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    • 1. 发明授权
    • Electronic parts carrier with a chip-supporting top tape
    • 电子部件载体带芯片支撑顶胶带
    • US4654693A
    • 1987-03-31
    • US769769
    • 1985-08-27
    • Yasutomo FunakoshiMasamitu MiyazakiTadashi SakairiKozo Suzuki
    • Yasutomo FunakoshiMasamitu MiyazakiTadashi SakairiKozo Suzuki
    • B65D75/34H01L23/02H01L23/04H01L23/08
    • B65D75/327Y10T29/53178Y10T428/234
    • In an electronic parts carrier of the type comprising a bottom tape and a top tape for use with a chip-mounting machine, the top tape is arranged to be secured to the bottom tape so as to hold and sandwich each electronic parts chip between the lower surface of the top tape and a bottom of each recess made by the bottom tape. In one embodiment, the top tape is secured to the bottom tape by way of an adhesive where the depth of the recess is made slightly smaller than the height of the chips to be contained in the recess. In another embodiment, grooves are made in side walls of each recess so that convex portions made by the top tape are engageable with the grooves to secure the top tape with each electronic parts chip being held and sandwiched between the top tape and the bottom of each recess. A through-hole may be made in the bottom of the recess for easy recognition of the contained chips and for easy pushing up of the same when the chips are to be taken out of the carrier.
    • 在包括底带和用于芯片安装机的顶带的电子部件载体中,顶部带被布置成固定到底部带,以便将每个电子部件芯片保持并夹在下部 顶部带的表面和由底部带制成的每个凹部的底部。 在一个实施例中,顶部带通过粘合剂固定到底部带,其中凹部的深度略微小于待容纳在凹部中的芯片的高度。 在另一个实施例中,在每个凹部的侧壁中形成凹槽,使得由顶部带制成的凸部可与凹槽接合以固定顶部带,每个电子部件芯片被保持并夹在顶部带子和每个底部的底部之间 休息。 可以在凹部的底部形成通孔,以容易地识别所包含的芯片,并且当芯片从载体中取出时容易将其推入。
    • 6. 发明授权
    • Directly moldable resin compositions for composite plastics
    • 用于复合塑料的直接成型树脂组合物
    • US4524160A
    • 1985-06-18
    • US577948
    • 1984-01-27
    • Nobuhisa MaedaTadashi SakairiTamotsu Wakahata
    • Nobuhisa MaedaTadashi SakairiTamotsu Wakahata
    • C08K9/00C08K9/04C08L1/00C08L7/00C08L21/00C08L23/00C08L27/00C08L51/00C08L51/02C08L101/00C08K7/00
    • C08K9/04
    • A directly moldable resin composition for a composite plastic is disclosed, which comprises a predetermined amount of a mixture of pellets of a thermoplastic synthetic resin having an average size of 2.0 mm or larger and particles of a thermoplastic resin having an average size in a predetermined range, or particles of a thermoplastic resin alone having an average size of below 900 microns, and the balance of at least one filler such as particulate inorganic fillers or fibrous fillers. The particles of a thermoplastic resin should preferably be contained in an amount equal to or higher than 100% by volume of the at least one filler. When determined by a suspending tensile failure method at a tension speed of 2 mm/cm.sup.2, a particulate filler should preferably have an adhesion force in the range of below 4 g/cm.sup.2. Greater amounts of the mixture or the particles of thermoplastic resins can be used when the filler is treated on the surface thereof with organic compounds with a H.L.B. value below 13 so as to improve affinity for synthetic resins.
    • 公开了一种用于复合塑料的可直接模塑的树脂组合物,其包含预定量的平均尺寸为2.0mm以上的热塑性合成树脂颗粒和平均尺寸在预定范围内的热塑性树脂颗粒 ,或平均粒径小于900微米的单独的热塑性树脂的颗粒,余量的至少一种填料如颗粒无机填料或纤维填料。 优选热塑性树脂的颗粒的含量应等于或高于至少一种填料的100体积%。 当以拉伸速度为2mm / cm 2的悬浮拉伸破坏方法测定时,颗粒填料应优选具有在4g / cm 2以下的粘合力。 当使用具有H.L.B的有机化合物在其表面上处理填料时,可以使用更大量的混合物或热塑性树脂颗粒。 值低于13,以提高对合成树脂的亲和力。