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    • 2. 发明申请
    • METHOD FOR MANUFACTURING SOI SUBSTRATE AND SEMICONDUCTOR DEVICE
    • 制造SOI衬底和半导体器件的方法
    • US20120021588A1
    • 2012-01-26
    • US13184591
    • 2011-07-18
    • Shinya HASEGAWAAtsuo ISOBEMotomu KURATA
    • Shinya HASEGAWAAtsuo ISOBEMotomu KURATA
    • H01L21/265
    • H01L21/76254
    • One object is to provide excellent electric characteristics of an end portion of a single crystal semiconductor layer having a tapered shape. An embrittled region is formed in a single crystal semiconductor substrate by irradiating the single crystal semiconductor substrate with accelerated ions. Then, the single crystal semiconductor substrate and a base substrate are bonded to each other with an insulating film interposed therebetween and a first single crystal semiconductor layer is formed over the base substrate with the insulating film interposed therebetween by separating the single crystal semiconductor substrate at the embrittled region. After that, a second single crystal semiconductor layer having a tapered end portion is formed by performing dry etching on the first single crystal semiconductor layer, and etching is performed on the end portion of the second single crystal semiconductor layer in a state where a potential on the base substrate side is a ground potential.
    • 一个目的是提供具有锥形形状的单晶半导体层的端部的优异的电特性。 通过用加速离子照射单晶半导体衬底,在单晶半导体衬底中形成脆化区域。 然后,将单晶半导体衬底和基底衬底彼此接合,并且隔着绝缘膜在基底衬底上形成第一单晶半导体层,通过在第一单晶半导体衬底上分离单晶半导体衬底 脆弱的地区。 之后,通过在第一单晶半导体层上进行干蚀刻来形成具有锥形端部的第二单晶半导体层,并且在第二单晶半导体层的端部进行蚀刻, 基底侧是接地电位。
    • 5. 发明申请
    • GLASS COMPOSITION FOR COVERING ELECTRODES AND GLASS PASTE CONTAINING THE SAME
    • 用于覆盖电极的玻璃组合物和包含该电极的玻璃料
    • US20060276322A1
    • 2006-12-07
    • US11465048
    • 2006-08-16
    • Shinya HASEGAWAOsamu INOUESeiji TOYODA
    • Shinya HASEGAWAOsamu INOUESeiji TOYODA
    • C03C3/14C03C3/066
    • C03C3/066C03C3/145C03C8/04H01J2211/38
    • A glass composition for covering electrodes of the present invention contains: 0 to 15 wt % SiO2; 10 to 50 wt % B2O3; 15 to 50 wt % ZnO; 0 to 10 wt % Al2O3; 2 to 40 wt % Bi2O3; 0 to 5 wt % MgO; 5 to 38 wt % CaO+SrO+BaO; 0 to 0.1 wt % Li2O+Na2O+K2O; 0 to 4 wt % MoO3; and 0 to 4 wt % WO3, and the total of the contents of MoO3 and WO3 is in the range of 0.1 to 8 wt %. The glass composition for covering electrodes of the present invention may contain: 0 to 2 wt % SiO2; 10 to 50 wt % B2O3; 15 to 50 wt % ZnO; 0 to 10 wt % Al2O3; 2 to 40 wt % Bi2O3; 0 to 5 wt % MgO; 5 to 38 wt % CaO+SrO+BaO; 0 to 4 wt % MoO3; and 0 to 4 wt % WO3, and the total of the contents of MoO3 and WO3 may be in the range of 0.1 to 8 wt %.
    • 本发明的覆盖电极用玻璃组合物含有:0〜15重量%的SiO 2; 10至50重量%B 2 O 3 3; 15〜50wt%的ZnO; 0至10重量%的Al 2 O 3 3; 2至40重量%的Bi 2 O 3 3; 0〜5重量%的MgO; 5〜38重量%CaO + SrO + BaO; 0〜0.1重量%Li 2 O + Na 2 O + K 2 O; 0至4wt%MoO 3 3; 和0至4重量%的WO 3,MoO 3 3和WO 3 3的含量的总和在0.1至8的范围内 重量%。 本发明的覆盖电极用玻璃组合物可以含有0〜2重量%的SiO 2, 10至50重量%B 2 O 3 3; 15〜50wt%的ZnO; 0至10重量%的Al 2 O 3 3; 2至40重量%的Bi 2 O 3 3; 0〜5重量%的MgO; 5〜38重量%CaO + SrO + BaO; 0至4wt%MoO 3 3; 和0〜4重量%的WO 3,MoO 3 3和WO 3的含量的总和可以在0.1〜 8重量%。
    • 6. 发明申请
    • IMAGING APPARATUS
    • 成像设备
    • US20110235046A1
    • 2011-09-29
    • US13070024
    • 2011-03-23
    • Kazunori MARUYAMAShinya HASEGAWAAkinori MIYAMOTONorihiko ITANI
    • Kazunori MARUYAMAShinya HASEGAWAAkinori MIYAMOTONorihiko ITANI
    • G01J3/45
    • G02B21/14G02B21/0004
    • An imaging apparatus includes an optical source configured to emit an electromagnetic wave, a wave dividing unit configured to divide the wave from the optical source into a first and a second wave beam, a probe optical source configured to emit a probe beam, a probe-beam dividing unit configured to divide the probe beam into a first and a second probe beam, a first crystal on which the first crystal is irradiated through an object and the first probe beam is incident, a second crystal on which the second crystal is irradiated through an object and the second probe beam is incident, an interference unit configured to allow the first probe beam from the first crystal to interfere with the second probe beam from the second crystal, and an image pickup device configured to capture an interference figure between the first and the second probe beam.
    • 一种成像装置,包括:被配置为发射电磁波的光源;波分割部,被配置为将来自光源的波分成第一和第二波束;被配置为发射探测光束的探测光源; 光束分割单元,被配置为将探测光束分成第一和第二探测光束,第一晶体,其上通过物体照射第一晶体,并且第一探测光束入射;第二晶体,其上照射第二晶体的第二晶体 物体和第二探测光束入射;干涉单元,被配置为允许来自第一晶体的第一探测光束与来自第二晶体的第二探测光束干涉;以及图像拾取器件,被配置为捕获第一 和第二探测光束。