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    • 1. 发明授权
    • Non-volatile semiconductor storage device
    • 非易失性半导体存储器件
    • US08314455B2
    • 2012-11-20
    • US13156727
    • 2011-06-09
    • Yasuhiro ShiinoAtsuhiro SatoTakeshi KamigaichiFumitaka Arai
    • Yasuhiro ShiinoAtsuhiro SatoTakeshi KamigaichiFumitaka Arai
    • H01L29/792
    • H01L27/11578H01L27/11573H01L27/11582
    • A non-volatile semiconductor storage device includes: a memory cell area in which a plurality of electrically rewritable memory cells are formed; and a peripheral circuit area in which transistors that configure peripheral circuits to control the memory cells are formed. The memory cell area has formed therein: a semiconductor layer formed to extend in a vertical direction to a semiconductor substrate; a plurality of conductive layers extending in a parallel direction to, and laminated in a vertical direction to the semiconductor substrate; and a property-varying layer formed between the semiconductor layer and the conductive layers and having properties varying depending on a voltage applied to the conductive layers. The peripheral circuit area has formed therein a plurality of dummy wiring layers that are formed on the same plane as each of the plurality of conductive layers and that are electrically separated from the conductive layers.
    • 非易失性半导体存储装置包括:形成有多个电可重写存储单元的存储单元区域; 以及外围电路区域,其中形成配置外围电路以控制存储单元的晶体管。 在其中形成存储单元区域:形成为在垂直方向上延伸到半导体衬底的半导体层; 多个导电层,沿着与半导体基板的垂直方向平行的方向延伸并层叠; 以及形成在所述半导体层和所述导电层之间的性质变化层,并且具有根据施加到所述导电层的电压而变化的特性。 外围电路区域中形成有多个虚拟布线层,其形成在与多个导电层中的每一个相同的平面上,并且与导电层电分离。
    • 2. 发明授权
    • Non-volatile semiconductor memory device, method of reading data therefrom, and semiconductor device
    • 非挥发性半导体存储器件,从其读取数据的方法以及半导体器件
    • US08279679B2
    • 2012-10-02
    • US12979796
    • 2010-12-28
    • Takeshi KamigaichiKenji Sawamura
    • Takeshi KamigaichiKenji Sawamura
    • G11C16/06
    • G11C16/3454G11C11/5628G11C11/5642G11C16/0483G11C16/3418G11C2211/5621
    • A control circuit is configured to perform, in a write operation to a memory cell and a verify operation for verifying a threshold voltage of the memory cell, a voltage control to provide the memory cell with threshold voltage distributions. The circuit is configured to apply, in a read operation from the memory cell, to a selected memory cell a read voltage between the lower and upper limits of the threshold voltage distributions, and apply to an unselected memory cell a first read-pass voltage higher than the upper limit of a first threshold voltage distribution that is the maximum distribution of the threshold voltage distributions. The circuit is configured to apply, at least during a verify operation in a first write operation conducted before a second write operation that completes writing to the first threshold voltage distribution, a second read-pass voltage lower than the first read-pass voltage to the unselected memory cell, and apply to the semiconductor layer and the source-line a positive voltage.
    • 控制电路被配置为在对存储器单元的写入操作和用于验证存储器单元的阈值电压的验证操作中执行电压控制,以向存储器单元提供阈值电压分布。 该电路被配置为在从存储器单元的读取操作中将阈值电压分布的下限和上限之间的读取电压应用于所选择的存储器单元,并将其应用于未选择的存储器单元的第一读取通过电压 超过作为阈值电压分布的最大分布的第一阈值电压分布的上限。 该电路被配置为至少在第二写入操作期间在完成对第一阈值电压分布的写入的第二写入操作期间的验证操作期间施加低于第一读通过电压的第二读通过电压 未选择的存储单元,并且应用于半导体层和源极线的正电压。
    • 3. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 非易失性半导体存储器件及其制造方法
    • US20110316065A1
    • 2011-12-29
    • US13226224
    • 2011-09-06
    • Takeshi MURATATakeshi KAMIGAICHI
    • Takeshi MURATATakeshi KAMIGAICHI
    • H01L29/78
    • H01L27/11551H01L27/11524H01L27/11556H01L29/66825H01L29/7881
    • A nonvolatile semiconductor memory device includes a first stack unit with a first selection transistor and a second selection transistor formed on a semiconductor substrate and a second stack unit with first insulating layers and first conductive layers stacked alternately on the upper surface of the first stack unit. The second stack unit includes a second insulating layer formed in contact with side walls of the first insulating layer and the first conductive layer, a charge storage layer formed in contact with the second insulating layer for storing electrical charges, a third insulating layer formed in contact with the charge storage layer, and a first semiconductor layer formed in contact with the third insulating layer so as to extend in a stacking direction, with one end connected to one diffusion layer of the first selection transistor and the other end connected to a diffusion layer of the second selection transistor.
    • 非易失性半导体存储器件包括具有第一选择晶体管的第一堆叠单元和形成在半导体衬底上的第二选择晶体管和具有第一绝缘层的第二堆叠单元和在第一堆叠单元的上表面上交替堆叠的第一导电层。 第二堆叠单元包括与第一绝缘层和第一导电层的侧壁接触形成的第二绝缘层,与用于存储电荷的第二绝缘层接触形成的电荷存储层,形成为接触的第三绝缘层 与电荷存储层形成的第一半导体层以及与第三绝缘层接触形成的层叠方向延伸的第一半导体层,一端与第一选择晶体管的一个扩散层连接,另一端与扩散层连接 的第二选择晶体管。
    • 4. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件和控制非易失性半导体存储器件的方法
    • US20110235413A1
    • 2011-09-29
    • US12886847
    • 2010-09-21
    • Takeshi KAMIGAICHI
    • Takeshi KAMIGAICHI
    • G11C16/04
    • G11C11/5628G11C16/0483G11C16/3418
    • A control circuit of a nonvolatile semiconductor memory device according to an embodiment of the present invention sets the lower limit of an intermediate distribution in a page writing operation such that an amount of shift from a first threshold voltage distribution to a second threshold voltage distribution is substantially equal to an amount of shift from the intermediate distribution to a fourth threshold voltage distribution, and raises the lower limit of the intermediate distribution as the number of times writing has been executed increases. When the threshold voltage distribution of a second memory cell adjoining a reading target first memory cell and subject to data write after the first memory cell is the second or fourth threshold voltage distribution, the control circuit executes control of applying a second reading pass voltage higher than the first reading pass voltage to the second memory cell.
    • 根据本发明的实施例的非易失性半导体存储器件的控制电路在页写入操作中设定中间分布的下限,使得从第一阈值电压分布到第二阈值电压分布的偏移量基本上 等于从中间分布到第四阈值电压分布的偏移量,并且随着写入次数的增加,提高了中间分布的下限。 当与第一存储单元相邻的第二存储单元与第一存储单元相邻并经受数据写入的阈值电压分布是第二或第四阈值电压分布时,控制电路执行施加高于 第一读取通过电压到第二存储单元。
    • 5. 发明授权
    • Nonvolatile semiconductor memory device and method of manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • US08026546B2
    • 2011-09-27
    • US12434305
    • 2009-05-01
    • Takeshi MurataTakeshi Kamigaichi
    • Takeshi MurataTakeshi Kamigaichi
    • H01L29/792
    • H01L27/11551H01L27/11524H01L27/11556H01L29/66825H01L29/7881
    • A nonvolatile semiconductor memory device includes a first stack unit with a first selection transistor and a second selection transistor formed on a semiconductor substrate and a second stack unit with first insulating layers and first conductive layers stacked alternately on the upper surface of the first stack unit. The second stack unit includes a second insulating layer formed in contact with side walls of the first insulating layer and the first conductive layer, a charge storage layer formed in contact with the second insulating layer for storing electrical charges, a third insulating layer formed in contact with the charge storage layer, and a first semiconductor layer formed in contact with the third insulating layer so as to extend in a stacking direction, with one end connected to one diffusion layer of the first selection transistor and the other end connected to a diffusion layer of the second selection transistor.
    • 非易失性半导体存储器件包括具有第一选择晶体管的第一堆叠单元和形成在半导体衬底上的第二选择晶体管和具有第一绝缘层的第二堆叠单元和在第一堆叠单元的上表面上交替堆叠的第一导电层。 第二堆叠单元包括与第一绝缘层和第一导电层的侧壁接触形成的第二绝缘层,与用于存储电荷的第二绝缘层接触形成的电荷存储层,形成为接触的第三绝缘层 与电荷存储层形成的第一半导体层以及与第三绝缘层接触形成的层叠方向延伸的第一半导体层,一端与第一选择晶体管的一个扩散层连接,另一端与扩散层连接 的第二选择晶体管。