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    • 9. 发明授权
    • Nonvolatile memory structures and fabrication methods
    • 非易失性存储器结构和制造方法
    • US06962848B2
    • 2005-11-08
    • US10689908
    • 2003-10-20
    • Chung Wai LeungChia-Shun HsiaoVei-Han Chan
    • Chung Wai LeungChia-Shun HsiaoVei-Han Chan
    • H01L21/8247H01L27/115
    • H01L27/11521H01L27/115
    • To fabricate a semiconductor memory, one or more pairs of first structures are formed over a semiconductor substrate. Each first structure comprises (a) a plurality of floating gates of memory cells and (b) a first conductive line providing control gates for the memory cells. The control gates overlie the floating gates. Each pair of the first structures corresponds to a plurality of doped regions each of which provides a source/drain region to a memory cell having the floating and control gates in one or the structure and a source/drain region to a memory cell having floating and control gates in the other one of the structures. For each pair, a second conductive line is formed whose bottom surface extends between the two structures and physically contacts the corresponding first doped regions. In some embodiments, the first doped regions are separated by insulation trenches. The second conductive line may form a conductive plug at least partially filling the region between the two first structures.
    • 为了制造半导体存储器,在半导体衬底上形成一对或多对第一结构。 每个第一结构包括(a)存储器单元的多个浮动栅极和(b)为存储器单元提供控制栅极的第一导电线。 控制门覆盖浮动门。 每对第一结构对应于多个掺杂区域,每个掺杂区域向存储单元提供源极/漏极区域,该存储器单元具有在一个或者结构中的浮动栅极和控制栅极,并且源极/漏极区域到具有浮置和/ 在另一个结构中控制门。 对于每对,形成第二导线,其底表面在两个结构之间延伸并物理地接触对应的第一掺杂区域。 在一些实施例中,第一掺杂区域被绝缘沟槽分开。 第二导线可以形成至少部分地填充两个第一结构之间的区域的导电插塞。