专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07381359B2 Method for making filled epoxy resin compositions 失效
标题翻译：填充环氧树脂组合物的制备方法
公开(公告)号：US07381359B2
公开(公告)日：2008-06-03
申请号：US10967646
申请日：2004-10-14
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
IPC分类号： H01L21/56 , C08L63/00 , H01L23/29 , B32B27/04 , B32B27/20 , B32B27/38
CPC分类号： C08G59/24 , C08G59/4215 , C08G59/688 , C08K9/06 , C08L63/00 , Y10T428/31511
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译：对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率，在400至900nm范围内的波长处，密封剂厚度约为1mm。密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近（3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电子器件，和（5）固化填充的环氧树脂组成。

2. 发明授权

US06841888B2 Encapsulant for opto-electronic devices and method for making it 失效
标题翻译：用于光电器件的封装剂及其制造方法
公开(公告)号：US06841888B2
公开(公告)日：2005-01-11
申请号：US10455733
申请日：2003-06-04
申请人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
IPC分类号： C08K3/40 , C08L63/00 , H01L23/29 , H01L31/0203 , H01L23/28
CPC分类号： C08K3/40 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.
摘要翻译：用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。

3. 发明授权

US07311972B2 Filled epoxy resin compositions 失效
标题翻译：填充环氧树脂组合物
公开(公告)号：US07311972B2
公开(公告)日：2007-12-25
申请号：US10967115
申请日：2004-10-14
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
IPC分类号： B32B27/38 , B32B27/04 , B32B27/20 , H01L21/56 , C08L63/00
CPC分类号： H01L31/0203 , C08G59/226 , C08G59/4215 , C08G59/686 , C08K3/40 , C08K9/06 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译：对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率，在400至900nm范围内的波长处，密封剂厚度约为1mm。密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近（3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电子器件，和（5）固化填充的环氧树脂组成。

4. 发明授权

US07014961B2 Photomask assembly incorporating a porous frame 失效
标题翻译：包含多孔框架的光掩模组合
公开(公告)号：US07014961B2
公开(公告)日：2006-03-21
申请号：US10646356
申请日：2003-08-22
申请人： Rahul Ganguli , Troy Robinson , D. Laurence Meixner
发明人： Rahul Ganguli , Troy Robinson , D. Laurence Meixner
IPC分类号： G03F1/14 , G03B27/62
CPC分类号： G03F1/64 , C03B19/12 , Y02P40/57
摘要： A photomask assembly is described having a frame for supporting a transparent pellicle above a photomask substrate, defining a closed pellicle space overlaying the substrate. The frame is formed of a porous material configured to allow the pellicle space to be purged with an inert gas within a reasonable processing time period, thereby removing any harmful chemicals that might be present. The frame preferably is made by a method that includes preparing a gel by a sol-gel process, drying the gel, and partially densifying the dry gel. The resulting frame has a gas permeability to oxygen or nitrogen higher than about 10 ml.mm/cm2.min.MPa, an average pore size between 0.001 micrometer and 10 micrometers, and a coefficient of thermal expansion between 0.01 ppm/° C. and 10 ppm/° C.
摘要翻译：描述了一种光掩模组件，其具有用于在光掩模基板上方支撑透明防护薄膜的框架，限定覆盖基板的封闭的薄膜空间。框架由多孔材料形成，其被配置为允许防护薄膜空间在合理的处理时间段内用惰性气体吹扫，从而去除可能存在的任何有害化学物质。框架优选通过包括通过溶胶 - 凝胶法制备凝胶，干燥凝胶并部分致密化干凝胶的方法制备。所得到的框架对氧气或氮气的气体渗透性高于约10毫升/厘米3·秒/秒/秒·秒·分钟·MPa，平均孔径在0.001微米至10微米之间，并且热膨胀系数在0.01ppm /℃和10ppm /℃之间。

5. 发明授权

US07476474B2 Method for making a photomask assembly incorporating a porous frame 失效
标题翻译：制造包含多孔框架的光掩模组件的方法
公开(公告)号：US07476474B2
公开(公告)日：2009-01-13
申请号：US11340384
申请日：2006-01-25
申请人： Rahul Ganguli , Troy Robinson , D. Laurence Meixner
发明人： Rahul Ganguli , Troy Robinson , D. Laurence Meixner
IPC分类号： G03F1/14 , B29C65/00 , B32B37/00 , B32B38/10 , C03B8/00 , C03B23/20 , C03C19/00 , C03C27/06
CPC分类号： G03F1/64 , C03B19/12 , Y02P40/57
摘要： A photomask assembly is described having a frame for supporting a transparent pellicle above a photomask substrate, defining a closed pellicle space overlaying the substrate. The frame is formed of a porous material configured to allow the pellicle space to be purged with an inert gas within a reasonable processing time period, thereby removing any harmful chemicals that might be present. The frame preferably is made by a method that includes preparing a gel by a sol-gel process, drying the gel, and partially densifying the dry gel. The resulting frame has a gas permeability to oxygen or nitrogen higher than about 10 ml.mm/cm2.min.MPa, an average pore size between 0.001 micrometer and 10 micrometers, and a coefficient of thermal expansion between 0.01 ppm/° C. and 10 ppm/° C.
摘要翻译：描述了一种光掩模组件，其具有用于在光掩模基板上方支撑透明防护薄膜的框架，限定覆盖基板的封闭的薄膜空间。框架由多孔材料形成，其被配置为允许防护薄膜空间在合理的处理时间段内用惰性气体吹扫，从而去除可能存在的任何有害化学物质。框架优选通过包括通过溶胶 - 凝胶法制备凝胶，干燥凝胶并部分致密化干凝胶的方法制备。所得到的框架对氧气或氮气的气体渗透性高于约10毫升/厘米2 /分钟，平均孔径在0.001微米至10微米之间，热膨胀系数在0.01ppm /℃和 10 ppm /°C

6. 发明授权

US07304102B2 Process for making encapsulant for opto-electronic devices 失效
标题翻译：制造光电器件密封剂的工艺
公开(公告)号：US07304102B2
公开(公告)日：2007-12-04
申请号：US11007766
申请日：2004-12-07
申请人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
IPC分类号： C08L63/00 , B32B27/04 , B32B27/20 , B32B27/38 , H01L21/56
CPC分类号： C08K3/40 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.
摘要翻译：用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式