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    • 1. 发明授权
    • Semiconductor wafer cleaning apparatus
    • SEMICONDUCTOR WAFER CLEANING APPARATUS
    • US5196034A
    • 1993-03-23
    • US737666
    • 1991-07-30
    • Toshiki OnoShiro YamasakiToshihiko Noguchi
    • Toshiki OnoShiro YamasakiToshihiko Noguchi
    • H01L21/304H01L21/00
    • H01L21/67028Y10T29/41
    • A semiconductor wafer cleaning apparatus provided with an ice making unit and a jet nozzle for ejecting fine ice particles against a wafer held within a cleaning vessel includes an exhaust chamber having an expanded portion and connected to the cleaning vessel. Curved guide plates extend from cleaning vessel into the exhaust chamber equidistant from each other into the expanded portion to guide the jet particles into the expanded portion. A flow regulator plate having a multitude of inverted frustum-shaped tapered holes regulates the jetted particles within the cleaning bath in accordance with the downward flow direction. Further, the upward flow from the exhaust chamber along the side walls is caught by stopper plates and exhausted via exhaust ports.
    • 设置有制冰单元和喷射喷嘴的半导体晶片清洁设备包括具有扩展部分并连接到清洁容器的排气室,所述制冷单元和喷嘴用于将保存在清洁容器内的晶片喷射到精细冰颗粒。 弯曲的引导板从清洁容器延伸到排放室中,彼此等距离地放入扩展部分中,以将射流颗粒引导到扩展部分中。 具有多个反向截头锥形锥形孔的流量调节板根据向下流动方向调节清洗槽内的喷射颗粒。 此外,从排气室沿着侧壁的向上流动被止动板卡住,并通过排气口排出。
    • 8. 发明授权
    • Group III nitride compound semiconductor laser
    • III族氮化物化合物半导体激光器
    • US06680957B1
    • 2004-01-20
    • US09515493
    • 2000-02-29
    • Masayoshi KoikeShiro YamasakiYuta TezenSeiji NagaiAkira KojimaToshio Hiramatsu
    • Masayoshi KoikeShiro YamasakiYuta TezenSeiji NagaiAkira KojimaToshio Hiramatsu
    • H01S500
    • B82Y20/00H01S5/22H01S5/34333
    • A semiconductor laser 101 comprises a sapphire substrate 1, an AlN buffer layer 2, Si-doped GaN n-layer 3, Si-doped Al0.1Ga0.9N n-cladding layer 4, Si-doped GaN n-guide layer 5, an active layer 6 having multiple quantum well (MQW) structure in which about 35 Å in thickness of GaN barrier layer 62 and about 35 Å in thickness of Ga0.95In0.05N well layer 61 are laminated alternately, Mg-doped GaN p-guide layer 7, Mg-doped Al0.1Ga0.9N p-cladding layer 8, and Mg-doped GaN p-contact layer 9 are formed successively thereon. A ridged hole injection part B which contacts to a ridged resonator part A is formed to have the same width as the width w of an Ni electrode 10. Holes transmitted from the Ni electrode 10 are injected to the active layer 6 with high current density, and electric current threshold for laser oscillation can be decreased. Electric current threshold can be improved more effectively by forming also the p-guide layer 7 to have the same width as the width w of the Ni electrode 10.
    • 半导体激光器101包括蓝宝石衬底1,AlN缓冲层2,掺杂Si的GaN n层3,掺杂Si的Al 0.1 Ga 0.9 N n包层4,掺杂Si的GaN n引导层5, 具有多个量子阱(MQW)结构的有源层6,其中厚度约为35的GaN阻挡层62和约35厚度的Ga0.95In0.05N阱层61交替层叠,掺杂Mg的GaN p引导层 如图7所示,依次形成Mg掺杂的Al 0.1 Ga 0.9 N p包覆层8和Mg掺杂的GaN p接触层9。 与脊状谐振器部件A接触的脊状空穴注入部分B形成为具有与Ni电极10的宽度w相同的宽度。从Ni电极10传输的孔以高电流密度注入到有源层6中, 可以降低激光振荡的电流阈值。 也可以通过将p导向层7形成为具有与Ni电极10的宽度w相同的宽度来更有效地提高电流阈值。