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    • 1. 发明授权
    • Semiconductor storage device and method of manufacturing the same
    • 半导体存储装置及其制造方法
    • US08525246B2
    • 2013-09-03
    • US12724802
    • 2010-03-16
    • Yoshiko KatoHiroyuki KutsukakeKikuko SugimaeYasuhiko Matsunaga
    • Yoshiko KatoHiroyuki KutsukakeKikuko SugimaeYasuhiko Matsunaga
    • H01L29/76
    • H01L27/11521
    • A non-volatile semiconductor storage device includes: a semiconductor substrate; a semiconductor layer formed on the semiconductor substrate; a first device isolation/insulation film formed in a trench, the trench formed in the semiconductor layer, with a first direction taken as a longitudinal direction; a device formation region formed by separating the semiconductor layer by the first device isolation/insulation film with the first direction taken as a longitudinal direction; and a memory transistor disposed on the device formation region. The first device isolation/insulation film and the device formation region have an impurity of a first conductivity type. An impurity concentration of the impurity of the first conductivity type in the first device isolation/insulation film is higher than that in the device formation region.
    • 非易失性半导体存储器件包括:半导体衬底; 形成在半导体衬底上的半导体层; 形成在沟槽中的第一器件隔离/绝缘膜,形成在半导体层中的沟槽,第一方向作为纵向方向; 通过第一装置隔离/绝缘膜将第一方向作为纵向方向分离半导体层而形成的器件形成区域; 以及设置在器件形成区域上的存储晶体管。 第一器件隔离/绝缘膜和器件形成区具有第一导电类型的杂质。 第一器件隔离/绝缘膜中的第一导电类型的杂质的杂质浓度高于器件形成区域中的杂质浓度。
    • 2. 发明申请
    • SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体存储器件及其制造方法
    • US20100314677A1
    • 2010-12-16
    • US12724802
    • 2010-03-16
    • Yoshiko KATOHiroyuki KutsukakeKikuko SugimaeYasuhiko Matsunaga
    • Yoshiko KATOHiroyuki KutsukakeKikuko SugimaeYasuhiko Matsunaga
    • H01L27/115H01L21/8247
    • H01L27/11521
    • A non-volatile semiconductor storage device includes: a semiconductor substrate; a semiconductor layer formed on the semiconductor substrate; a first device isolation/insulation film formed in a trench, the trench formed in the semiconductor layer, with a first direction taken as a longitudinal direction; a device formation region formed by separating the semiconductor layer by the first device isolation/insulation film with the first direction taken as a longitudinal direction; and a memory transistor disposed on the device formation region. The first device isolation/insulation film and the device formation region have an impurity of a first conductivity type. An impurity concentration of the impurity of the first conductivity type in the first device isolation/insulation film is higher than that in the device formation region.
    • 非易失性半导体存储器件包括:半导体衬底; 形成在半导体衬底上的半导体层; 形成在沟槽中的第一器件隔离/绝缘膜,形成在半导体层中的沟槽,第一方向作为纵向方向; 通过第一装置隔离/绝缘膜将第一方向作为纵向方向分离半导体层而形成的器件形成区域; 以及设置在器件形成区域上的存储晶体管。 第一器件隔离/绝缘膜和器件形成区具有第一导电类型的杂质。 第一器件隔离/绝缘膜中的第一导电类型的杂质的杂质浓度高于器件形成区域中的杂质浓度。
    • 3. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08400812B2
    • 2013-03-19
    • US13231510
    • 2011-09-13
    • Hiroyuki KutsukakeKikuko SugimaeMitsuhiro Noguchi
    • Hiroyuki KutsukakeKikuko SugimaeMitsuhiro Noguchi
    • G11C5/06G11C5/02G11C16/04
    • G11C16/0483G11C5/063G11C8/14H01L27/0207H01L27/088H01L27/11519H01L27/11529
    • According to one embodiment, a semiconductor memory device includes a memory array and a peripheral circuit. The memory array has a plurality of memory cells, word lines, and bit lines, in which a first, second, and third blocks are set in the order along the bit line. The peripheral circuit has a transistor group. The transistor group includes a first transfer transistor belonging to the first block, a second transfer transistor belonging to the second block, and a third transfer transistor belonging to the third block. The first, second, and third transfer transistors share the other of a source and a drain of each. With regard to a direction in which either of the source and the drain is connected to the other in each of the first, second, and third transfer transistors, the directions of the adjacent transfer transistors are different from each other by 90° or 180°.
    • 根据一个实施例,半导体存储器件包括存储器阵列和外围电路。 存储器阵列具有多个存储单元,字线和位线,其中按照位线的顺序设置第一,第二和第三块。 外围电路具有晶体管组。 晶体管组包括属于第一块的第一转移晶体管,属于第二块的第二转移晶体管和属于第三块的第三转移晶体管。 第一,第二和第三转移晶体管共享每个的源极和漏极中的另一个。 关于源极和漏极中的任一个与第一,第二和第三转移晶体管中的每一个连接到另一个的方向,相邻的转移晶体管的方向彼此相差90°或180° 。
    • 10. 发明申请
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US20050036353A1
    • 2005-02-17
    • US10885613
    • 2004-07-08
    • Kikuko SugimaeHiroyuki Kutsukake
    • Kikuko SugimaeHiroyuki Kutsukake
    • H01L21/8247G11C16/04H01L27/115H01L29/788H01L29/792G11C11/21
    • H01L27/115G11C16/0483H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A memory cell and a selection transistor for selecting the memory cell are provided. The memory cell includes a floating gate formed on a semiconductor substrate via a first gate insulation film, a pair of first diffusion layers positioned on the opposite sides of the floating gate and formed in the substrate, first and second control gates formed on the opposite sides of the floating gate to drive the floating gate, and an inter-gate insulation film formed between the first and second control gates and the floating gate. The selection transistor includes a selection gate•wiring including a first portion constituted of the same conductive layer as the first conductive layer, and a second portion constituted of the same conductive layer as the second conductive layer, and a second diffusion layer formed in the substrate, facing the second portion of the selection gate•wiring.
    • 提供了用于选择存储单元的存储单元和选择晶体管。 存储单元包括通过第一栅极绝缘膜在半导体衬底上形成的浮置栅极,位于浮置栅极的相对侧并形成在衬底中的一对第一扩散层,形成在相对侧上的第一和第二控制栅极 的栅极驱动浮栅,以及形成在第一和第二控制栅极与浮置栅极之间的栅极间绝缘膜。 选择晶体管包括选择栅极布线,其包括由与第一导电层相同的导电层构成的第一部分和由与第二导电层相同的导电层构成的第二部分,以及形成在基板中的第二扩散层 ,面向选择门的第二部分。