazuhiro Yoshimoto , Yuzo Shimobeppu , Kazuo Teshirogi , Yoshiaki Shinjo
发明人： Kazuhiro Yoshimoto , Yuzo Shimobeppu , Kazuo Teshirogi , Yoshiaki Shinjo
IPC分类号： B23K20/00 , B23K31/12
CPC分类号： H05K13/08 , H01L21/67144 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/7592 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H05K13/046 , H05K13/082
摘要： To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.
摘要翻译：为了提供能够通过实现对电子部件在电子部件安装在基板上施加的按压力进行高精度控制而提高产品质量的接合装置，并且能够稳定地提供高品质的产品的接合方法。接合装置包括：至少一个用于将电子部件6压靠在基板1上以将其接合到基板1的接合头100; 多个负载检测机构（例如，负载传感器5），其基本上等间隔地在支撑设置有电子部件6的基板1的基板台S下面对; 以及压力检测单元20，用于根据由各个负载检测机构5检测的压力值来检测电子部件6与基板1之间的接合面的按压力。

3. 发明授权

US07770500B2 Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method 失效
标题翻译：基板分割系统，基板制造设备，基板划线方法和基板分割方法
公开(公告)号：US07770500B2
公开(公告)日：2010-08-10
申请号：US10598878
申请日：2005-03-14
申请人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
发明人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
IPC分类号： B26D3/08 , B26D5/04 , B26F3/00
CPC分类号： B28D1/047 , B27B5/063 , B28D5/024 , B65G49/064 , B65G49/065 , B65G49/067 , B65G2249/04 , C03B33/023 , C03B33/027 , C03B33/03 , C03B2225/02 , Y10T83/0333 , Y10T83/0356 , Y10T83/4617 , Y10T83/6606 , Y10T225/12 , Y10T225/321 , Y10T225/336 , Y10T225/357
摘要： A substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate is disclosed. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50.
摘要翻译：公开了一种基板切割系统，其需要小的占地面积以致紧凑，并且还能够有效地切割基板。一对基板切割装置设置在切割装置引导体30中，以便能够沿着与夹紧装置50的移动方向垂直的方向移动，该对基板切割装置从每个上表面切割母基板以及由夹持装置50夹紧的母基板的底面。

4. 发明授权

US07571538B2 Vacuum fixing jig for semiconductor device 有权
标题翻译：半导体装置用真空固定夹具
公开(公告)号：US07571538B2
公开(公告)日：2009-08-11
申请号：US11075712
申请日：2005-03-10
申请人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
发明人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
IPC分类号： B23P19/00 , H01L21/10
CPC分类号： H01L21/67092 , B24B37/042 , B32B37/003 , B32B37/1018 , B32B38/0012 , B32B2310/0831 , B32B2457/14 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , Y10T29/5313 , Y10T29/53191 , Y10T428/1452 , H01L2924/3512 , H01L2924/00
摘要： The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.
摘要翻译：本发明涉及包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片接合步骤的半导体衬底的夹具和方法; 以及用于这种方法的半导体衬底夹具。本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。随着橡胶膜22的体积增加，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1。使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

5. 发明申请

US20070281444A1 Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method 失效
标题翻译：基板分割系统，基板制造设备，基板划线方法和基板划分方法
公开(公告)号：US20070281444A1
公开(公告)日：2007-12-06
申请号：US10598878
申请日：2005-03-14
申请人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
发明人： Yoshitaka Nishio , Yasutomo Okajima , Yukio Oshima , Hiroyuki Ohnari , Kazuhiro Yoshimoto
IPC分类号： H01L21/78 , B26F3/00
CPC分类号： B28D1/047 , B27B5/063 , B28D5/024 , B65G49/064 , B65G49/065 , B65G49/067 , B65G2249/04 , C03B33/023 , C03B33/027 , C03B33/03 , C03B2225/02 , Y10T83/0333 , Y10T83/0356 , Y10T83/4617 , Y10T83/6606 , Y10T225/12 , Y10T225/321 , Y10T225/336 , Y10T225/357
摘要： The objective of the present invention is to provide a substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate. Clamp devices 50 are attached to the substrate cutting system. The clamp devices can hold at least one part of a side edge of the mother substrate to be carried-in a mounting base 10 in a hollow rectangular parallelepiped and reciprocate along one side of the mounting base 10 in a hollow rectangular parallelepiped. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50. When the clamp devices 50 holding the mother substrate are moved, a substrate supporting device supports the mother substrate without rubbing against the mother substrate.
摘要翻译：本发明的目的是提供一种基板切割系统，其需要小的占地面积以致紧凑，并且还能够有效地切割基板。夹持装置50附接到基板切割系统。夹持装置可以将母体基板的侧边缘的至少一部分保持在安装基座10中，该中心长方体平行六面体并沿着安装基座10的一侧在中空的长方体内往复运动。一对基板切割装置设置在切割装置引导体30中，以便能够沿着与夹紧装置50的移动方向垂直的方向移动，该对基板切割装置从每个上表面切割母基板以及由夹持装置50夹紧的母基板的底面。当保持母基板的夹持装置50移动时，基板支撑装置不会摩擦母体基板而支撑母基板。

6. 发明申请

US20050221588A1 Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig 有权
标题翻译：半导体装置的制造方法以及使用基板夹具固定半导体装置的方法
公开(公告)号：US20050221588A1
公开(公告)日：2005-10-06
申请号：US11075721
申请日：2005-03-10
申请人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
发明人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
IPC分类号： H01L21/68 , H01L21/00 , H01L21/301 , H01L21/304 , H01L21/52 , H01L21/58 , H01L21/60 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67092 , B24B37/042 , B32B37/003 , B32B37/1018 , B32B38/0012 , B32B2310/0831 , B32B2457/14 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , Y10T29/5313 , Y10T29/53191 , Y10T428/1452 , H01L2924/3512 , H01L2924/00
摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.
摘要翻译：本发明涉及一种制造半导体衬底的方法，该半导体衬底包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片键合步骤; 以及用于这种方法的半导体衬底夹具。本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。当橡胶膜22的体积增加时，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1 。使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

7. 发明授权

US06824643B2 Method and device of peeling semiconductor device using annular contact members 有权
标题翻译：使用环形接触构件剥离半导体器件的方法和装置
公开(公告)号：US06824643B2
公开(公告)日：2004-11-30
申请号：US10086729
申请日：2002-03-04
申请人： Kazuhiro Yoshimoto , Kazuo Teshirogi , Eiji Yoshida
发明人： Kazuhiro Yoshimoto , Kazuo Teshirogi , Eiji Yoshida
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , H01L2221/68322 , Y10S156/943 , Y10S438/976 , Y10T29/49824 , Y10T156/1179 , Y10T156/19 , Y10T156/1983
摘要： In a semiconductor device manufacturing process, a semiconductor wafer is diced into a plurality of semiconductor chips, which are then peeled, from a dicing tape, using a peeling device. The peeling device includes a plurality of annular contact members arranged one after another from the outside to the inside, and the annular contact members are operated so that the semiconductor chip is successively peeled from the tape from the outer circumferential portion thereof toward the central portion thereof.
摘要翻译：在半导体器件制造工艺中，半导体晶片被切割成多个半导体芯片，然后使用剥离装置从切割带剥离。剥离装置包括从外部向内部依次布置的多个环状接触构件，并且环状接触构件被操作，使得半导体芯片从其外周部分向其中心部分连续地从带剥离。

8. 发明申请

US20090239355A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20090239355A1
公开(公告)日：2009-09-24
申请号：US12273009
申请日：2008-11-18
申请人： Hironori FUKAYA , Yuzo SHIMOBEPPU , Kazuhiro YOSHIMOTO , Yoshiaki SHINJO , Kazuo TESHIROGI , Mika SAKAMOTO
发明人： Hironori FUKAYA , Yuzo SHIMOBEPPU , Kazuhiro YOSHIMOTO , Yoshiaki SHINJO , Kazuo TESHIROGI , Mika SAKAMOTO
IPC分类号： H01L21/302
CPC分类号： H01L21/78
摘要： A method of manufacturing a semiconductor device includes spraying fluid onto a surface of a treatment target substrate including a semiconductor substrate; forming a protection layer on the surface of the treatment target substrate after spraying the fluid; selectively removing the protection layer and a part of the treatment target substrate by an energy beam; and conducting removal processing on an area of the treatment target substrate from which the protection layer and the part of the treatment target substrate are selectively removed.
摘要翻译：一种制造半导体器件的方法包括：将流体喷射到包括半导体衬底的处理目标衬底的表面上; 在喷射流体之后在处理对象基板的表面上形成保护层; 通过能量束选择性地去除保护层和处理目标衬底的一部分; 对被处理对象基板的保护层和处理对象基板的一部分选择性地除去的区域进行去除处理。

9. 发明申请

US20090186451A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20090186451A1
公开(公告)日：2009-07-23
申请号：US12408062
申请日：2009-03-20
申请人： Kazuo TESHIROGI , Yuzo SHIMOBEPPU , Kazuhiro YOSHIMOTO , Yoshiaki SHINJO
发明人： Kazuo TESHIROGI , Yuzo SHIMOBEPPU , Kazuhiro YOSHIMOTO , Yoshiaki SHINJO
IPC分类号： H01L21/60
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/563 , H01L21/6836 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2221/68313 , H01L2221/68318 , H01L2221/68322 , H01L2221/68327 , H01L2221/68354 , H01L2221/68386 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/75743 , H01L2224/81001 , H01L2224/81203 , H01L2224/81801 , H01L2224/83192 , H01L2224/97 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2224/81 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A manufacturing method of a semiconductor device includes providing an adhesive on a supporting board, the supporting board being where a semiconductor element is to be mounted; providing a member configured to block flow of the adhesive on a first main surface of the semiconductor element, the semiconductor element having a second main surface where an outside connection terminal is provided; mounting the semiconductor element on a part of the supporting board where the adhesive is provided by pressing the semiconductor element via the member.
摘要翻译：半导体器件的制造方法包括在支撑板上设置粘合剂，所述支撑板是要安装半导体元件的位置; 提供构造成阻挡所述粘合剂在所述半导体元件的第一主表面上的流动的构件，所述半导体元件具有设置有外部连接端子的第二主表面; 通过经由构件挤压半导体元件，将半导体元件安装在支撑板的设置有粘合剂的部分上。

10. 发明授权

US07432114B2 Semiconductor device manufacturing method 有权
标题翻译：半导体器件制造方法
公开(公告)号：US07432114B2
公开(公告)日：2008-10-07
申请号：US11515994
申请日：2006-09-06
申请人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Yoshiaki Shinjo , Masataka Mizukoshi
发明人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Yoshiaki Shinjo , Masataka Mizukoshi
IPC分类号： H01L21/00
CPC分类号： H01L21/561 , H01L21/563 , H01L21/6835 , H01L23/3128 , H01L23/49816 , H01L23/544 , H01L24/11 , H01L24/12 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/90 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L2221/68322 , H01L2221/68336 , H01L2221/68354 , H01L2223/54426 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05572 , H01L2224/05578 , H01L2224/05644 , H01L2224/05655 , H01L2224/10165 , H01L2224/1147 , H01L2224/13028 , H01L2224/13099 , H01L2224/1329 , H01L2224/133 , H01L2224/16145 , H01L2224/16225 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/75 , H01L2224/75252 , H01L2224/75743 , H01L2224/8113 , H01L2224/81132 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/83856 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： To provide a low-cost, efficient semiconductor device manufacturing method for connecting electrodes of a pair of bases (e.g., a pair of a semiconductor chip and a circuit board, or a pair of semiconductor chips) together in a short time. The method of the present invention includes: forming magnetic bumps 34 on at least one of first and second bases 10A and 40 to be bonded together at their corresponding electrodes (e.g., electrodes 15 and electrodes 41); aligning the electrodes 15 of the first base 10A to positions corresponding to the electrodes 41 of the second base 40 for connection, by means of magnetic forces of the magnetic bumps 34 formed over the first base 10A; and connecting the electrodes 15 of the first base 10A to the electrodes 41 of the second base 40, wherein the alignment is made for a plurality of the first bases 10A at a time.
摘要翻译：为了提供一种用于在短时间内将一对基极（例如，一对半导体芯片和电路板或一对半导体芯片）的电极连接在一起的低成本，高效的半导体器件制造方法。本发明的方法包括：在第一和第二基底10A和40中的至少一个上形成磁性凸块34，以在其相应的电极（例如电极15和电极41）处接合在一起; 通过形成在第一基座10A上的磁性凸块34的磁力将第一基座10A的电极15对准到与第二基座40的电极41相对应的连接位置; 并且将第一基座10A的电极15连接到第二基座40的电极41，其中一次对多个第一基座10A进行对准。

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