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1. 发明申请

US20050133363A1 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US20050133363A1
公开(公告)日：2005-06-23
申请号：US11031545
申请日：2005-01-08
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Liu , Antoine Manens , Siew Neo , Stan Tsai , Liang-Yuh Chen , Paul Butterfield , Yuan Tian , Sen-Hou Ko
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Liu , Antoine Manens , Siew Neo , Stan Tsai , Liang-Yuh Chen , Paul Butterfield , Yuan Tian , Sen-Hou Ko
IPC分类号： B23H5/08 , B23H5/10 , B24B37/04 , B24B53/007 , B24D13/14 , H01L21/321 , C25D17/00
CPC分类号： B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。

2. 发明申请

US20050000801A1 Method and apparatus for electrochemical mechanical processing 失效
标题翻译：电化学机械加工的方法和装置
公开(公告)号：US20050000801A1
公开(公告)日：2005-01-06
申请号：US10880752
申请日：2004-06-30
申请人： Yan Wang , Siew Neo , Feng Liu , Stan Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald Olgado , Paul Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
发明人： Yan Wang , Siew Neo , Feng Liu , Stan Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald Olgado , Paul Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
IPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/04 , B24B49/16 , B24B53/007 , B24D13/14 , H01L21/321 , C25D17/00
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/16 , B24B49/16 , B24B53/017 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。残余处理单元包括偏置的导电平面化表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

3. 发明授权

US07678245B2 Method and apparatus for electrochemical mechanical processing 失效
标题翻译：电化学机械加工的方法和装置
公开(公告)号：US07678245B2
公开(公告)日：2010-03-16
申请号：US10880752
申请日：2004-06-30
申请人： Yan Wang , Siew Neo , Feng Liu , Stan D. Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph M. Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald J. K. Olgado , Paul D. Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
发明人： Yan Wang , Siew Neo , Feng Liu , Stan D. Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph M. Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald J. K. Olgado , Paul D. Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
IPC分类号： C25B9/00
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/16 , B24B49/16 , B24B53/017 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。残余处理单元包括偏置的导电平面化表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

4. 发明申请

US20070295611A1 METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE 审中-公开
标题翻译：用于抛光底物的方法和组合物
公开(公告)号：US20070295611A1
公开(公告)日：2007-12-27
申请号：US11764726
申请日：2007-06-18
申请人： FENG LIU , Stan Tsai , Yongqi Hu , Siew Neo , Yan Wang , Alain Duboust , Liang-Yuh Chen
发明人： FENG LIU , Stan Tsai , Yongqi Hu , Siew Neo , Yan Wang , Alain Duboust , Liang-Yuh Chen
IPC分类号： B23H9/00 , B23H7/00
CPC分类号： B23H7/08 , B23H1/022 , B23H1/06
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The ECMP polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。一方面，组合物包括酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约2至约10 ，选自磨料颗粒，一种或多种氧化剂及其组合的研磨增强材料和溶剂。该组合物可用于导电材料去除工艺中，包括在包括电极的处理设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及从导电材料层去除导电材料。本文所述的ECMP抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

5. 发明申请

US20060006074A1 Method and composition for polishing a substrate 失效
标题翻译：抛光基材的方法和组合物
公开(公告)号：US20060006074A1
公开(公告)日：2006-01-12
申请号：US11196876
申请日：2005-08-04
申请人： Feng Liu , Tianbao Du , Alain Duboust , Yan Wang , Yongqi Hu , Stan Tsai , Liang-Yuh Chen , Wen-Chiang Tu , Wei-Yung Hsu
发明人： Feng Liu , Tianbao Du , Alain Duboust , Yan Wang , Yongqi Hu , Stan Tsai , Liang-Yuh Chen , Wen-Chiang Tu , Wei-Yung Hsu
IPC分类号： B23H5/00
CPC分类号： B23H5/08 , B24B37/042 , C25F3/02 , H01L21/32125 , H01L21/6875 , H01L21/7684
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率除去，以及然后用至少一种化学机械抛光技术研磨衬底。

6. 发明申请

US20080108288A1 Conductive Polishing Article for Electrochemical Mechanical Polishing 审中-公开
标题翻译：电化学机械抛光导电抛光制品
公开(公告)号：US20080108288A1
公开(公告)日：2008-05-08
申请号：US11934878
申请日：2007-11-05
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Stan Tsai , Feng Liu , Liang-Yuh Chen , Robert Ewald
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Stan Tsai , Feng Liu , Liang-Yuh Chen , Robert Ewald
IPC分类号： B24B39/06 , H01L21/3105
CPC分类号： B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软质材料组成，并且在一个实施例中，暴露表面可以是平面的。

7. 发明授权

US07207878B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US07207878B2
公开(公告)日：2007-04-24
申请号：US11031545
申请日：2005-01-08
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
IPC分类号： B24D11/00
CPC分类号： B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。

8. 发明授权

US06991528B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US06991528B2
公开(公告)日：2006-01-31
申请号：US10455941
申请日：2003-06-06
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Antoine P. Manens , Siew S. Neo , Stan D. Tsai , Liang-Yuh Chen , Paul D. Butterfield , Yuan A. Tian , Sen-Hou Ko
IPC分类号： B23H3/00 , B23B5/02
CPC分类号： B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。

9. 发明申请

US20060046623A1 Method and apparatus for reduced wear polishing pad conditioning 失效
标题翻译：降低磨损抛光垫调理的方法和装置
公开(公告)号：US20060046623A1
公开(公告)日：2006-03-02
申请号：US11209167
申请日：2005-08-22
申请人： Yan Wang , Stan Tsai , Yongqi Hu , Feng Liu , Liang-Yuh Chen , Daxin Mao , Huyen Tran , Martin Wohlert , Renhe Jia , Yuan Tian
发明人： Yan Wang , Stan Tsai , Yongqi Hu , Feng Liu , Liang-Yuh Chen , Daxin Mao , Huyen Tran , Martin Wohlert , Renhe Jia , Yuan Tian
IPC分类号： B24B1/00
CPC分类号： B24B53/017 , B23H5/08
摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.
摘要翻译：提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。在一个实施例中，调节头包括设置在中心腔中的刷子。清洁流体通过调节头的中心空腔设置到处理垫。刷子旋转并横向移动到处理垫的表面上。通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻地擦拭处理垫。调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

10. 发明申请

US20080051009A1 ENDPOINT FOR ELECTROPROCESSING 失效
标题翻译：电子终端
公开(公告)号：US20080051009A1
公开(公告)日：2008-02-28
申请号：US11930495
申请日：2007-10-31
申请人： Yan Wang , Antoine Manens , Siew Neo , Alain Duboust , Liang-Yuh Chen
发明人： Yan Wang , Antoine Manens , Siew Neo , Alain Duboust , Liang-Yuh Chen
IPC分类号： B24B49/00
CPC分类号： H01L21/32134 , B23H5/06 , B23H5/08 , B24B37/013 , B24B37/042 , B24B37/046 , B24B49/04 , B24B49/10 , B24B49/16 , G01N1/32 , H01L21/32125 , H04N1/00
摘要： Method for process control of electro-processes is provided. In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portions of an underlying layer, and adjusting the target endpoint in response to the detected breakthrough. In another embodiment, the target endpoint is adjusted relative to an amount of underlying layer exposed through the conductive layer.
摘要翻译：提供了电工艺过程控制方法。在一个实施例中，该方法包括使用目标端点处理在晶片上形成的导电层，检测导电层的穿透以暴露下层的部分，以及响应于检测到的突破来调整目标端点。在另一个实施例中，相对于通过导电层暴露的下层的量来调整目标端点。

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