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    • 1. 发明授权
    • Method to enhance device performance with selective stress relief
    • 通过选择性应力消除来增强设备性能的方法
    • US07659174B2
    • 2010-02-09
    • US11930230
    • 2007-10-31
    • Yong Meng LeeHaining S. YangVictor Chan
    • Yong Meng LeeHaining S. YangVictor Chan
    • H01L21/336
    • H01L21/823807H01L21/823864H01L29/7843
    • A structure and method of fabrication of a semiconductor device having a stress relief layer under a stress layer in one region of a substrate. In a first example, a stress relief layer is formed over a first region of the substrate (e.g., PFET region) and not over a second region (e.g., NFET region). A stress layer is over the stress relief layer in the first region and over the devices and substrate/silicide in the second region. The NFET transistor performance is enhanced due to the overall tensile stress in the NFET channel while the degradation in the PFET transistor performance is reduced/eliminated due to the inclusion of the stress relief layer. In a second example embodiment, the stress relief layer is formed over the second region, but not the first region and the stress of the stress layer is reversed.
    • 在衬底的一个区域中的应力层下方具有应力消除层的半导体器件的制造结构和方法。 在第一示例中,应力消除层形成在衬底的第一区域(例如,PFET区域)上,而不是在第二区域(例如,NFET区域)之上。 应力层在第一区域中的应力消除层上方和第二区域中的器件和衬底/硅化物之上。 NFET晶体管的性能由于NFET沟道中的整体拉伸应力而增强,而由于包含应力消除层而降低/消除了PFET晶体管性能的降低。 在第二示例性实施例中,应力消除层形成在第二区域上,但不是第一区域并且应力层的应力被反转。
    • 3. 发明申请
    • METHOD TO ENHANCE DEVICE PERFORMANCE WITH SELECTIVE STRESS RELIEF
    • 增强选择性应力消除装置性能的方法
    • US20080050868A1
    • 2008-02-28
    • US11930230
    • 2007-10-31
    • Yong Meng LeeHaining S. YangVictor Chan
    • Yong Meng LeeHaining S. YangVictor Chan
    • H01L21/8238
    • H01L21/823807H01L21/823864H01L29/7843
    • A structure and method of fabrication of a semiconductor device having a stress relief layer under a stress layer in one region of a substrate. In a first example, a stress relief layer is formed over a first region of the substrate (e.g., PFET region) and not over a second region (e.g., NFET region). A stress layer is over the stress relief layer in the first region and over the devices and substrate/silicide in the second region. The NFET transistor performance is enhanced due to the overall tensile stress in the NFET channel while the degradation in the PFET transistor performance is reduced/eliminated due to the inclusion of the stress relief layer. In a second example embodiment, the stress relief layer is formed over the second region, but not the first region and the stress of the stress layer is reversed.
    • 在衬底的一个区域中的应力层下方具有应力消除层的半导体器件的制造结构和方法。 在第一示例中,应力消除层形成在衬底的第一区域(例如,PFET区域)上,而不是在第二区域(例如,NFET区域)之上。 应力层在第一区域中的应力消除层上方和第二区域中的器件和衬底/硅化物之上。 NFET晶体管的性能由于NFET沟道中的整体拉伸应力而增强,而由于包含应力消除层而降低/消除了PFET晶体管性能的降低。 在第二示例性实施例中,应力消除层形成在第二区域上,但不是第一区域并且应力层的应力被反转。
    • 7. 发明申请
    • DUAL TRENCH ISOLATION FOR CMOS WITH HYBRID ORIENTATIONS
    • CMOS混合方向的双路隔离
    • US20120104511A1
    • 2012-05-03
    • US13349203
    • 2012-01-12
    • Victor ChanMeikei IeongRajesh RengarajanAlexander ReznicekChun-yung SungMin Yang
    • Victor ChanMeikei IeongRajesh RengarajanAlexander ReznicekChun-yung SungMin Yang
    • H01L27/092
    • H01L21/76229
    • The present invention provides a semiconductor structure in which different types of devices are located upon a specific crystal orientation of a hybrid substrate that enhances the performance of each type of device. In the semiconductor structure of the present invention, a dual trench isolation scheme is employed whereby a first trench isolation region of a first depth isolates devices of different polarity from each other, while second trench isolation regions of a second depth, which is shallower than the first depth, are used to isolate devices of the same polarity from each other. The present invention further provides a dual trench semiconductor structure in which pFETs are located on a (110) crystallographic plane, while nFETs are located on a (100) crystallographic plane. In accordance with the present invention, the devices of different polarity, i.e., nFETs and pFETs, are bulk-like devices.
    • 本发明提供了一种半导体结构,其中不同类型的器件位于混合衬底的特定晶体取向上,这增强了每种器件的性能。 在本发明的半导体结构中,采用双沟槽隔离方案,由此第一深度的第一沟槽隔离区将彼此不同极性的器件隔离,而第二深度的第二沟槽隔离区比第 第一深度用于隔离相同极性的设备。 本发明还提供一种双沟槽半导体结构,其中pFET位于(110)结晶平面上,而nFET位于(100)晶面上。 根据本发明,不同极性的器件,即nFET和pFETs是大块状器件。