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1. 发明申请

US20100065310A1 METHOD FOR MANUFACTURING METALLIZED CERAMIC SUBSTRATE CHIP 审中-公开
标题翻译：用于制造金属化陶瓷衬底芯片的方法
公开(公告)号：US20100065310A1
公开(公告)日：2010-03-18
申请号：US12516394
申请日：2007-11-29
申请人： Yasuyuki Yamamoto , Kouichi Yamamoto , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Kouichi Yamamoto , Masakatsu Maeda
IPC分类号： H05K1/03 , H01R43/00
CPC分类号： H05K3/0052 , H01L23/13 , H01L2924/0002 , H05K1/0306 , H05K2201/09036 , H05K2201/0909 , H05K2203/0228 , Y10T29/49117 , Y10T29/49124 , H01L2924/00
摘要： A method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 μm to 5 μm; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove. When manufacturing metallized ceramic substrate chips by cutting (dividing) the ceramic substrate on the surface of which wiring patterns made of a metal film is formed, the method is capable of effectively using the base material, inhibiting defects in the metallized portion, and efficiently manufacturing the substrate chips in high yield.
摘要翻译：一种用于制造衬底芯片的方法，包括以下步骤：将设置在原始衬底上的金属布线图案单元的至少一部分的厚度设定为0.1μm至5μm; 形成用于沿着规划的切割线在陶瓷基板的表面中至少形成裂纹的槽，该切割线穿过金属布线图案单元的一部分，通过使用具有切割刀的切割轮，该切割轮具有大致V形截面沿着盘旋转轮的圆周部分; 并通过从凹槽的后面施加载荷来切割原始基底。当通过在形成由金属膜制成的布线图案的表面上切割（分割）陶瓷基板来制造金属化陶瓷基板芯片时，该方法能够有效地使用基材，抑制金属化部分中的缺陷并有效地制造基片芯片产量高。

2. 发明授权

US08138428B2 Lead-embedded metallized ceramics substrate and package 失效
标题翻译：铅嵌入式金属化陶瓷基板和封装
公开(公告)号：US08138428B2
公开(公告)日：2012-03-20
申请号：US12279073
申请日：2007-02-07
申请人： Masakatsu Maeda , Yasuyuki Yamamoto
发明人： Masakatsu Maeda , Yasuyuki Yamamoto
IPC分类号： H05K1/11
CPC分类号： H01L23/10 , H01L23/15 , H01L24/48 , H01L33/483 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H05K1/0306 , H05K3/3447 , H05K3/3452 , H05K2201/09909 , H05K2201/10106 , H05K2201/10303 , Y10T29/49139 , Y10T29/49165 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A metallized ceramics substrate including: a ceramics body; a wiring pattern formed on one surface of the ceramics body; and a lead electrically-connected to the wiring pattern. The ceramics body has a through-hole, the lead penetrates the through-hole and sticks out from another surface of the ceramics body, and the lead is fixed by filling an electroconductive filler between the lead and the through-hole for keeping airtightness. The metallized ceramics substrate does not cause a problem of interlayer peeling and is excellent in airtightness and electric conductivity.
摘要翻译：一种金属化陶瓷基板，包括：陶瓷体; 形成在陶瓷体的一个表面上的布线图案; 以及电连接到布线图案的引线。陶瓷体具有通孔，引线穿透通孔并从陶瓷体的另一表面伸出，并且通过在引线和通孔之间填充导电填料来固定引线，以保持气密性。金属化陶瓷基板不会产生层间剥离的问题，气密性和导电性优异。

3. 发明授权

US08071187B2 Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package 有权
标题翻译：用于制造金属化陶瓷衬底的方法，通过该方法制造的金属化陶瓷衬底和封装
公开(公告)号：US08071187B2
公开(公告)日：2011-12-06
申请号：US12161193
申请日：2007-01-23
申请人： Yasuyuki Yamamoto , Osamu Yatabe , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Osamu Yatabe , Masakatsu Maeda
IPC分类号： B29D22/00 , B32B7/02 , H01L23/15 , H05K5/06 , H05K7/02
CPC分类号： H01L23/15 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H05K1/092 , H05K3/4667 , H05K2201/0266 , H05K2201/0352 , Y10T428/131 , Y10T428/24355 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/31 , H01L2924/00
摘要： A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.
摘要翻译：一种金属化陶瓷基板的制造方法，包括以下步骤：在烧结陶瓷基板上形成含有金属粉末的第一导电浆料层; 形成含有与构成第一导电糊层的金属粉末的平均粒径不同的金属粉末的第二导电膏层; 以及形成第一导电层和第二导电糊层。第一导电层和第二导电层的表面粗糙度不同。通过这种方法，即使是具有多个金属化层的多层基板，也可以确保金属化陶瓷基板的气密性。

4. 发明授权

US07973481B2 Nitride sintered body and method for manufacturing thereof 有权
公开(公告)号：US07973481B2
公开(公告)日：2011-07-05
申请号：US12767254
申请日：2010-04-26
申请人： Yasuyuki Yamamoto , Yukihiro Kanechika , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Yukihiro Kanechika , Masakatsu Maeda
IPC分类号： H01J17/16 , C04B35/00
CPC分类号： C04B35/64 , C04B35/581 , C04B35/62625 , C04B35/6264 , C04B35/6303 , C04B2235/3205 , C04B2235/3222 , C04B2235/3224 , C04B2235/3225 , C04B2235/5436 , C04B2235/5445 , C04B2235/652 , C04B2235/656 , C04B2235/658 , C04B2235/77 , C04B2235/85 , C04B2235/9607 , C04B2235/9646 , Y10T428/249921 , Y10T428/268
摘要： An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO×Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature.

5. 发明申请

US20100178461A1 METHOD FOR FABRICATING METALLIZED CERAMICS SUBSTRATE, METALLIZED CERAMICS SUBSTRATE FABRICATED BY THE METHOD, AND PACKAGE 有权
标题翻译：金属化陶瓷基板的制造方法，由该方法制成的金属化陶瓷基板和封装
公开(公告)号：US20100178461A1
公开(公告)日：2010-07-15
申请号：US12161193
申请日：2007-01-23
申请人： Yasuyuki Yamamoto , Osamu Yatabe , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Osamu Yatabe , Masakatsu Maeda
IPC分类号： B32B3/02 , B05D3/02
CPC分类号： H01L23/15 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H05K1/092 , H05K3/4667 , H05K2201/0266 , H05K2201/0352 , Y10T428/131 , Y10T428/24355 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/31 , H01L2924/00
摘要： A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.
摘要翻译：一种金属化陶瓷基板的制造方法，包括以下步骤：在烧结陶瓷基板上形成含有金属粉末的第一导电浆料层; 形成含有与构成第一导电糊层的金属粉末的平均粒径不同的金属粉末的第二导电膏层; 以及形成第一导电层和第二导电糊层。第一导电层和第二导电层的表面粗糙度不同。通过这种方法，即使是具有多个金属化层的多层基板，也可以确保金属化陶瓷基板的气密性。

6. 发明授权

US07993699B2 Process for producing metallized aluminum nitride substrate 有权
标题翻译：金属化氮化铝基板的制造方法
公开(公告)号：US07993699B2
公开(公告)日：2011-08-09
申请号：US11667603
申请日：2005-11-10
申请人： Yasuyuki Yamamoto , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Masakatsu Maeda
IPC分类号： B05D5/12 , B05D3/00
CPC分类号： C04B41/5133 , B22F7/02 , C04B41/009 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/90 , C04B2111/00844 , C22C32/0047 , C23C24/08 , C23C30/005 , H01L23/15 , H01L2924/0002 , H05K1/092 , H05K2201/0209 , Y10T29/49789 , Y10T428/12063 , C04B41/0072 , C04B41/4539 , C04B41/4572 , C04B41/5063 , C04B41/4564 , C04B41/5116 , C04B41/5144 , C04B35/581 , H01L2924/00
摘要： A metallized aluminum substrate for mounting a semiconductor device such as LD or LED is provided and a metallized aluminum nitride substrate having excellent dimensional accuracy and high bonding strength of a wiring pattern. An intermediate material substrate is provided, comprising a sintered aluminum nitride substrate having on its surface a wiring pattern constituted of a conductor layer composed of a composition containing at least high-melting point metal powder, aluminum nitride powder and a sintering auxiliary agent for aluminum nitride is prepared. Then, the intermediate material substrate is fired while the sintered aluminum nitride obtained by sintering using a sintering auxiliary agent of the same kind as that of the sintering auxiliary agent contained in the composition is placed so as to be brought into contact with the conductor layer on the surface of the intermediate material substrate or so as to be present in the vicinity of the conductor layer.
摘要翻译：提供了用于安装诸如LD或LED的半导体器件的金属化铝基板和具有优异的尺寸精度和布线图案的高粘结强度的金属化的氮化铝基板。提供了一种中间材料基板，其包括烧结的氮化铝基板，其表面上具有由至少含有高熔点金属粉末，氮化铝粉末和氮化铝的烧结助剂的组成的导体层构成的布线图案准备好了然后，烧结中间材料基板，同时通过使用与组合物中所含的与烧结助剂相同种类的烧结助剂进行烧结而获得的烧结氮化铝被放置成与导体层接触，中间材料基板的表面，或者存在于导体层附近。

7. 发明授权

US07876053B2 Nitride sintered body and method for manufacturing thereof 有权
标题翻译：氮化物烧结体及其制造方法
公开(公告)号：US07876053B2
公开(公告)日：2011-01-25
申请号：US11630630
申请日：2005-06-20
申请人： Yasuyuki Yamamoto , Yukihiro Kanechika , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Yukihiro Kanechika , Masakatsu Maeda
IPC分类号： H01J17/16
CPC分类号： C04B35/64 , C04B35/581 , C04B35/62625 , C04B35/6264 , C04B35/6303 , C04B2235/3205 , C04B2235/3222 , C04B2235/3224 , C04B2235/3225 , C04B2235/5436 , C04B2235/5445 , C04B2235/652 , C04B2235/656 , C04B2235/658 , C04B2235/77 , C04B2235/85 , C04B2235/9607 , C04B2235/9646 , Y10T428/249921 , Y10T428/268
摘要： An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO×Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature.
摘要翻译：高导热性和光反射率高的绝缘材料，以及用于安装其上的LED元件的高散热性的基座，能够提高光利用率并快速散发由元件产生的热量。例如，用作基座的基板材料是具有350nm至800nm的波长区域中的光的反射率为50％以上的氮化物烧结体，波长为700nm的光的反射率为60nm 通过在含有特定量的惰性气氛中烧结由含有100质量份氮化铝粉末的组合物和0.5〜10质量份含有碱土金属如3CaO×Al 2 O 3的化合物组成的预成型体而获得的％的碳蒸气，或者通过将施加在具有预定温度的耐热性的基底上的氮化物糊的烧成。

8. 发明授权

US07718456B2 Package for housing light-emitting element and method for manufacturing package for housing light-emitting element 失效
标题翻译：用于容纳发光元件的封装和用于制造用于容纳发光元件的封装的方法
公开(公告)号：US07718456B2
公开(公告)日：2010-05-18
申请号：US11664181
申请日：2005-09-29
申请人： Masakatsu Maeda , Yasuyuki Yamamoto
发明人： Masakatsu Maeda , Yasuyuki Yamamoto
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L33/486 , H01L24/73 , H01L33/46 , H01L33/62 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15153 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A package for housing a light-emitting element wherein a via hole for wiring provided so as to pass through an insulating substrate is arranged in such a manner that it is positioned under a reflector frame; a method for manufacturing the above package for housing a light-emitting element which comprises the steps of separately providing a green sheet for the substrate and a green sheet for the frame, causing a paste containing a ceramic powder to be present between the two green sheets to bind them, and subjecting them to degreasing and sintering, to thereby integrate them.
摘要翻译：一种用于容纳发光元件的封装，其中设置为穿过绝缘基板的布线用通孔布置成使其位于反射器框架下方; 一种用于制造用于容纳发光元件的上述封装的方法，包括以下步骤：分别提供用于基板的生片和用于框架的生片，使得包含陶瓷粉末的糊剂存在于两个生片之间结合它们，并对其进行脱脂和烧结，从而将它们整合。

9. 发明申请

US20100015468A1 METHOD FOR MANUFACTURING METALLIZED ALUMINUM NITRIDE SUBSTRATE 审中-公开
标题翻译：制造金属化氮化铝衬底的方法
公开(公告)号：US20100015468A1
公开(公告)日：2010-01-21
申请号：US12519571
申请日：2007-12-21
申请人： Yasuyuki Yamamoto , Masakatsu Maeda , Osamu Yatabe
发明人： Yasuyuki Yamamoto , Masakatsu Maeda , Osamu Yatabe
IPC分类号： B32B15/04 , B05D3/02
CPC分类号： H05K3/38 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , H01L21/4867 , H01L23/3735 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/248 , H05K2201/0347 , H05K2201/035 , Y10T428/12576 , C04B35/581 , C04B41/4517 , C04B41/4539 , C04B41/5133 , C04B41/4541 , C04B41/5144 , C04B41/5127 , C04B41/522 , C04B41/5116 , H01L2924/00
摘要： A method for manufacturing metallized aluminum nitride substrate. The method includes: Step A for forming a high-melting point metal layer over a sintered aluminum nitride substrate; Step B for forming over the high-melting point metal layer an intermediate metal layer of at least one selected from the group of: nickel, copper, copper-silver, copper-tin, and gold by plate processing; and Step C for forming a surface metal layer containing silver as a main component over the intermediate metal layer by coating a silver paste whose glass component content is 1 mass % or less and firing under nonoxidizing atmosphere. By this method, it is capable of forming a glass component-free silver layer which is adhered at a high degree of adhesion strength onto the high-melting point metal layer formed over the aluminum nitride substrate as a top face by thick-film method using a silver paste which makes thick-membrane forming easier.
摘要翻译：金属化氮化铝基板的制造方法。该方法包括：步骤A，用于在烧结的氮化铝衬底上形成高熔点金属层; 步骤B，通过板加工在高熔点金属层上形成选自镍，铜，铜 - 银，铜 - 锡和金中的至少一种的中间金属层; 以及步骤C，通过涂覆玻璃成分含量为1质量％以下的银膏，在非氧化性气氛下进行烧成，在中间金属层上形成含有银为主要成分的表面金属层。通过该方法，能够通过厚膜法以高膜法形成以高粘合强度粘附在形成在氮化铝基板上的高熔点金属层上的无玻璃成分的银层，使得较厚膜形成更容易的银糊。

10. 发明申请

US20070272938A1 Package For Storing Light Emitting Element And Method For Producing Package For Storing Light Emitting Element 失效
标题翻译：用于存储发光元件的封装和用于存储发光元件的封装的方法
公开(公告)号：US20070272938A1
公开(公告)日：2007-11-29
申请号：US11659158
申请日：2005-08-03
申请人： Masakatsu Maeda , Yasuyuki Yamamoto , Yukihiro Kanechika
发明人： Masakatsu Maeda , Yasuyuki Yamamoto , Yukihiro Kanechika
IPC分类号： H01L33/00 , H01L21/48
CPC分类号： H01L33/486 , C04B35/581 , C04B35/583 , C04B35/587 , C04B35/6342 , C04B35/63424 , C04B35/6365 , C04B2235/3208 , C04B2235/3212 , C04B2235/3222 , C04B2235/3224 , C04B2235/3225 , C04B2235/442 , C04B2235/443 , C04B2235/445 , C04B2235/5436 , C04B2235/5445 , C04B2235/6025 , C04B2235/652 , C04B2235/6587 , C04B2235/723 , C04B2235/77 , C04B2235/9661 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041
摘要： A light-emitting element storing package which ensures the efficient reflection of light emitted by a light-emitting element by a reflector frame and thereby improves the brightness of the emitted light, and a method of manufacturing the same are provided. The light-emitting element storing package includes: an insulating substrate consisting of a ceramic board, a reflector frame composed of a ceramic material, joined to the upper surface of the substrate along its outer edge and having an inner wall surface defining a light-reflecting surface, and a wiring pattern layer formed on the upper surface of the substrate for connection with a light-emitting element, a light-emitting element storing concave portion, which is defined by the substrate and the reflector frame, and in which the light-emitting element is mounted on the wiring pattern layer, the reflector frame is mainly composed of nitride ceramics and its light-reflecting surface is composed of white ceramics.
摘要翻译：一种发光元件存储包，其确保了由反射器框架有效地反射由发光元件发出的光，从而提高了发光的亮度，并提供了其制造方法。发光元件存储包装包括：绝缘基板，由陶瓷板，由陶瓷材料构成的反射器框架构成，沿其外边缘接合到基板的上表面，并具有限定反射光的内壁表面表面和形成在用于与发光元件连接的基板的上表面上的布线图案层，由基板和反射器框架限定的存储凹部的发光元件，发光元件安装在布线图案层上，反射框架主要由氮化物陶瓷组成，其反光面由白色陶瓷组成。

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