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    • 6. 发明授权
    • Method of manufacturing semiconductor devices having high pressure anneal
    • 制造具有高压退火的半导体器件的方法
    • US06274490B1
    • 2001-08-14
    • US09521268
    • 2000-03-08
    • Yih-Feng ChyanYi Ma
    • Yih-Feng ChyanYi Ma
    • H01L2144
    • H01L29/518H01L21/28176H01L21/3003H01L21/324H01L21/76826H01L21/76834
    • The present invention provides a method of passivating a semiconductor device having a capping layer formed thereover, comprising: (1) subjecting the semiconductor device to a high pressure within a pressure chamber and (2) exposing the semiconductor device to a passivating gas. The high pressure causes the passivating gas, such as a deuterated passivating gas, to penetrate the capping layer and thereby passivate the semiconductor device. The method provided by the present invention is, therefore, particularly useful in those instances where a final passivation step is desired after the formation of the capping layer. It is believed that the hydrogen isotope bonds to dangling bond sites within the semiconductor device, which are most often present at a silicon/silicon dioxide interface. Further, because of their larger mass, these hydrogen isotope atoms are not easily removed by electron flow during the operation of the device as is the case with the lighter hydrogen atoms.
    • 本发明提供一种钝化具有形成在其上的覆盖层的半导体器件的方法,包括:(1)使半导体器件在压力室内受到高压,以及(2)将半导体器件暴露于钝化气体。 高压使诸如氘代钝化气体的钝化气体穿透封盖层,从而钝化半导体器件。 因此,本发明提供的方法在形成覆盖层之后需要最终钝化步骤的情况下特别有用。 据信氢同位素结合到半导体器件内的悬挂键合位置,其通常存在于硅/二氧化硅界面处。 此外,由于它们的质量较大,与较轻的氢原子一样,这些氢同位素原子在器件的操作过程中不容易被电子流除去。
    • 7. 发明授权
    • Camera calibration with lens distortion from low-rank textures
    • 相机校准与低等级纹理的镜头失真
    • US08818132B2
    • 2014-08-26
    • US13310729
    • 2011-12-03
    • Zhengdong ZhangYasuyuki MatsushitaYi Ma
    • Zhengdong ZhangYasuyuki MatsushitaYi Ma
    • G06K9/36G06T7/00
    • G06T7/0018G06T7/80G06T2207/20104H04N17/002
    • A “Camera Calibrator” provides various techniques for recovering intrinsic camera parameters and distortion characteristics by processing a set of one or more input images. These techniques are based on extracting “Transform Invariant Low-Rank Textures” (TILT) from input images using high-dimensional convex optimization tools for matrix rank minimization and sparse signal recovery. The Camera Calibrator provides a simple, accurate, and flexible method to calibrate intrinsic parameters of a camera even with significant lens distortion, noise, errors, partial occlusions, illumination and viewpoint change, etc. Distortions caused by the camera can then be automatically corrected or removed from images. Calibration is achieved under a wide range of practical scenarios, including using multiple images of a known pattern, multiple images of an unknown pattern, single or multiple images of multiple patterns, etc. Significantly, calibration is achieved without extracting or manually identifying low-level features such as corners or edges from the calibration images.
    • “相机校准器”提供了通过处理一组一个或多个输入图像来恢复本征相机参数和失真特性的各种技术。 这些技术基于使用用于矩阵秩最小化和稀疏信号恢复的高维凸优化工具从输入图像中提取“变换不变低阶纹理”(TILT)。 相机校准器提供了一种简单,准确和灵活的校准相机内在参数的方法,即使有明显的镜头失真,噪点,错误,部分遮挡,照明和视点更改等。然后可以自动更正相机造成的失真或 从图像中删除 在广泛的实际情况下实现校准,包括使用已知图案的多个图像,未知图案的多个图像,多个图案的单个或多个图像等。显着地,在不提取或手动识别低级别的情况下实现校准 特征如校准图像的拐角或边缘。
    • 10. 发明授权
    • Atomic layer deposition processes for non-volatile memory devices
    • 用于非易失性存储器件的原子层沉积工艺
    • US07659158B2
    • 2010-02-09
    • US12059782
    • 2008-03-31
    • Yi MaShreyas S. KherKhaled AhmedTejal GoyaniMaitreyee MahajaniJallepally RaviYi-Chiau Huang
    • Yi MaShreyas S. KherKhaled AhmedTejal GoyaniMaitreyee MahajaniJallepally RaviYi-Chiau Huang
    • H01L21/8238H01L29/788
    • H01L29/42324H01L21/28273H01L29/7881
    • Embodiments of the invention provide memory devices and methods for forming memory devices. In one embodiment, a memory device is provided which includes a floating gate polysilicon layer disposed over source/drain regions of a substrate, a silicon oxynitride layer disposed over the floating gate polysilicon layer, a first aluminum oxide layer disposed over the silicon oxynitride layer, a hafnium silicon oxynitride layer disposed over the first aluminum oxide layer, a second aluminum oxide layer disposed over the hafnium silicon oxynitride layer, and a control gate polysilicon layer disposed over the second aluminum oxide layer. In another embodiment, a memory device is provided which includes a control gate polysilicon layer disposed over an inter-poly dielectric stack disposed over a silicon oxide layer disposed over the floating gate polysilicon layer. The inter-poly dielectric stack contains two silicon oxynitride layers separated by a silicon nitride layer.
    • 本发明的实施例提供了用于形成存储器件的存储器件和方法。 在一个实施例中,提供了一种存储器件,其包括设置在衬底的源极/漏极区域上的浮置栅极多晶硅层,设置在浮置栅极多晶硅层上的氧氮化硅层,设置在氧氮化硅层上的第一氧化铝层, 设置在所述第一氧化铝层上的铪硅氮化物层,设置在所述铪硅氮氧化物层上的第二氧化铝层,以及设置在所述第二氧化铝层上的控制栅极多晶硅层。 在另一个实施例中,提供了一种存储器件,其包括设置在布置在浮置多晶硅层上方的氧化硅层上的多晶硅介质叠层之间的控制栅极多晶硅层。 多晶硅间介质堆叠包含由氮化硅层分隔的两个氮氧化硅层。