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1. 发明授权

US06703316B2 Method and system for processing substrate 有权
标题翻译：基板处理方法及系统
公开(公告)号：US06703316B2
公开(公告)日：2004-03-09
申请号：US10132212
申请日：2002-04-26
申请人： Yoichi Inoue , Yoshihiko Sakashita , Katsumi Watanabe , Nobuyuki Kawakami , Takahiko Ishii , Yusuke Muraoka , Kimitsugu Saito , Tomomi Iwata , Ikuo Mizobata , Takashi Miyake , Ryuji Kitakado
发明人： Yoichi Inoue , Yoshihiko Sakashita , Katsumi Watanabe , Nobuyuki Kawakami , Takahiko Ishii , Yusuke Muraoka , Kimitsugu Saito , Tomomi Iwata , Ikuo Mizobata , Takashi Miyake , Ryuji Kitakado
IPC分类号： H01L21302
CPC分类号： H01L21/02052 , H01L21/67028
摘要： A method and system for processing a substrate includes performing a wet process by supplying a working liquid to a substrate in a wet processing apparatus, transferring the substrate in a non-dry state from the wet processing apparatus to a drying apparatus, and subjecting the substrate to a supercritical drying by a supercritical fluid in the drying apparatus.
摘要翻译：用于处理衬底的方法和系统包括通过在湿法处理设备中将工作液体供应到衬底来进行湿法处理，将非干燥状态的衬底从湿法处理设备转移到干燥设备，并对衬底在干燥装置中通过超临界流体进行超临界干燥。

2. 发明授权

US06691430B2 High-pressure drying apparatus, high-pressure drying method and substrate processing apparatus 失效
标题翻译：高压干燥装置，高压干燥方法和基板处理装置
公开(公告)号：US06691430B2
公开(公告)日：2004-02-17
申请号：US10382616
申请日：2003-03-04
申请人： Kimitsugu Saito , Yusuke Muraoka , Ryuji Kitakado , Takashi Miyake , Tomomi Iwata , Ikuo Mizobata
发明人： Kimitsugu Saito , Yusuke Muraoka , Ryuji Kitakado , Takashi Miyake , Tomomi Iwata , Ikuo Mizobata
IPC分类号： F26B700
CPC分类号： H01L21/67034 , Y10S134/902
摘要： Liquid for prevention of substrate drying is supplied into a processing chamber so that a pool of the liquid is created as an anti-drying atmosphere in advance inside a processing chamber, and substrates, as they are dipped in the pool, are kept on stand-by in a substrate board. In this manner, air drying of the substrates which are kept on stand-by is prevented. When the number of the substrates in the substrate board reaches a certain number, the anti-drying atmosphere is removed from the processing chamber, which is followed by introduction of an SCF into the processing chamber and supercritical drying (high pressure drying) of all of the plurality of substrates inside the processing chamber, namely, batch supercritical drying.
摘要翻译：将用于防止基材干燥的液体供应到处理室中，使得在处理室内预先产生作为防干燥气氛的液体池，并且当浸入池中时，将基板保持在待机状态，通过在衬底板中。以这种方式，防止了保持待机的基板的空气干燥。当基板中的基板数量达到一定数量时，从处理室中除去防干燥气氛，然后将SCF引入处理室，并将超临界干燥（高压干燥）全部处理室内的多个基板，即分批超临界干燥。

3. 发明授权

US06841031B2 Substrate processing apparatus equipping with high-pressure processing unit 有权
标题翻译：衬底处理设备配备高压处理单元
公开(公告)号：US06841031B2
公开(公告)日：2005-01-11
申请号：US10201383
申请日：2002-07-23
申请人： Tomomi Iwata , Yusuke Muraoka , Kimitsugu Saito , Ikuo Mizobata , Takashi Miyake , Ryuji Kitakado
发明人： Tomomi Iwata , Yusuke Muraoka , Kimitsugu Saito , Ikuo Mizobata , Takashi Miyake , Ryuji Kitakado
IPC分类号： G03F7/30 , B65G49/07 , C03C15/00 , C03C23/00 , G03F7/40 , H01L21/00 , H01L21/027 , H01L21/304 , H01L21/306
CPC分类号： H01L21/67161 , C03C15/00 , C03C23/0075 , C03C23/0085 , H01L21/67173
摘要： With respect to any one of processing units, a main transportation path, a developing unit, a dedicated transportation robot and a high-pressure processing unit are disposed linearly in this order in a direction. Hence, even if a processing fluid adhering to a substrate or an evaporant of the processing fluid moves toward the main transportation path while the high-pressure processing unit transports the substrate wet with the processing fluid, there are the processing units located which the processing fluid or its evaporant must arrive at before reaching the main transportation path.
摘要翻译：对于处理单元中的任何一个，主传送路径，显影单元，专用传送机器人和高压处理单元在该方向上以该顺序线性地设置。因此，即使附着在处理液的基板或蒸发剂上的处理流体朝着主输送路径移动，而高压处理单元用处理流体输送基板，则存在处理单元，处理流体或其蒸发器必须在到达主要运输路径之前到达。

4. 发明授权

US07384484B2 Substrate processing method, substrate processing apparatus and substrate processing system 失效
标题翻译：基板加工方法，基板处理装置和基板处理系统
公开(公告)号：US07384484B2
公开(公告)日：2008-06-10
申请号：US10700020
申请日：2003-11-03
申请人： Yusuke Muraoka , Kimitsugu Saito , Tomomi Iwata , Eiji Fukatsu , Ikuo Mizobata , Hiroyuki Ueno , Yasuo Okuyama , Takashi Gama , Yoshihiko Sakashita , Katsumi Watanabe , Jun Munemasa , Hisanori Oshiba , Shogo Sarumaru
发明人： Yusuke Muraoka , Kimitsugu Saito , Tomomi Iwata , Eiji Fukatsu , Ikuo Mizobata , Hiroyuki Ueno , Yasuo Okuyama , Takashi Gama , Yoshihiko Sakashita , Katsumi Watanabe , Jun Munemasa , Hisanori Oshiba , Shogo Sarumaru
IPC分类号： B05C13/02 , B05B1/26 , B05B7/00 , C23C14/00 , B08B3/00 , H01L21/677
CPC分类号： H01L21/67051 , G11B7/261 , G11B7/265 , H01L21/67028 , Y10S134/902
摘要： After subjected to a developing process, a rinsing process and a replacing process in this order in a developing unit 10A, 10B, a substrate W wet with an anti-drying solution is wet-transported to a supercritical drying unit 20 by a primary transport robot 30. The supercritical drying unit 20 performs a high-pressure drying process (supercritical drying process) in a dedicated manner. Accordingly, by virtue of the presence of the anti-drying solution, the substrate W is effectively prevented from becoming air-dry during the transportation of the substrate W.
摘要翻译：在显影单元10A，10B中经过显影处理之后，依次进行漂洗处理和替换处理，用防干燥溶液湿润的基板W通过初级干燥器湿式输送到超临界干燥单元20 运输机器人30。超临界干燥单元20以专用的方式进行高压干燥处理（超临界干燥处理）。因此，通过存在防干燥溶液，能够有效地防止基板W在基板W的输送过程中变得风干。

5. 发明授权

US07513265B2 High pressure processing method and apparatus 失效
标题翻译：高压加工方法及装置
公开(公告)号：US07513265B2
公开(公告)日：2009-04-07
申请号：US10688889
申请日：2003-10-21
申请人： Tetsuya Yoshikawa , Yoichi Inoue , Katsumi Watanabe , Kaoru Masuda , Katsuyuki Iijima , Tomomi Iwata , Yusuke Muraoka , Kimitsugu Saito , Ikuo Mizobata
发明人： Tetsuya Yoshikawa , Yoichi Inoue , Katsumi Watanabe , Kaoru Masuda , Katsuyuki Iijima , Tomomi Iwata , Yusuke Muraoka , Kimitsugu Saito , Ikuo Mizobata
IPC分类号： B08B6/00
CPC分类号： H01L21/67017 , B08B7/0021
摘要： Disclosed is a high pressure processing method for subjecting a processing object to a high pressure processing using a high pressure fluid. In this method, the high pressure fluid is brought into collision with the surface of the processing object placed in a high pressure processing chamber, and then distributed along the surface of the processing object in an outward direction beyond the processing object.
摘要翻译：公开了一种用于使处理对象使用高压流体进行高压处理的高压处理方法。在该方法中，使高压流体与放置在高压处理室中的处理对象的表面碰撞，然后沿着处理对象的表面向外方向分布超过处理对象。

6. 发明授权

US07435396B2 High-pressure processing apparatus and high-pressure processing method 失效
标题翻译：高压加工设备及高压加工方法
公开(公告)号：US07435396B2
公开(公告)日：2008-10-14
申请号：US10958224
申请日：2004-10-04
申请人： Yusuke Muraoka , Tomomi Iwata , Kimitsugu Saito , Masahiro Yamagata , Yoichi Inoue , Hisanori Oshiba
发明人： Yusuke Muraoka , Tomomi Iwata , Kimitsugu Saito , Masahiro Yamagata , Yoichi Inoue , Hisanori Oshiba
IPC分类号： B01J3/00 , B01J19/00 , B08B3/08 , H01L21/306
CPC分类号： G05D11/132 , Y10S134/902
摘要： Mixing baths 6A and 6B which temporarily hold chemical agents A and B respectively are disposed. The mixing baths 6A and 6B are each connected with a high-pressure fluid supplying unit 2. For surface treatment using a mixture of the chemical agent A and SCF (processing fluid), SCF is fed under pressure from the high-pressure fluid supplying unit 2 to the mixing bath 6A which already holds the chemical agent A, whereby the chemical agent A dissolves in SCF flowing into the mixing bath 6A and the mixture of the chemical agent A and SCF (processing fluid) is created. As a high-pressure valve (processing fluid introducing valve) 39 is opened, the processing fluid is sent into a pressure vessel 1. This achieves a predetermined surface treatment of a substrate which has been set inside the pressure vessel 1, using the processing fluid.
摘要翻译：分别临时容纳化学试剂A和B的混合浴6A和6B。混合槽6A和6B各自与高压流体供应单元2连接。为了使用化学试剂A和SCF（加工液）的混合物的表面处理，将SCF从压力下从高压流体供给单元2供给已经保持化学试剂A的混合槽6A，由此化学试剂 A溶解流入混合槽6A的SCF，并且产生化学试剂A和SCF（加工流体）的混合物。当打开高压阀（加工流体导入阀）39时，将处理流体送入压力容器1。这使得使用处理流体对已经设置在压力容器1内部的基板进行预定的表面处理。

7. 发明申请

US20050079107A1 High-pressure processing apparatus and high-pressure processing method 失效
标题翻译：高压加工设备及高压加工方法
公开(公告)号：US20050079107A1
公开(公告)日：2005-04-14
申请号：US10958224
申请日：2004-10-04
申请人： Yusuke Muraoka , Tomomi Iwata , Kimitsugu Saito , Masahiro Yamagata , Yoichi Inoue , Hisanori Oshiba
发明人： Yusuke Muraoka , Tomomi Iwata , Kimitsugu Saito , Masahiro Yamagata , Yoichi Inoue , Hisanori Oshiba
IPC分类号： B08B3/08 , G05D11/13 , H01L21/304 , H01L21/306 , G05D9/00 , G05B1/00
CPC分类号： G05D11/132 , Y10S134/902
摘要： Mixing baths 6A and 6B which temporarily hold chemical agents A and B respectively are disposed. The mixing baths 6A and 6B are each connected with a high-pressure fluid supplying unit 2. For surface treatment using a mixture of the chemical agent A and SCF (processing fluid), SCF is fed under pressure from the high-pressure fluid supplying unit 2 to the mixing bath 6A which already holds the chemical agent A, whereby the chemical agent A dissolves in SCF flowing into the mixing bath 6A and the mixture of the chemical agent A and SCF (processing fluid) is created. As a high-pressure valve (processing fluid introducing valve) 39 is opened, the processing fluid is sent into a pressure vessel 1. This achieves a predetermined surface treatment of a substrate which has been set inside the pressure vessel 1, using the processing fluid.
摘要翻译：分别临时容纳化学试剂A和B的混合浴6A和6B。混合槽6A和6B各自与高压流体供应单元2连接。为了使用化学试剂A和SCF（处理流体）的混合物的表面处理，SCF在压力下从高压流体供应单元 2到已经保持化学试剂A的混合槽6A，由此化学试剂A溶解在流入混合槽6A的SCF中，并且产生化学试剂A和SCF（加工流体）的混合物。当打开高压阀（加工流体导入阀）39时，处理流体被送入压力容器1中。这样就可以利用处理流体对设置在压力容器1内部的基板进行预定的表面处理。

8. 发明申请

US20050005957A1 Cleaning apparatus for cleaning objects to be treated with use of cleaning composition 审中-公开
标题翻译：使用清洁剂清洁待处理物体的清洁装置
公开(公告)号：US20050005957A1
公开(公告)日：2005-01-13
申请号：US10886629
申请日：2004-07-09
申请人： Masahiro Yamagata , Hisanori Oshiba , Yoichi Inoue , Yusuke Muraoka , Tomomi Iwata , Kimitsugu Saito
发明人： Masahiro Yamagata , Hisanori Oshiba , Yoichi Inoue , Yusuke Muraoka , Tomomi Iwata , Kimitsugu Saito
IPC分类号： B08B3/08 , B08B7/00 , H01L21/00 , H01L21/027 , H01L21/304 , B08B3/00
CPC分类号： H01L21/67051 , B08B7/0021
摘要： Provided is a cleaning apparatus for cleaning an object to be treated by contacting the object to be treated with a high pressure fluid of a cleaning composition containing a cleaning component as an essential ingredient. The cleaning apparatus includes high pressure fluid supplying means for supplying the high pressure fluid of the cleaning composition, a high pressure washing vessel for removing unnecessary materials deposited on the object to be treated by contacting the object to be treated with the high pressure fluid of the cleaning composition therein, a storing vessel for storing a waste high pressure fluid of the cleaning composition carrying the unnecessary materials therein, and a sealed structure for sealably housing the high pressure fluid supplying means, the high pressure washing vessel, and the storing vessel therein. The sealed structure has first exhaust means for exhausting the gas remaining in the sealed structure therefrom.
摘要翻译：本发明提供一种清洁装置，用于通过将含有清洁组分作为必要成分的清洁组合物的高压流体接触待处理物体来清洁待处理物体。清洁装置包括用于供应清洁组合物的高压流体的高压流体供应装置，用于通过使待处理物体与待处理物体接触的待处理物体与所述待处理物体接触的高压流体来除去沉积在待处理物体上的不需要的材料的高压清洗容器清洁组合物，用于储存载有不需要的材料的清洁组合物的废高压流体的储存容器，以及用于将高压流体供给装置，高压清洗容器和储存容器密封地容纳在其中的密封结构。密封结构具有用于从其中排出残留在密封结构中的气体的第一排气装置。

9. 发明授权

US07562663B2 High-pressure processing apparatus and high-pressure processing method 失效
标题翻译：高压加工设备及高压加工方法
公开(公告)号：US07562663B2
公开(公告)日：2009-07-21
申请号：US10772546
申请日：2004-02-05
申请人： Yusuke Muraoka , Tomomi Iwata , Kimitsugu Saito , Masahiro Yamagata , Hisanori Oshiba , Shogo Sarumaru
发明人： Yusuke Muraoka , Tomomi Iwata , Kimitsugu Saito , Masahiro Yamagata , Hisanori Oshiba , Shogo Sarumaru
IPC分类号： B08B3/00 , B08B3/04
CPC分类号： B08B7/0021
摘要： A mixing valve assembly 42 is communicated with a dedicated tank 51D, storing therein a compatibilizer D, via an inlet valve 43 and is also communicated with dedicated tanks 51A-51C via three injection valves, the tanks storing therein auxiliaries A-C respectively. A chemical formulation is prepared by selectively injecting any one(s) of four chemical agents into the mixing valve assembly 42 by way of on-off control of the inlet valve 43 and the injection valves and blending together the injected chemical agents. Then, the chemical formulation is pumped into SCF by a high-pressure pump 45 such that the SCF and the chemical formulation are mixed together to form a process fluid. Thus, the number of components of a high-pressure portion can be reduced to achieve a cost reduction of an apparatus. Furthermore, a pipe line for pumping the chemical agents is simplified.
摘要翻译：混合阀组件42与专用罐51D连通，经由入口阀43存储增容器D，并且还经由三个喷射阀与专用罐51A-51C连通，储罐分别存储辅助件A-C。通过对入口阀43和喷射阀的开关控制并将注射的化学试剂混合在一起，通过选择性地将四种化学试剂中的一种或几种四种化学试剂注入混合阀组件42来制备化学制剂。然后，通过高压泵45将化学制剂泵送到SCF中，使得SCF和化学制剂混合在一起以形成工艺流体。因此，可以减少高压部分的部件的数量，以实现装置的成本降低。此外，简化了用于泵送化学试剂的管线。

10. 发明授权

US06897623B2 Electric power supply system for LED lighting unit 失效
标题翻译： LED照明单元电源系统
公开(公告)号：US06897623B2
公开(公告)日：2005-05-24
申请号：US10686234
申请日：2003-10-15
申请人： Kenji Yoneda , Tomomi Iwata , Masahiro Wakata
发明人： Kenji Yoneda , Tomomi Iwata , Masahiro Wakata
IPC分类号： H05B33/08 , H05B37/00
CPC分类号： H05B33/0848
摘要： An electric power supply system is provided to recognize a type or a desired operating condition of a connected LED lighting unit automatically and to supply electric power corresponding to the type or the operating condition.An electric power supply system for LED lighting unit comprises an LED lighting unit 1 that has an LED conducting circuit including at least an LED 2 and a resistor 4 having resistance R corresponding to a specification or a characteristics of use of the LED conducting circuit and an electric power supply unit 5 consisting of a constant current supply that can be connected with both ends of the LED conducting circuit in order to supply electric power to the LED conducting circuit and is so arranged that a type identify portion 9 consisting of a resistor measuring circuit that can be connected with both ends of the resistor and a constant current control portion 8 that supplies a control current in an arbitrary range not over the maximum allowable current of the LED conducting circuit set based on the resistance of the resistor measured by the type identify portion 9 to the LED conducting circuit.
摘要翻译：提供电力供应系统以自动识别连接的LED照明单元的类型或期望的操作条件，并提供与类型或操作条件相对应的电力。一种用于LED照明单元的电力供应系统包括具有LED导通电路的LED照明单元1，所述LED导通电路至少包括LED 2和具有对应于LED导通电路的使用的特性或特性的电阻R，以及电源单元5，其由可以与LED导通电路的两端连接的恒流源组成，以便向LED导电电路提供电力，并且被布置成使得由电阻测量电路可以与电阻器的两端连接，恒定电流控制部8以不同于LED导通电路组的最大允许电流的任意范围内提供控制电流，该电流控制部8基于由型号识别部分9连接到LED导电电路。

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