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    • 1. 发明申请
    • Method for making filled epoxy resin compositions
    • 填充环氧树脂组合物的制备方法
    • US20060083851A1
    • 2006-04-20
    • US10967646
    • 2004-10-14
    • Yongan YanDouglas MeyersMark MorrisD. MeixnerSatyabrata Raychaudhuri
    • Yongan YanDouglas MeyersMark MorrisD. MeixnerSatyabrata Raychaudhuri
    • H05K3/00B05D5/12
    • C08G59/24C08G59/4215C08G59/688C08K9/06C08L63/00Y10T428/31511
    • An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
    • 对于光电器件或光学部件描述了一种密封剂,其提供小于50ppm /℃的热膨胀系数,其变化小于±30%,并进一步提供至少20%的光透射率, 在400至900nm范围内的波长处,密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料,其基本上不含二氧化钛和氧化铅,并且折射率在1.48至1.60范围内,其变化小于约0.001。 还描述了制造密封剂的方法,该方法包括以下步骤:(1)处理玻璃以形成直径在1至500μm之间的颗粒;(2)制备环氧树脂组合物,其在固化阶段的折射率接近 (3)将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物,(4)用填充的环氧树脂组合物封装光电器件,和(5)固化填充的环氧树脂 组成。
    • 2. 发明申请
    • Filled epoxy resin compositions
    • 填充环氧树脂组合物
    • US20060084727A1
    • 2006-04-20
    • US10967115
    • 2004-10-14
    • Yongan YanDouglas MeyersMark MorrisD. MeixnerSatyabrata Raychaudhuri
    • Yongan YanDouglas MeyersMark MorrisD. MeixnerSatyabrata Raychaudhuri
    • C08L63/00H01L21/56B32B27/38
    • H01L31/0203C08G59/226C08G59/4215C08G59/686C08K3/40C08K9/06C08L63/00H01L23/293H01L2924/0002Y10T428/31511H01L2924/00
    • An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
    • 对于光电器件或光学部件描述了一种密封剂,其提供小于50ppm /℃的热膨胀系数,其变化小于±30%,并进一步提供至少20%的光透射率, 在400至900nm范围内的波长处,密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料,其基本上不含二氧化钛和氧化铅,并且折射率在1.48至1.60范围内,其变化小于约0.001。 还描述了制造密封剂的方法,该方法包括以下步骤:(1)处理玻璃以形成直径在1至500μm之间的颗粒;(2)制备环氧树脂组合物,其在固化阶段的折射率接近 (3)将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物,(4)用填充的环氧树脂组合物封装光电子器件,和(5)固化填充的环氧树脂 组成。
    • 4. 发明授权
    • Filled epoxy resin compositions
    • 填充环氧树脂组合物
    • US07311972B2
    • 2007-12-25
    • US10967115
    • 2004-10-14
    • Yongan YanDouglas MeyersMark MorrisD. Laurence MeixnerSatyabrata Raychaudhuri
    • Yongan YanDouglas MeyersMark MorrisD. Laurence MeixnerSatyabrata Raychaudhuri
    • B32B27/38B32B27/04B32B27/20H01L21/56C08L63/00
    • H01L31/0203C08G59/226C08G59/4215C08G59/686C08K3/40C08K9/06C08L63/00H01L23/293H01L2924/0002Y10T428/31511H01L2924/00
    • An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
    • 对于光电器件或光学部件描述了一种密封剂,其提供小于50ppm /℃的热膨胀系数,其变化小于±30%,并进一步提供至少20%的光透射率, 在400至900nm范围内的波长处,密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料,其基本上不含二氧化钛和氧化铅,并且折射率在1.48至1.60范围内,其变化小于约0.001。 还描述了制造密封剂的方法,该方法包括以下步骤:(1)处理玻璃以形成直径在1至500μm之间的颗粒;(2)制备环氧树脂组合物,其在固化阶段的折射率接近 (3)将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物,(4)用填充的环氧树脂组合物封装光电子器件,和(5)固化填充的环氧树脂 组成。
    • 5. 发明授权
    • Method for making filled epoxy resin compositions
    • 填充环氧树脂组合物的制备方法
    • US07381359B2
    • 2008-06-03
    • US10967646
    • 2004-10-14
    • Yongan YanDouglas MeyersMark MorrisD. Laurence MeixnerSatyabrata Raychaudhuri
    • Yongan YanDouglas MeyersMark MorrisD. Laurence MeixnerSatyabrata Raychaudhuri
    • H01L21/56C08L63/00H01L23/29B32B27/04B32B27/20B32B27/38
    • C08G59/24C08G59/4215C08G59/688C08K9/06C08L63/00Y10T428/31511
    • An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
    • 对于光电器件或光学部件描述了一种密封剂,其提供小于50ppm /℃的热膨胀系数,其变化小于±30%,并进一步提供至少20%的光透射率, 在400至900nm范围内的波长处,密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料,其基本上不含二氧化钛和氧化铅,并且折射率在1.48至1.60范围内,其变化小于约0.001。 还描述了制造密封剂的方法,该方法包括以下步骤:(1)处理玻璃以形成直径在1至500μm之间的颗粒;(2)制备环氧树脂组合物,其在固化阶段的折射率接近 (3)将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物,(4)用填充的环氧树脂组合物封装光电子器件,和(5)固化填充的环氧树脂 组成。
    • 6. 发明授权
    • Apparatus for drying wet porous bodies under subcritical temperatures
and pressures
    • 用于在亚临界温度和压力下干燥湿多孔体的装置
    • US5966832A
    • 1999-10-19
    • US257884
    • 1999-02-25
    • Fikret KirkbirSatyabrata RaychaudhuriDouglas MeyersHideaki Murata
    • Fikret KirkbirSatyabrata RaychaudhuriDouglas MeyersHideaki Murata
    • F26B5/16F26B7/00F26B21/00F26B21/14F26B25/00F26B21/06
    • F26B25/006F26B21/14F26B7/00
    • An improved apparatus, and related method of operation, is described for rapidly drying large monoliths of glass, ceramic and/or composite material, under subcritical conditions, while minimizing the risk of cracking the monolith during the drying process. The apparatus incorporates a pressure chamber for carrying the monolith to be dried, with no significant limitation on the size of the monolith relative to the size of the chamber. The monolith is initially immersed in a suitable drying solvent, and the temperature of the pressure chamber is raised to a predetermined value below the solvent's critical temperature, which raises the pressure to a predetermined value, likewise below the solvent's critical pressure. At a selected time during the drying process the pressure chamber is connected to a diffusion chamber, to draw away and condense solvent vapor. This drawing away of solvent vapor continues until the monolith is dry, at which time the pressure chamber is purged with an inert gas and then depressurized in a controlled manner. The apparatus thereby is configured to dry the monolith at an even lower subcritical pressure than previous apparatus of this kind, leading to increased safety and reduced operating expenses.
    • 描述了一种改进的装置和相关的操作方法,用于在亚临界条件下快速干燥玻璃,陶瓷和/或复合材料的大型整料,同时最小化在干燥过程中破裂整料的风险。 该装置包括用于承载要干燥的整料的压力室,相对于室的大小对整体体的尺寸没有明显的限制。 将整料首先浸入合适的干燥溶剂中,并将压力室的温度升高到低于溶剂临界温度的预定值,将该压力提高到预定值,同样低于溶剂的临界压力。 在干燥过程中的选定时间,压力室连接到扩散室,以抽出并冷凝溶剂蒸汽。 继续抽出溶剂蒸汽直到整料干燥,此时用惰性气体吹扫压力室,然后以受控的方式进行减压。 因此,该装置被配置成以比这种类型的先前装置更低的亚临界压力干燥整料,从而增加了安全性并降低了操作费用。
    • 7. 发明授权
    • Method and apparatus for drying wet porous bodies under subcritical
temperatures and pressures
    • 在亚临界温度和压力下干燥湿多孔体的方法和设备
    • US5875564A
    • 1999-03-02
    • US914433
    • 1997-08-19
    • Fikret KirkbirSatyabrata RaychaudhuriDouglas MeyersHideaki Murata
    • Fikret KirkbirSatyabrata RaychaudhuriDouglas MeyersHideaki Murata
    • F26B5/16F26B7/00F26B21/00F26B21/14F26B25/00F26B5/06
    • F26B25/006F26B21/14F26B7/00
    • An improved apparatus, and related method of operation, is described for rapidly drying large monoliths of glass, ceramic and/or composite material, under subcritical conditions, while minimizing the risk of cracking the monolith during the drying process. The apparatus incorporates a pressure chamber for carrying the monolith to be dried, with no significant limitation on the size of the monolith relative to the size of the chamber. The monolith is initially immersed in a suitable drying solvent, and the temperature of the pressure chamber is raised to a predetermined value below the solvent's critical temperature, which raises the pressure to a predetermined value, likewise below the solvent's critical pressure. At a selected time during the drying process the pressure chamber is connected to a diffusion chamber, to draw away and condense solvent vapor. This drawing away of solvent vapor continues until the monolith is dry, at which time the pressure chamber is purged with an inert gas and then depressurized in a controlled manner. The apparatus thereby is configured to dry the monolith at an even lower subcritical pressure than previous apparatus of this kind, leading to increased safety and reduced operating expenses.
    • 描述了一种改进的装置和相关的操作方法,用于在亚临界条件下快速干燥玻璃,陶瓷和/或复合材料的大型整料,同时最小化在干燥过程中破裂整料的风险。 该装置包括用于承载要干燥的整料的压力室,相对于室的大小对整体体的尺寸没有明显的限制。 将整料首先浸入合适的干燥溶剂中,并将压力室的温度升高到低于溶剂临界温度的预定值,将该压力提高到预定值,同样低于溶剂的临界压力。 在干燥过程中的选定时间,压力室连接到扩散室,以抽出并冷凝溶剂蒸汽。 继续抽出溶剂蒸汽直到整料干燥,此时用惰性气体吹扫压力室,然后以受控的方式进行减压。 因此,该装置被配置成以比这种类型的先前装置更低的亚临界压力干燥整料,从而增加了安全性并降低了操作费用。
    • 10. 发明申请
    • Pallet clamping device
    • 托盘夹紧装置
    • US20070014654A1
    • 2007-01-18
    • US11485207
    • 2006-07-12
    • Forrest HaverfieldPatrick SoderDouglas MeyersMichael Heitkamp
    • Forrest HaverfieldPatrick SoderDouglas MeyersMichael Heitkamp
    • B66F9/18
    • B66F9/18B62B3/06B62B2203/29B66F9/183
    • A pallet clamping device is mounted between forks of a material handling vehicle. The device clamps to a stringer of a pallet using a pair of horizontally moveable jaws. The jaws are resiliently forced toward one another for clamping a stringer so that a clamped pallet will not move off the forks. The jaws are mounted for pivoting and sliding motion relative to mounting pins which, together with links coupling the jaws to a base of the device, tighten jaw closure if a pallet moves away from the forks. The pivoting and sliding motion of the jaws helps align the jaws with pallets not perfectly aligned with the vehicle. Depression of a foot pedal moves the jaws from a closed position to a latched open position for receiving a pallet stringer. The jaws can also be moved to an unlatched open position for receiving a greater width center stringer. Upon release of the operating device from the unlatched open position, the jaws move toward their closed position.
    • 托盘夹紧装置安装在材料处理车辆的叉之间。 该装置使用一对水平移动的夹爪夹紧到托盘的纵梁上。 夹爪相互弹性地相互夹紧,以夹紧桁条,使得夹紧的托盘不会从叉子上移开。 夹爪安装成相对于安装销枢转和滑动运动,如果托盘远离货叉移动,连接钳口的装置与装置的基座一起紧固钳口闭合。 夹爪的枢转和滑动运动有助于使夹爪与车辆不完全对准的托盘对齐。 踏板踏板将颚板从关闭位置移动到锁定的打开位置,以接收托盘纵梁。 夹爪也可以移动到未锁定的打开位置,以接收更大的宽度中心纵梁。 当操作装置从解锁的打开位置释放时,夹爪朝着关闭位置移动。