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1. 发明授权

US08617688B2 Conductive paste and multilayer printed wiring board using the same 失效
公开(公告)号：US08617688B2
公开(公告)日：2013-12-31
申请号：US11663450
申请日：2006-05-18
申请人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
发明人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
IPC分类号： B32B3/24 , H05K3/40 , H01B1/24
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0245 , H05K2201/0394 , Y10T428/24322 , Y10T428/24339
摘要： The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 μm or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.

2. 发明申请

US20090220738A1 Conductive paste and multilayer printed wiring board using the same 失效
标题翻译：导电膏和使用其的多层印刷线路板
公开(公告)号：US20090220738A1
公开(公告)日：2009-09-03
申请号：US11663450
申请日：2006-05-18
申请人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
发明人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
IPC分类号： H05K3/00 , H01B1/22
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0245 , H05K2201/0394 , Y10T428/24322 , Y10T428/24339
摘要： The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 μm or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.
摘要翻译：本发明提供一种包含99％累积粒径为25μm以下的片状导电性填料和作为必需成分的粘合剂树脂的导电性糊剂。片状导电填料是具有银 - 铜合金表面层的金属颗粒。根据本发明的导电膏在通过加热和加压的连接期间与要连接的导电浆的铜箔电路的一部分熔合，并且在通孔中具有高导电性和高填充率。因此，根据本发明的导电膏提供了具有高连接可靠性和优异的层间连接的多层印刷线路板。

3. 发明申请

US20080099121A1 Conductive Paste and Method for Manufacturing Multilayer Printed Wiring Board Using the Same 有权
标题翻译：导电糊和使用该多层印刷线路板的制造方法
公开(公告)号：US20080099121A1
公开(公告)日：2008-05-01
申请号：US11664393
申请日：2005-09-26
申请人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
发明人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
IPC分类号： H01B1/00 , H01B13/00 , H05K3/22
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0245 , H05K2201/0394
摘要： There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste.A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.
摘要翻译：提供一种通过将导电性粒子混入环氧树脂中并且具有良好的填充能力进入通孔而获得的导电膏，其可以形成连接部分，其中连接电阻即使在高温和高湿度条件下也不随时间变化。此外，提供了一种使用导电浆料制造多层印刷线路板的方法。含有导电性粒子和树脂混合物的导电性糊剂，其中分子量为10,000以上的环氧树脂的含量为总树脂成分的30〜90重量％，固化后85℃的弹性模量为 2GPa以下，导电性粒子的含量为30〜75体积％。另外，使用该导电性糊料的多层印刷电路板的制造方法。

4. 发明授权

US08597459B2 Conductive paste and method for manufacturing multilayer printed wiring board using the same 有权
标题翻译：导电浆料和使用其制造多层印刷线路板的方法
公开(公告)号：US08597459B2
公开(公告)日：2013-12-03
申请号：US11664393
申请日：2005-09-26
申请人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
发明人： Yoshio Oka , Hitoshi Takii , Noriki Hayashi
IPC分类号： B29C65/00 , B32B37/00
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0245 , H05K2201/0394
摘要： There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste.A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.
摘要翻译：提供一种通过将导电性粒子混入环氧树脂中并且具有良好的填充能力进入通孔而获得的导电膏，其可以形成连接部分，其中连接电阻即使在高温和高湿度条件下也不随时间变化。此外，提供了一种使用导电浆料制造多层印刷线路板的方法。含有导电性粒子和树脂混合物的导电性糊剂，其中分子量为10,000以上的环氧树脂的含量为总树脂成分的30〜90重量％，固化后85℃的弹性模量为 2GPa以下，导电性粒子的含量为30〜75体积％。另外，使用该导电性糊料的多层印刷电路板的制造方法。

5. 发明申请

US20080063792A1 Board for printed wiring, printed wiring board, and method for manufacturing them 有权
标题翻译：印刷电路板，印刷线路板及其制造方法
公开(公告)号：US20080063792A1
公开(公告)日：2008-03-13
申请号：US11976490
申请日：2007-10-25
申请人： Noriki Hayashi , Yoshio Oka , Masahiko Kanda , Narito Yagi , Kenji Miyazaki , Kyouichirou Nakatsugi
发明人： Noriki Hayashi , Yoshio Oka , Masahiko Kanda , Narito Yagi , Kenji Miyazaki , Kyouichirou Nakatsugi
IPC分类号： H05K3/00
CPC分类号： H05K3/246 , H05K1/095 , H05K3/108 , H05K3/12 , H05K3/1216 , H05K3/16 , H05K3/381 , H05K3/388 , H05K2201/0347 , H05K2201/035 , H05K2203/072 , H05K2203/095 , Y10T29/49126
摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.
摘要翻译：一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理，和（4）通过溅射粗化然后形成金属膜涂层。印刷电路板及其制造方法的特征在于，使用含有平均粒径为4μm以下，最大粒径为15μm的金属粒子的导电糊进行印刷，制造导体布线或更少。另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面被蚀刻，在表面上形成镀覆层。

6. 发明授权

US08231766B2 Method for producing printed wiring board 有权
标题翻译：印刷电路板的制造方法
公开(公告)号：US08231766B2
公开(公告)日：2012-07-31
申请号：US11976490
申请日：2007-10-25
申请人： Noriki Hayashi , Yoshio Oka , Masahiko Kanda , Narito Yagi , Kenji Miyazaki , Kyouichirou Nakatsugi
发明人： Noriki Hayashi , Yoshio Oka , Masahiko Kanda , Narito Yagi , Kenji Miyazaki , Kyouichirou Nakatsugi
IPC分类号： C23C14/00 , B05D5/12
CPC分类号： H05K3/246 , H05K1/095 , H05K3/108 , H05K3/12 , H05K3/1216 , H05K3/16 , H05K3/381 , H05K3/388 , H05K2201/0347 , H05K2201/035 , H05K2203/072 , H05K2203/095 , Y10T29/49126
摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.
摘要翻译：一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理，和（4）通过溅射粗化然后形成金属膜涂层。印刷电路板及其制造方法的特征在于，通过使用含有平均粒径为4μm以下且最大粒径为15μm的金属粒子的导电糊进行印刷来制造导体布线或更少。另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面被蚀刻，在表面上形成镀覆层。

7. 发明申请

US20050236182A1 Board for printed wiring, printed wiring board, and method for manufacturing them 审中-公开
标题翻译：印刷电路板，印刷线路板及其制造方法
公开(公告)号：US20050236182A1
公开(公告)日：2005-10-27
申请号：US10517058
申请日：2003-06-02
申请人： Noriki Hayashi , Yoshio Oka , Masahiko Kanda , Narito Yagi , Kenji Miyazaki , Kyouichirou Nakatsugi
发明人： Noriki Hayashi , Yoshio Oka , Masahiko Kanda , Narito Yagi , Kenji Miyazaki , Kyouichirou Nakatsugi
IPC分类号： H05K1/09 , H05K3/10 , H05K3/12 , H05K3/16 , H05K3/24 , H05K3/38 , H05K1/16
CPC分类号： H05K3/246 , H05K1/095 , H05K3/108 , H05K3/12 , H05K3/1216 , H05K3/16 , H05K3/381 , H05K3/388 , H05K2201/0347 , H05K2201/035 , H05K2203/072 , H05K2203/095 , Y10T29/49126
摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.
摘要翻译：一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理，和（4）通过溅射粗化然后形成金属膜涂层。印刷电路板及其制造方法的特征在于，使用含有平均粒径为4μm以下，最大粒径为15μm的金属粒子的导电糊进行印刷，制造导体布线或更少。另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面被蚀刻，在表面上形成镀覆层。

8. 发明授权

US5372991A Oxide superconductive wire, method of manufacturing the same and the products using the same 失效
标题翻译：氧化物超导线，其制造方法和使用其的产品
公开(公告)号：US5372991A
公开(公告)日：1994-12-13
申请号：US196615
申请日：1994-02-15
申请人： Noriki Hayashi , Satoshi Takano , Shigeru Okuda , Hajime Hitotsuyanagi
发明人： Noriki Hayashi , Satoshi Takano , Shigeru Okuda , Hajime Hitotsuyanagi
IPC分类号： H01B12/06 , H01B13/00 , H01F6/06 , H01L39/24 , H01F7/22 , H01B12/02
CPC分类号： H01F6/06 , H01B12/06 , H01L39/248 , Y02E40/642 , Y10S505/70 , Y10S505/704 , Y10S505/705
摘要： An oxide superconductive wire is provided by, for example, forming an oxide superconductive layer on a tape-type flexible base. A preliminary compressive strain is applied to the oxide superconductive layer in the longitudinal direction. The remaining strain can be provided by using a base having thermal expansion coefficient larger than that of the oxide superconductive layer and by cooling the same after heat treatment, due to contraction of the base. Since the preliminary compressive strain is applied to the oxide superconductive layer, degradation of superconductivity of the oxide superconductive layer can be suppressed even if the oxide superconductive wire is bent in any direction, compared with the wire without such strain. Therefore, the oxide superconductive wire can be coiled, for example, without much degrading the superconductivity.
摘要翻译：氧化物超导线通过例如在带状柔性基底上形成氧化物超导层而提供。在纵向上对氧化物超导层施加预压缩应变。可以通过使用具有大于氧化物超导层的热膨胀系数的碱的基底，并且由于基底的收缩而在热处理后对其进行冷却来提供剩余的应变。由于将预压缩应变施加到氧化物超导层上，与没有这种应变的线相比，即使氧化物超导线在任何方向上弯曲，也可以抑制氧化物超导层的超导性的劣化。因此，氧化物超导线例如可以卷绕，而不会使超导性降低。

9. 发明授权

US5273954A Method for forming superconducting ceramics elongated body 失效
标题翻译：形成超导陶瓷细长体的方法
公开(公告)号：US5273954A
公开(公告)日：1993-12-28
申请号：US832565
申请日：1992-02-07
申请人： Satoshi Takano , Kenichi Takahashi , Kenji Miyazaki , Noriyuki Yoshida , Shinji Inazawa , Noriki Hayashi
发明人： Satoshi Takano , Kenichi Takahashi , Kenji Miyazaki , Noriyuki Yoshida , Shinji Inazawa , Noriki Hayashi
IPC分类号： B32B18/00 , C01G3/00 , C04B35/45 , C04B41/50 , C04B41/52 , C04B41/85 , C04B41/89 , H01L23/532 , H01L39/24 , B05D3/06 , B05D5/12
CPC分类号： H01L39/248 , C01G3/006 , C04B35/45 , C04B35/4504 , C04B35/4508 , C04B41/5074 , C04B41/52 , C04B41/85 , C04B41/89 , H01L23/53285 , H01L39/2425 , H01L39/2432 , H01L39/2451 , H01L39/2461 , C01P2002/34 , H01L2924/0002 , Y10S505/704 , Y10S505/73 , Y10S505/732
摘要： A method of manufacturing a superconducting ceramics elongated body by forming a longitudinally continuous superconducting layer on at least a part of the surface of a flexible ceramics elongated substrate by evaporation under the presence of oxygen ions.
摘要翻译：一种通过在氧离子的存在下通过蒸发在柔性陶瓷细长衬底的至少一部分表面上形成纵向连续超导层来制造超导陶瓷细长体的方法。

10. 发明授权

US5242898A Method of forming superconducting circuit 失效
标题翻译：形成超导电路的方法
公开(公告)号：US5242898A
公开(公告)日：1993-09-07
申请号：US886113
申请日：1992-05-19
申请人： Kenichi Takahashi , Noriyuki Yoshida , Jun Shioya , Yoichi Yamaguchi , Akira Mizoguchi , Noriki Hayashi , Satoshi Takano , Kenji Miyazaki
发明人： Kenichi Takahashi , Noriyuki Yoshida , Jun Shioya , Yoichi Yamaguchi , Akira Mizoguchi , Noriki Hayashi , Satoshi Takano , Kenji Miyazaki
IPC分类号： H01L39/24
CPC分类号： H01L39/249 , Y10S428/93 , Y10S505/701 , Y10S505/702 , Y10T428/24926
摘要： A method of forming a superconducting circuit comprises the steps of preparing a ceramics body which is changed from a non-superconductive phase not superconducting at the working temperature into a superconducting phase superconducting at the working temperature by heat treatment and performing the heat treatment on a part of the ceramics body by applying a laser beam to the ceramics body to change the same into the superconductive phase, thereby to form a superconducting circuit consisting of the superconductive phase and the non-superconductive phase on the ceramics body.
摘要翻译：一种形成超导电路的方法包括以下步骤：制备陶瓷体，其从工作温度下不超导的非超导相变为通过热处理在工作温度下超导超导相，并对部件进行热处理通过将激光束施加到陶瓷体以将其改变为超导相，从而形成由陶瓷体上的超导相和非超导相组成的超导电路。

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