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    • 1. 发明授权
    • Semiconductor storage device and method of manufacturing the same
    • 半导体存储装置及其制造方法
    • US08525246B2
    • 2013-09-03
    • US12724802
    • 2010-03-16
    • Yoshiko KatoHiroyuki KutsukakeKikuko SugimaeYasuhiko Matsunaga
    • Yoshiko KatoHiroyuki KutsukakeKikuko SugimaeYasuhiko Matsunaga
    • H01L29/76
    • H01L27/11521
    • A non-volatile semiconductor storage device includes: a semiconductor substrate; a semiconductor layer formed on the semiconductor substrate; a first device isolation/insulation film formed in a trench, the trench formed in the semiconductor layer, with a first direction taken as a longitudinal direction; a device formation region formed by separating the semiconductor layer by the first device isolation/insulation film with the first direction taken as a longitudinal direction; and a memory transistor disposed on the device formation region. The first device isolation/insulation film and the device formation region have an impurity of a first conductivity type. An impurity concentration of the impurity of the first conductivity type in the first device isolation/insulation film is higher than that in the device formation region.
    • 非易失性半导体存储器件包括:半导体衬底; 形成在半导体衬底上的半导体层; 形成在沟槽中的第一器件隔离/绝缘膜,形成在半导体层中的沟槽,第一方向作为纵向方向; 通过第一装置隔离/绝缘膜将第一方向作为纵向方向分离半导体层而形成的器件形成区域; 以及设置在器件形成区域上的存储晶体管。 第一器件隔离/绝缘膜和器件形成区具有第一导电类型的杂质。 第一器件隔离/绝缘膜中的第一导电类型的杂质的杂质浓度高于器件形成区域中的杂质浓度。
    • 2. 发明申请
    • SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体存储器件及其制造方法
    • US20100314677A1
    • 2010-12-16
    • US12724802
    • 2010-03-16
    • Yoshiko KATOHiroyuki KutsukakeKikuko SugimaeYasuhiko Matsunaga
    • Yoshiko KATOHiroyuki KutsukakeKikuko SugimaeYasuhiko Matsunaga
    • H01L27/115H01L21/8247
    • H01L27/11521
    • A non-volatile semiconductor storage device includes: a semiconductor substrate; a semiconductor layer formed on the semiconductor substrate; a first device isolation/insulation film formed in a trench, the trench formed in the semiconductor layer, with a first direction taken as a longitudinal direction; a device formation region formed by separating the semiconductor layer by the first device isolation/insulation film with the first direction taken as a longitudinal direction; and a memory transistor disposed on the device formation region. The first device isolation/insulation film and the device formation region have an impurity of a first conductivity type. An impurity concentration of the impurity of the first conductivity type in the first device isolation/insulation film is higher than that in the device formation region.
    • 非易失性半导体存储器件包括:半导体衬底; 形成在半导体衬底上的半导体层; 形成在沟槽中的第一器件隔离/绝缘膜,形成在半导体层中的沟槽,第一方向作为纵向方向; 通过第一装置隔离/绝缘膜将第一方向作为纵向方向分离半导体层而形成的器件形成区域; 以及设置在器件形成区域上的存储晶体管。 第一器件隔离/绝缘膜和器件形成区具有第一导电类型的杂质。 第一器件隔离/绝缘膜中的第一导电类型的杂质的杂质浓度高于器件形成区域中的杂质浓度。
    • 3. 发明申请
    • SEMICONDUCTOR DEVICE WITH DOUBLE BARRIER FILM
    • 具有双屏障膜的半导体器件
    • US20080251881A1
    • 2008-10-16
    • US12143597
    • 2008-06-20
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • H01L29/00
    • H01L27/115H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulation layer, a second insulation layer, a first barrier film, a second barrier film, a diffusion layer. The device further comprises an upper contact hole, a lower contact hole, and a contact plug. The upper contact hole penetrates the second insulation layer and has a bottom in the second barrier film. The bottom has a width greater than a trench made in the first insulation layer, as measured in a direction crossing the widthwise direction of the trench. The lower contact hole penetrates the first insulation layer and first barrier film, communicates with the first contact hole via the trench and is provided on the diffusion layer. The upper portion of the lower contact hole has the same width as the trench. The contact plug is provided in the upper contact hole and lower contact hole.
    • 一种半导体器件,包括第一绝缘层,第二绝缘层,第一阻挡膜,第二阻挡膜,扩散层。 该装置还包括上接触孔,下接触孔和接触塞。 上接触孔穿透第二绝缘层,并且在第二阻挡膜中具有底部。 底部的宽度大于在与沟槽宽度方向交叉的方向上测量的在第一绝缘层中形成的沟槽。 下接触孔穿过第一绝缘层和第一阻挡膜,经由沟槽与第一接触孔连通并设置在扩散层上。 下接触孔的上部具有与沟槽相同的宽度。 接触塞设置在上接触孔和下接触孔中。
    • 4. 发明授权
    • Nonvolatile semiconductor memory and fabrication method for the same
    • 非易失性半导体存储器及其制造方法相同
    • US08541829B2
    • 2013-09-24
    • US13235948
    • 2011-09-19
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • H01L29/76H01L29/792
    • H01L27/115G11C16/0416G11C16/0433G11C16/0483G11C16/30H01L27/11521H01L27/11524
    • A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, first and second control gate electrode layers, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on a high voltage gate insulating film, a second inter-gate insulating film having an aperture, third and fourth control gate electrode layers, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on a second tunneling insulating film, a third inter-gate insulating film having an aperture, fifth and sixth control gate electrode layers, and a third metallic silicide film; and a liner insulating film directly disposed on source and drain regions of each of the memory cell transistor, the low voltage transistor, and the high voltage transistor.
    • 非易失性半导体存储器包括:存储单元晶体管,包括形成在第一隧穿绝缘膜上的第一浮栅电极层,第一栅间绝缘膜,第一和第二控制栅极电极层以及第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层,具有孔径的第二栅极间绝缘膜,第三和第四控制栅极电极层以及第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层,具有孔的第三栅间绝缘膜,第五和第六控制栅电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在每个存储单元晶体管,低压晶体管和高压晶体管的源极和漏极区域上的衬垫绝缘膜。
    • 5. 发明授权
    • Nonvolatile semiconductor memory and fabrication method for the same
    • 非易失性半导体存储器及其制造方法相同
    • US08084324B2
    • 2011-12-27
    • US12720062
    • 2010-03-09
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • H01L21/8238H01L21/336H01L21/4763
    • H01L27/115G11C16/0416G11C16/0433G11C16/0483G11C16/30H01L27/11521H01L27/11524
    • A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, a first and a second control gate electrode layer, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on the high voltage gate insulating film, a second inter-gate insulating film having an aperture, a third and a fourth control gate electrode layer, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on the second tunneling insulating film, a third inter-gate insulating film having an aperture, a fifth and a sixth control gate electrode layer, and a third metallic silicide film; and a liner insulating film directly disposed on a first source and drain region of the memory cell transistor, a second source and drain region of the low voltage transistor, and a third source and drain region of the high voltage transistor.
    • 非易失性半导体存储器包括:存储单元晶体管,包括形成在第一隧道绝缘膜上的第一浮栅电极层,第一栅间绝缘膜,第一和第二控制栅极电极层和第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层,具有孔径的第二栅极间绝缘膜,第三和第四控制栅极电极层和第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层,具有孔的第三栅间绝缘膜,第五和第六控制栅极电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在存储单元晶体管的第一源极和漏极区域,低压晶体管的第二源极和漏极区域以及高压晶体管的第三源极和漏极区域中的衬垫绝缘膜。
    • 6. 发明授权
    • Semiconductor device with double barrier film
    • 具有双阻挡膜的半导体器件
    • US07291875B2
    • 2007-11-06
    • US11447947
    • 2006-06-07
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • H01L23/485
    • H01L27/115H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulation layer, a second insulation layer, a first barrier film, a second barrier film, a diffusion layer. The device further comprises an upper contact hole, a lower contact hole, and a contact plug. The upper contact hole penetrates the second insulation layer and has a bottom in the second barrier film. The bottom has a width greater than a trench made in the first insulation layer, as measured in a direction crossing the widthwise direction of the trench. The lower contact hole penetrates the first insulation layer and first barrier film, communicates with the first contact hole via the trench and is provided on the diffusion layer. The upper portion of the lower contact hole has the same width as the trench. The contact plug is provided in the upper contact hole and lower contact hole.
    • 一种半导体器件,包括第一绝缘层,第二绝缘层,第一阻挡膜,第二阻挡膜,扩散层。 该装置还包括上接触孔,下接触孔和接触塞。 上接触孔穿透第二绝缘层,并且在第二阻挡膜中具有底部。 底部的宽度大于在与沟槽宽度方向交叉的方向上测量的在第一绝缘层中形成的沟槽。 下接触孔穿过第一绝缘层和第一阻挡膜,经由沟槽与第一接触孔连通并设置在扩散层上。 下接触孔的上部具有与沟槽相同的宽度。 接触塞设置在上接触孔和下接触孔中。
    • 8. 发明申请
    • Semiconductor device with double barrier film
    • 具有双阻挡膜的半导体器件
    • US20060065913A1
    • 2006-03-30
    • US11001223
    • 2004-12-02
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • H01L21/82H01L29/76
    • H01L27/115H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulation layer, a second insulation layer, a first barrier film, a second barrier film, a diffusion layer. The device further comprises an upper contact hole, a lower contact hole, and a contact plug. The upper contact hole penetrates the second insulation layer and has a bottom in the second barrier film. The bottom has a width greater than a trench made in the first insulation layer, as measured in a direction crossing the widthwise direction of the trench. The lower contact hole penetrates the first insulation layer and first barrier film, communicates with the first contact hole via the trench and is provided on the diffusion layer. The upper portion of the lower contact hole has the same width as the trench. The contact plug is provided in the upper contact hole and lower contact hole.
    • 一种半导体器件,包括第一绝缘层,第二绝缘层,第一阻挡膜,第二阻挡膜,扩散层。 该装置还包括上接触孔,下接触孔和接触塞。 上接触孔穿透第二绝缘层,并且在第二阻挡膜中具有底部。 底部的宽度大于在与沟槽宽度方向交叉的方向上测量的在第一绝缘层中形成的沟槽。 下接触孔穿过第一绝缘层和第一阻挡膜,经由沟槽与第一接触孔连通并设置在扩散层上。 下接触孔的上部具有与沟槽相同的宽度。 接触塞设置在上接触孔和下接触孔中。
    • 10. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY AND FABRICATION METHOD FOR THE SAME
    • 非易失性半导体存储器及其制造方法
    • US20100173471A1
    • 2010-07-08
    • US12720062
    • 2010-03-09
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • H01L21/336H01L21/762
    • H01L27/115G11C16/0416G11C16/0433G11C16/0483G11C16/30H01L27/11521H01L27/11524
    • A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, a first and a second control gate electrode layer, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on the high voltage gate insulating film, a second inter-gate insulating film having an aperture, a third and a fourth control gate electrode layer, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on the second tunneling insulating film, a third inter-gate insulating film having an aperture, a fifth and a sixth control gate electrode layer, and a third metallic silicide film; and a liner insulating film directly disposed on a first source and drain region of the memory cell transistor, a second source and drain region of the low voltage transistor, and a third source and drain region of the high voltage transistor.
    • 非易失性半导体存储器包括:存储单元晶体管,包括形成在第一隧道绝缘膜上的第一浮栅电极层,第一栅间绝缘膜,第一和第二控制栅极电极层和第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层,具有孔径的第二栅极间绝缘膜,第三和第四控制栅极电极层和第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层,具有孔的第三栅间绝缘膜,第五和第六控制栅极电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在存储单元晶体管的第一源极和漏极区域,低压晶体管的第二源极和漏极区域以及高压晶体管的第三源极和漏极区域中的衬垫绝缘膜。