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    • 1. 发明授权
    • Thickness measuring apparatus, substrate processing method, and substrate processing apparatus
    • 厚度测量装置,基板处理方法和基板处理装置
    • US06331890B1
    • 2001-12-18
    • US09474126
    • 1999-12-29
    • Yoshinori MarumoTeruyuki Hayashi
    • Yoshinori MarumoTeruyuki Hayashi
    • G01J400
    • G01B11/0683
    • A film thickness measuring apparatus is provided with a housing which is made up of a base plate and outer cases, and which substantially shuts off the internal region thereof from the outside air, an introduction stage on which a cassette C is mounted, the cassette containing a plurality of substrates which have thin films formed thereon, a measurement stage which is arranged inside the housing and on which the substrate is placed for measuring the film thickness of the thin film, and a conveyance mechanism, arranged inside the housing, for moving the substrates between the inside of the cassette and the measurement stage. A film thickness measuring mechanism is arranged inside the housing. The film thickness measuring mechanism comprises a light emitting mechanism and a detector. The light emitting mechanism includes a laser light source for emitting a laser beam to the thin film on a wafer placed on the measurement stage. The detector detects light reflected from the thin film. On the basis of the information detected by the detector, the film thickness measuring mechanism measures the thickness of the thin film in a non-contact manner. A filter unit is arranged in the housing and located above the measurement stage. Through this filter unit, pure air free of gaseous organic matter is supplied and guided to the region above the measurement stage.
    • 薄膜厚度测量装置设置有由基板和外壳组成的壳体,其基本上从外部空气中切断其内部区域,安装盒C的导入台,所述盒体包含 在其上形成有薄膜的多个基板,布置在壳体内部并且放置基板以测量薄膜的膜厚度的测量台,以及布置在壳体内部的用于移动 盒子内部和测量台之间的衬底。 膜厚测量机构设置在壳体内。 膜厚测量机构包括发光机构和检测器。 发光机构包括用于在放置在测量台上的晶片上向激光束发射激光的激光光源。 检测器检测从薄膜反射的光。 基于由检测器检测到的信息,膜厚测量机构以非接触的方式测量薄膜的厚度。 过滤器单元布置在壳体中并位于测量台的上方。 通过该过滤器单元,将不含气态有机物的纯空气供给并引导到测量台上方的区域。
    • 2. 发明授权
    • Substrate processing apparatus and particle adhesion preventing method
    • 基板处理装置和颗粒附着防止方法
    • US08950999B2
    • 2015-02-10
    • US12525314
    • 2008-01-31
    • Akitake TamuraTeruyuki Hayashi
    • Akitake TamuraTeruyuki Hayashi
    • H01L21/677H01L21/67
    • H01J37/34H01J37/32522H01J37/3476H01J2237/332H01J2237/334H01L21/67248H01L21/67766H01L21/67772H01L21/67778
    • Any particle adhesion onto the surface of a substrate to be processed is prevented. There is provided a substrate processing apparatus characterized by including a transfer chamber for, via a gate to which a substrate accommodating container for accommodation of the substrate is set, performing transfer of the substrate between the same and the substrate accommodating container, a processing chamber for applying a specific process to the substrate, a load-lock chamber for linking the processing chamber with the transfer chamber, and a temperature control unit for at the stage of transferring the substrate into at least one of the transfer chamber and the load-lock chamber, so as for the temperature of the substrate just before the transfer thereof to be higher than the temperature of the interior of the chamber, into which the substrate will be transferred, controlling at least one of the temperature of the substrate and the temperature of the interior of the chamber.
    • 防止任何颗粒附着在待处理基材的表面上。 提供了一种基板处理装置,其特征在于包括:传送室,用于经由设置用于容纳基板的基板容纳容器的栅极,在其之间进行基板与基板容纳容器的传送;处理室, 对基板施加特定的处理,用于将处理室与传送室连接的加载锁定室以及用于在将基板转移到传送室和装载锁定室中的至少一个的阶段的温度控制单元 ,因为刚好在其转移之前的衬底的温度高于将被转移到其中的衬底内部的温度,控制衬底的温度和温度的至少一个 室内
    • 3. 发明申请
    • DEPOSITION HEAD AND FILM FORMING APPARATUS
    • 沉积头和成膜装置
    • US20120031339A1
    • 2012-02-09
    • US13262335
    • 2010-04-02
    • Yuji OnoTomohiko EduraTeruyuki HayashiAkitake TamuraMisako Saito
    • Yuji OnoTomohiko EduraTeruyuki HayashiAkitake TamuraMisako Saito
    • C23C16/455
    • C23C14/12C23C14/24H01L51/001H01L51/50
    • There is provided a deposition head capable of discharging a material gas having a uniform flow rate and equi-thermal property from each component in a large-sized substrate as well as a conventional small-sized one for forming a uniform thin film. A deposition apparatus including the deposition head is also provided. The deposition head is provided within a deposition apparatus for forming a thin film on a substrate and configured to discharge a material gas toward the substrate. The deposition head includes an outer casing, and an inner casing provided within the outer casing and into which the material gas is introduced. In the inner casing, an opening configured to discharge the material gas toward the substrate is formed, and a heater configured to heat the material gas is provided at an outer surface of the outer casing or in a space between the outer casing and the inner casing.
    • 提供一种沉积头,其能够在大尺寸基板中排出具有均匀流速和等热特性的材料气体,以及用于形成均匀薄膜的常规小尺寸基板。 还提供了包括沉积头的沉积设备。 沉积头设置在用于在衬底上形成薄膜并用于将材料气体朝向衬底排出的沉积设备中。 沉积头包括外壳和设置在外壳内并且材料气体被引入的内壳。 在内壳体中,形成有将材料气体朝向基板排出的开口,在外壳的外表面或外壳与内壳之间的空间内设置加热材料气体的加热器 。
    • 5. 发明授权
    • Particle measuring method and particle measuring apparatus
    • 粒子测量方法和粒子测量仪器
    • US07508518B2
    • 2009-03-24
    • US12078172
    • 2008-03-27
    • Akitake TamuraKaoru FujiharaTeruyuki Hayashi
    • Akitake TamuraKaoru FujiharaTeruyuki Hayashi
    • G01N21/00G01N21/55
    • G01N15/06G01N1/42G01N2015/0693
    • The present invention relates to a particle measuring method for irradiating light to a surface of a substrate to scatter the light so as to measure a condition of particles on the substrate based on the scattered light. The particle measuring method according to the present invention comprises the steps of: heating a certain liquid to obtain a steam; supplying the steam onto a substrate so that a content of the steam is absorbed by each particle, while a temperature of the substrate is maintained in such a manner that the steam does not condense on the substrate; cooling the substrate before the particle dries so that the content absorbed by the particle is solidified, while preventing generation of solidified substance on regions of the surface of the substrate to which no particle adheres; and irradiating light to the substrate to scatter the light and detecting the scattered light, under a condition in which the content absorbed by the particle has been solidified.
    • 本发明涉及一种用于将光照射到基板的表面以散射光以便基于散射光测量基板上的颗粒的状态的颗粒测量方法。 根据本发明的颗粒测量方法包括以下步骤:加热某些液体以获得蒸汽; 将蒸汽供给到基板上,使得蒸汽的含量被每个颗粒吸收,同时保持基板的温度使得蒸汽不会在基板上冷凝; 在颗粒干燥之前冷却基板,使得由颗粒吸收的内容物固化,同时防止在没有颗粒粘附的基材表面的区域上产生固化物质; 并且在颗粒吸收的内容物固化的条件下,向基板照射光以散射光并检测散射光。
    • 6. 发明申请
    • Particle measuring method and particle measuring apparatus
    • 粒子测量方法和粒子测量仪器
    • US20080239283A1
    • 2008-10-02
    • US12078172
    • 2008-03-27
    • Akitake TamuraKaoru FujiharaTeruyuki Hayashi
    • Akitake TamuraKaoru FujiharaTeruyuki Hayashi
    • G01N1/00
    • G01N15/06G01N1/42G01N2015/0693
    • The present invention relates to a particle measuring method for irradiating light to a surface of a substrate to scatter the light so as to measure a condition of particles on the substrate based on the scattered light. The particle measuring method according to the present invention comprises the steps of: heating a certain liquid to obtain a steam; supplying the steam onto a substrate so that a content of the steam is absorbed by each particle, while a temperature of the substrate is maintained in such a manner that the steam does not condense on the substrate; cooling the substrate before the particle dries so that the content absorbed by the particle is solidified, while preventing generation of solidified substance on regions of the surface of the substrate to which no particle adheres; and irradiating light to the substrate to scatter the light and detecting the scattered light, under a condition in which the content absorbed by the particle has been solidified.
    • 本发明涉及一种用于将光照射到基板的表面以散射光以便基于散射光测量基板上的颗粒的状态的颗粒测量方法。 根据本发明的颗粒测量方法包括以下步骤:加热某些液体以获得蒸汽; 将蒸汽供给到基板上,使得蒸汽的含量被每个颗粒吸收,同时保持基板的温度使得蒸汽不会在基板上冷凝; 在颗粒干燥之前冷却基板,使得由颗粒吸收的内容物固化,同时防止在没有颗粒粘附的基材表面的区域上产生固化物质; 并且在颗粒吸收的内容物固化的条件下,向基板照射光以散射光并检测散射光。