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1. 发明授权

US07381359B2 Method for making filled epoxy resin compositions 失效
标题翻译：填充环氧树脂组合物的制备方法
公开(公告)号：US07381359B2
公开(公告)日：2008-06-03
申请号：US10967646
申请日：2004-10-14
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
IPC分类号： H01L21/56 , C08L63/00 , H01L23/29 , B32B27/04 , B32B27/20 , B32B27/38
CPC分类号： C08G59/24 , C08G59/4215 , C08G59/688 , C08K9/06 , C08L63/00 , Y10T428/31511
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译：对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率，在400至900nm范围内的波长处，密封剂厚度约为1mm。密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近（3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电子器件，和（5）固化填充的环氧树脂组成。

2. 发明授权

US07311972B2 Filled epoxy resin compositions 失效
标题翻译：填充环氧树脂组合物
公开(公告)号：US07311972B2
公开(公告)日：2007-12-25
申请号：US10967115
申请日：2004-10-14
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
IPC分类号： B32B27/38 , B32B27/04 , B32B27/20 , H01L21/56 , C08L63/00
CPC分类号： H01L31/0203 , C08G59/226 , C08G59/4215 , C08G59/686 , C08K3/40 , C08K9/06 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译：对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率，在400至900nm范围内的波长处，密封剂厚度约为1mm。密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近（3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电子器件，和（5）固化填充的环氧树脂组成。

3. 发明申请

US20060083851A1 Method for making filled epoxy resin compositions 失效
标题翻译：填充环氧树脂组合物的制备方法
公开(公告)号：US20060083851A1
公开(公告)日：2006-04-20
申请号：US10967646
申请日：2004-10-14
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
IPC分类号： H05K3/00 , B05D5/12
CPC分类号： C08G59/24 , C08G59/4215 , C08G59/688 , C08K9/06 , C08L63/00 , Y10T428/31511
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译：对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率，在400至900nm范围内的波长处，密封剂厚度约为1mm。密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近（3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电器件，和（5）固化填充的环氧树脂组成。

4. 发明申请

US20060084727A1 Filled epoxy resin compositions 失效
标题翻译：填充环氧树脂组合物
公开(公告)号：US20060084727A1
公开(公告)日：2006-04-20
申请号：US10967115
申请日：2004-10-14
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
IPC分类号： C08L63/00 , H01L21/56 , B32B27/38
CPC分类号： H01L31/0203 , C08G59/226 , C08G59/4215 , C08G59/686 , C08K3/40 , C08K9/06 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译：对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率，在400至900nm范围内的波长处，密封剂厚度约为1mm。密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近（3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电子器件，和（5）固化填充的环氧树脂组成。

5. 发明申请

US20050101699A1 Process for making encapsulant for opto-electronic devices 失效
标题翻译：制造光电器件密封剂的工艺
公开(公告)号：US20050101699A1
公开(公告)日：2005-05-12
申请号：US11007766
申请日：2004-12-07
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
IPC分类号： C08K3/40 , C08L63/00 , H01L23/29
CPC分类号： C08K3/40 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.
摘要翻译：用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。

6. 发明授权

US07304102B2 Process for making encapsulant for opto-electronic devices 失效
标题翻译：制造光电器件密封剂的工艺
公开(公告)号：US07304102B2
公开(公告)日：2007-12-04
申请号：US11007766
申请日：2004-12-07
申请人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
IPC分类号： C08L63/00 , B32B27/04 , B32B27/20 , B32B27/38 , H01L21/56
CPC分类号： C08K3/40 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.
摘要翻译：用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。

7. 发明授权

US06841888B2 Encapsulant for opto-electronic devices and method for making it 失效
标题翻译：用于光电器件的封装剂及其制造方法
公开(公告)号：US06841888B2
公开(公告)日：2005-01-11
申请号：US10455733
申请日：2003-06-04
申请人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
IPC分类号： C08K3/40 , C08L63/00 , H01L23/29 , H01L31/0203 , H01L23/28
CPC分类号： C08K3/40 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.
摘要翻译：用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。

8. 发明授权

US08358467B2 Durable anti-reflection coatings 有权
标题翻译：耐用的防反射涂层
公开(公告)号：US08358467B2
公开(公告)日：2013-01-22
申请号：US13247334
申请日：2011-09-28
申请人： Yongan Yan , Anand Kaygee , Satyabrata Raychaudhuri
发明人： Yongan Yan , Anand Kaygee , Satyabrata Raychaudhuri
IPC分类号： G02B1/10 , G02B5/28
CPC分类号： G02B1/111 , B32B33/00 , B32B2307/40 , B32B2307/418 , C03C17/42 , C03C2217/73 , C03C2217/76 , C08J7/045
摘要： An article comprising a substrate and an anti-reflection coating, and methods for depositing the coating, are disclosed. The coating comprises (a) a first coating layer having a high refractive index deposited on the substrate; (b) an epoxide-silica coating layer deposited onto the high refractive index coating layer, comprising an inorganic silica component and an organic organo-silicate component, and (c) a silica coating layer consisting essentially of silica, deposited directly onto the epoxide-silica coating layer. The anti-reflection coating optionally comprises a stack of coating layers, between the first high refractive index coating layer and the epoxide-silica coating layer, having alternating a low refractive index and a high refractive index. Individual coating layer compositions, refractive indexes, and thicknesses are carefully controlled such that reflectance is minimized through destructive interference in the visible light wavelength range of 400 to 700 nm. The resulting deposited coating provides excellent mechanical, chemical, and environmental durability.
摘要翻译：公开了一种包括基底和抗反射涂层的物品，以及沉积涂层的方法。涂层包括（a）沉积在基底上的具有高折射率的第一涂层; （b）沉积在高折射率涂层上的环氧化物 - 二氧化硅涂层，包括无机二氧化硅组分和有机硅酸盐组分，和（c）基本上由二氧化硅组成的二氧化硅涂层，直接沉积在环氧化物 - 二氧化硅涂层。抗反射涂层任选地包括在第一高折射率涂层和环氧化物 - 二氧化硅涂层之间的具有交替低折射率和高折射率的涂层的叠层。仔细地控制单个涂层组合物，折射率和厚度，使得通过在400至700nm的可见光波长范围内的破坏性干扰使反射率最小化。所得到的沉积涂层提供优异的机械，化学和环境耐久性。

9. 发明申请

US20050266208A1 Abrasion-resistant, antistatic, antireflective transparent coating and method for making it 审中-公开
标题翻译：耐磨，抗静电，抗反射透明涂层及其制造方法
公开(公告)号：US20050266208A1
公开(公告)日：2005-12-01
申请号：US10853877
申请日：2004-05-25
申请人： Satyabrata Raychaudhuri , Yongan Yan , Chorng-Jeou Chen
发明人： Satyabrata Raychaudhuri , Yongan Yan , Chorng-Jeou Chen
IPC分类号： B32B1/00
CPC分类号： C09D183/02 , C09D5/24 , G02B1/111 , Y10T428/24372
摘要： An improved abrasion-resistant, antistatic, antireflective transparent coating, and a method for making it, are described. The coating includes a hard coat underlayer and an antistatic, antireflective overlayer, wherein the overlayer consists essentially of hydrolyzed silica and silica particles having a size less than 1000 nm and a concentration in the range of 0.00015 to 0.01 mg/cm2. The antistatic, antireflective overlayer is made using a sol-gel method including steps of (1) preparing a sol-gel solution comprising a hydrolyzed organo-metallic compound of silicon and silica particles, (2) modifying the outer surface of the hard coat layer, (3) depositing the sol-gel solution onto the modified outer surface of the hard coat layer, and (4) thermally treating the article in an atmosphere having a controlled humidity, wherein the partial pressure of the water, PH2O, expressed in units of kPa, satisfies the following inequality: PH2O≧0.09+0.05T where T is temperature, in degrees C.
摘要翻译：描述了改进的耐磨，抗静电，抗反射透明涂层及其制造方法。涂层包括硬涂层底层和抗静电的抗反射覆盖层，其中覆盖层基本上由水合二氧化硅和尺寸小于1000nm，浓度在0.00015至0.01mg / cm 2范围内的二氧化硅颗粒组成， / SUP>。使用溶胶 - 凝胶法制备抗静电的抗反射覆盖层，该方法包括以下步骤：（1）制备包含硅和二氧化硅颗粒的水解有机金属化合物的溶胶 - 凝胶溶液，（2）改变硬涂层的外表面（3）将溶胶 - 凝胶溶液沉积在硬涂层的改性外表面上，和（4）在具有受控湿度的气氛中对制品进行热处理，其中水分压P 以kPa为单位表示的 2 满足以下不等式：<？in-line-formula description =“In 线公式“end =”lead“？> P = 0.09 + 0.05T < ？in-line-formula description =“In-line Formulas”end =“tail”？>其中T是温度，单位为摄氏度。

10. 发明申请

US20100168264A1 ANTIREFLECTIVE COATING COMPOSITIONS 有权
标题翻译：抗反射涂料组合物
公开(公告)号：US20100168264A1
公开(公告)日：2010-07-01
申请号：US12488309
申请日：2009-06-19
申请人： Yongan Yan , Satyabrata Raychaudhuri , Matthew Emilio Coda
发明人： Yongan Yan , Satyabrata Raychaudhuri , Matthew Emilio Coda
IPC分类号： C08K3/36
CPC分类号： G02B1/113 , C08F283/10 , C08F290/06 , C08F290/064 , C08K3/36 , C09D5/006 , C09D7/62 , C09D133/06 , C09D151/10 , Y10S977/773 , C08L2666/02
摘要： Coating compositions, and methods for depositing them on the surface of an article to produce an antireflection coating, are disclosed. In one embodiment, the coating composition includes a (meth)acrylate-functional silicon alkoxide, silica particles, a (meth)acrylate monomer, an epoxy (meth)acrylate oligomer, a photoinitiator, a solvent, an acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index less than about 1.60 at a wavelength of 510 nm. In another embodiment, the coating composition includes an organo-metallic compound other than an organo-metallic compound of silicon, an epoxy-functional silicon alkoxide, a non-epoxy-functional silicon alkoxide, a curing agent compatible with epoxy-functional molecules, a solvent, an inorganic acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index greater than about 1.70 at a wavelength of 510 nm. The coating compositions are deposited in a process that produces an antireflection coating in less than 90 minutes of processing time.
摘要翻译：公开了涂料组合物以及将它们沉积在制品的表面上以产生抗反射涂层的方法。在一个实施方案中，涂料组合物包含（甲基）丙烯酸酯官能的硅醇盐，二氧化硅颗粒，（甲基）丙烯酸酯单体，环氧（甲基）丙烯酸酯低聚物，光引发剂，溶剂，酸和水。控制这些成分的相对量，使得当涂料组合物沉积在制品的表面上并固化时，其在波长510nm处的折射率小于约1.60。在另一个实施方案中，涂料组合物包括除有机金属化合物硅之外的有机金属化合物，环氧官能的硅醇盐，非环氧官能的硅醇盐，与环氧官能的分子相容的固化剂，溶剂，无机酸和水。控制这些成分的相对量，使得当涂料组合物沉积在制品的表面上并固化时，其在波长510nm处具有大于约1.70的折射率。涂料组合物以不到90分钟处理时间产生抗反射涂层的方法沉积。

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