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1. 发明授权

US5976260A Semiconductor producing apparatus, and wafer vacuum chucking device, gas cleaning method and nitride film forming method in semiconductor producing apparatus 失效
标题翻译：半导体制造装置，晶片真空夹紧装置，半导体制造装置中的气体净化方法和氮化物膜形成方法
公开(公告)号：US5976260A
公开(公告)日：1999-11-02
申请号：US612445
申请日：1996-03-07
申请人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
发明人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
IPC分类号： B23Q3/08 , B25B11/00 , C23C16/34 , C23C16/44 , C23C16/455 , C23C16/458 , C23C16/48 , H01L21/683 , C23C16/00
CPC分类号： C23C16/34 , B25B11/005 , C23C16/4405 , C23C16/455 , C23C16/4583 , C23C16/481 , H01L21/6838 , Y10T279/11
摘要： It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer (1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.
摘要翻译：本发明的目的是获得即使在其上附着有灰尘也能真空吸附晶片的真空吸盘。真空吸盘（101）的主体在其上吸引和固定晶片（1）的表面上具有多个块状凹槽（125），其中各真空抽空路径（105）用于真空抽吸每个块状凹槽（125））被设置用于每个块槽（125）。当晶片（1）在低压下被吸入和固定时，即使一个块状槽（125）中的一个真空度由于吸附表面的一部分上的灰尘等的附着而降低，晶片（1））肯定被吸住了。

2. 发明授权

US5534073A Semiconductor producing apparatus comprising wafer vacuum chucking device 失效
标题翻译：半导体制造装置，包括晶片真空吸附装置
公开(公告)号：US5534073A
公开(公告)日：1996-07-09
申请号：US116968
申请日：1993-09-07
申请人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
发明人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
IPC分类号： B23Q3/08 , B25B11/00 , C23C16/34 , C23C16/44 , C23C16/455 , C23C16/458 , C23C16/48 , H01L21/683 , C23C16/00 , B23B5/22 , B23B31/30
CPC分类号： C23C16/34 , B25B11/005 , C23C16/4405 , C23C16/455 , C23C16/4583 , C23C16/481 , H01L21/6838 , Y10T279/11
摘要： It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.
摘要翻译：本发明的目的是获得即使在其上附着有灰尘也能真空吸附晶片的真空吸盘。真空吸盘（101）的主体在其上吸引和固定晶片（1）的表面上具有多个块状凹槽（125），其中各真空抽空路径（105）用于真空抽吸每个块状凹槽（125））被设置用于每个块槽（125）。当晶片（1）在低压下被吸入和固定时，即使一个块状槽（125）中的一个真空度由于吸附表面的一部分上的灰尘等的附着而降低，晶片（1））肯定被吸住了。

3. 发明授权

US06768542B2 Defect inspecting device for substrate to be processed and method of manufacturing semiconductor device 失效
标题翻译：待处理基板缺陷检查装置及制造半导体装置的方法
公开(公告)号：US06768542B2
公开(公告)日：2004-07-27
申请号：US10219292
申请日：2002-08-16
申请人： Hirotoshi Ise , Toshiki Oono , Yasuhiro Kimura , Toshio Komemura , Masato Toyota , Toshihiko Noguchi
发明人： Hirotoshi Ise , Toshiki Oono , Yasuhiro Kimura , Toshio Komemura , Masato Toyota , Toshihiko Noguchi
IPC分类号： G01N2100
CPC分类号： G01N21/9501 , G01N21/9503
摘要： A defect inspecting device for a wafer is built in a positioning device for positioning a wafer 1, as a substrate to be processed, in a semiconductor manufacturing process. Light is irradiated on the wafer held on a vacuum holding base 2 while rotating the wafer at least one rotation from a position where the wafer is positioned and the scattered light is received. An operation unit 14 and a control unit 15 judge that if the intensity of the scattered light exceeds a predetermined threshold, a defect is detected on the wafer 1.
摘要翻译：用于晶片的缺陷检查装置内置在用于在半导体制造工艺中定位作为待处理基板的晶片1的定位装置中。在保持在真空保持基座2上的晶片上照射光从晶片定位位置和接收散射光的位置旋转至少一个旋转晶片。操作单元14和控制单元15判断如果散射光的强度超过预定阈值，则在晶片1上检测到缺陷。

4. 发明授权

US06648128B2 Conveyor, method for conveying a semiconductor wafer, and method for manufacturing a semiconductor device 失效
公开(公告)号：US06648128B2
公开(公告)日：2003-11-18
申请号：US10133740
申请日：2002-04-29
申请人： Toshihiro Yamashita , Toshio Komemura , Toshihiko Noguchi
发明人： Toshihiro Yamashita , Toshio Komemura , Toshihiko Noguchi
IPC分类号： B65G1724
CPC分类号： H01L21/67706
摘要： A conveyor is provided that is capable of preventing degradation in quality of an article being conveyed. The conveyor includes a conveyor belt; and a rolling element rotatably provided at a surface of the conveyor belt. A plurality of rolling elements are provided along a conveying direction. The conveyor further includes a holder provided at the surface of the conveyor belt, for rotatably holding the corresponding rolling element. The rolling element has a ball shape.

5. 发明授权

US5196034A Semiconductor wafer cleaning apparatus 失效
标题翻译： SEMICONDUCTOR WAFER CLEANING APPARATUS
公开(公告)号：US5196034A
公开(公告)日：1993-03-23
申请号：US737666
申请日：1991-07-30
申请人： Toshiki Ono , Shiro Yamasaki , Toshihiko Noguchi
发明人： Toshiki Ono , Shiro Yamasaki , Toshihiko Noguchi
IPC分类号： H01L21/304 , H01L21/00
CPC分类号： H01L21/67028 , Y10T29/41
摘要： A semiconductor wafer cleaning apparatus provided with an ice making unit and a jet nozzle for ejecting fine ice particles against a wafer held within a cleaning vessel includes an exhaust chamber having an expanded portion and connected to the cleaning vessel. Curved guide plates extend from cleaning vessel into the exhaust chamber equidistant from each other into the expanded portion to guide the jet particles into the expanded portion. A flow regulator plate having a multitude of inverted frustum-shaped tapered holes regulates the jetted particles within the cleaning bath in accordance with the downward flow direction. Further, the upward flow from the exhaust chamber along the side walls is caught by stopper plates and exhausted via exhaust ports.
摘要翻译：设置有制冰单元和喷射喷嘴的半导体晶片清洁设备包括具有扩展部分并连接到清洁容器的排气室，所述制冷单元和喷嘴用于将保存在清洁容器内的晶片喷射到精细冰颗粒。弯曲的引导板从清洁容器延伸到排放室中，彼此等距离地放入扩展部分中，以将射流颗粒引导到扩展部分中。具有多个反向截头锥形锥形孔的流量调节板根据向下流动方向调节清洗槽内的喷射颗粒。此外，从排气室沿着侧壁的向上流动被止动板卡住，并通过排气口排出。

6. 发明授权

US06929712B2 Plasma processing apparatus capable of evaluating process performance 失效
标题翻译：能够评估工艺性能的等离子体处理装置
公开(公告)号：US06929712B2
公开(公告)日：2005-08-16
申请号：US10235783
申请日：2002-09-06
申请人： Minoru Hanazaki , Keiichi Sugahara , Toshihiko Noguchi , Toshio Komemura , Masakazu Taki , Mutumi Tuda , Kenji Shintani
发明人： Minoru Hanazaki , Keiichi Sugahara , Toshihiko Noguchi , Toshio Komemura , Masakazu Taki , Mutumi Tuda , Kenji Shintani
IPC分类号： H05H1/00 , H01J37/32 , H01L21/3065 , H05H1/46 , H01L21/00 , C23C16/00
CPC分类号： H01J37/32082 , H01J37/32935
摘要： A high-frequency current detector of a plasma processing apparatus detects a high-frequency current produced when high-frequency power in the range that does not cause generation of plasma in a chamber is supplied from a high-frequency power supply source to the chamber. The high-frequency current detector outputs the detected high-frequency current to a computer. The computer compares the high-frequency current received from the high-frequency current detector with a reference high-frequency current. When the received high-frequency current matches the reference high-frequency current, the computer determines that the process performance is normal. Otherwise, the computer determines that the process performance is abnormal. In this way, high-frequency characteristics specific to the apparatus are detected and the process performance are evaluated based on the detected high-frequency characteristics.
摘要翻译：等离子体处理装置的高频电流检测器检测从高频电源向腔室供给不在室内产生等离子体的范围内的高频电力时产生的高频电流。高频电流检测器将检测到的高频电流输出到计算机。计算机将从高频电流检测器接收的高频电流与参考高频电流进行比较。当接收的高频电流与参考高频电流相匹配时，计算机确定处理性能正常。否则，计算机会确定进程性能异常。以这种方式，检测到对装置特有的高频特性，并且基于检测到的高频特性来评估处理性能。

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