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1. 发明授权

US4524160A Directly moldable resin compositions for composite plastics 失效
标题翻译：用于复合塑料的直接成型树脂组合物
公开(公告)号：US4524160A
公开(公告)日：1985-06-18
申请号：US577948
申请日：1984-01-27
申请人： Nobuhisa Maeda , Tadashi Sakairi , Tamotsu Wakahata
发明人： Nobuhisa Maeda , Tadashi Sakairi , Tamotsu Wakahata
IPC分类号： C08K9/00 , C08K9/04 , C08L1/00 , C08L7/00 , C08L21/00 , C08L23/00 , C08L27/00 , C08L51/00 , C08L51/02 , C08L101/00 , C08K7/00
CPC分类号： C08K9/04
摘要： A directly moldable resin composition for a composite plastic is disclosed, which comprises a predetermined amount of a mixture of pellets of a thermoplastic synthetic resin having an average size of 2.0 mm or larger and particles of a thermoplastic resin having an average size in a predetermined range, or particles of a thermoplastic resin alone having an average size of below 900 microns, and the balance of at least one filler such as particulate inorganic fillers or fibrous fillers. The particles of a thermoplastic resin should preferably be contained in an amount equal to or higher than 100% by volume of the at least one filler. When determined by a suspending tensile failure method at a tension speed of 2 mm/cm.sup.2, a particulate filler should preferably have an adhesion force in the range of below 4 g/cm.sup.2. Greater amounts of the mixture or the particles of thermoplastic resins can be used when the filler is treated on the surface thereof with organic compounds with a H.L.B. value below 13 so as to improve affinity for synthetic resins.
摘要翻译：公开了一种用于复合塑料的可直接模塑的树脂组合物，其包含预定量的平均尺寸为2.0mm以上的热塑性合成树脂颗粒和平均尺寸在预定范围内的热塑性树脂颗粒，或平均粒径小于900微米的单独的热塑性树脂的颗粒，余量的至少一种填料如颗粒无机填料或纤维填料。优选热塑性树脂的颗粒的含量应等于或高于至少一种填料的100体积％。当以拉伸速度为2mm / cm 2的悬浮拉伸破坏方法测定时，颗粒填料应优选具有在4g / cm 2以下的粘合力。当使用具有H.L.B的有机化合物在其表面上处理填料时，可以使用更大量的混合物或热塑性树脂颗粒。值低于13，以提高对合成树脂的亲和力。

2. 发明授权

US4472539A Polyolefin series composition comprising surface treatment of filler and polyolefin prior to blending of components 失效
标题翻译：聚烯烃系列组合物包括在混合组分之前对填料和聚烯烃进行表面处理
公开(公告)号：US4472539A
公开(公告)日：1984-09-18
申请号：US380271
申请日：1982-05-20
申请人： Yasutomo Funakoshi , Fumio Iwami , Tadashi Sakairi , Tamotsu Wakahata
发明人： Yasutomo Funakoshi , Fumio Iwami , Tadashi Sakairi , Tamotsu Wakahata
IPC分类号： C08L23/00 , C08J3/20 , C08K3/34 , C08K5/14 , C08K5/5435 , C08K5/544 , C08K9/00 , C08K9/06 , C08L7/00 , C08L21/00 , C08L51/00 , C08L51/02 , C08L77/00 , C08L101/00 , C08K5/54 , C08K9/12
CPC分类号： C08K3/34 , C08J3/203 , C08K9/06 , C08J2323/02 , Y10T428/2958 , Y10T428/2962
摘要： Composition is characterized in that ethylenically unsaturated group (CH.sub.2 .dbd.C
摘要翻译：组合物的特征在于，在分散剂和抗氧化剂存在下，进行烯属不饱和基团（CH 2 = C <）操作为聚烯烃系列组合物，并且至少一种环氧基和氨基与填料接枝烯烃通过有机过氧化物。

3. 发明授权

US4654693A Electronic parts carrier with a chip-supporting top tape 失效
标题翻译：电子部件载体带芯片支撑顶胶带
公开(公告)号：US4654693A
公开(公告)日：1987-03-31
申请号：US769769
申请日：1985-08-27
申请人： Yasutomo Funakoshi , Masamitu Miyazaki , Tadashi Sakairi , Kozo Suzuki
发明人： Yasutomo Funakoshi , Masamitu Miyazaki , Tadashi Sakairi , Kozo Suzuki
IPC分类号： B65D75/34 , H01L23/02 , H01L23/04 , H01L23/08
CPC分类号： B65D75/327 , Y10T29/53178 , Y10T428/234
摘要： In an electronic parts carrier of the type comprising a bottom tape and a top tape for use with a chip-mounting machine, the top tape is arranged to be secured to the bottom tape so as to hold and sandwich each electronic parts chip between the lower surface of the top tape and a bottom of each recess made by the bottom tape. In one embodiment, the top tape is secured to the bottom tape by way of an adhesive where the depth of the recess is made slightly smaller than the height of the chips to be contained in the recess. In another embodiment, grooves are made in side walls of each recess so that convex portions made by the top tape are engageable with the grooves to secure the top tape with each electronic parts chip being held and sandwiched between the top tape and the bottom of each recess. A through-hole may be made in the bottom of the recess for easy recognition of the contained chips and for easy pushing up of the same when the chips are to be taken out of the carrier.
摘要翻译：在包括底带和用于芯片安装机的顶带的电子部件载体中，顶部带被布置成固定到底部带，以便将每个电子部件芯片保持并夹在下部顶部带的表面和由底部带制成的每个凹部的底部。在一个实施例中，顶部带通过粘合剂固定到底部带，其中凹部的深度略微小于待容纳在凹部中的芯片的高度。在另一个实施例中，在每个凹部的侧壁中形成凹槽，使得由顶部带制成的凸部可与凹槽接合以固定顶部带，每个电子部件芯片被保持并夹在顶部带子和每个底部的底部之间休息。可以在凹部的底部形成通孔，以容易地识别所包含的芯片，并且当芯片从载体中取出时容易将其推入。

4. 发明授权

US4185262A Magnet device 失效
标题翻译：磁铁装置
公开(公告)号：US4185262A
公开(公告)日：1980-01-22
申请号：US928971
申请日：1978-07-28
申请人： Sadao Watanabe , Mitsuru Itoh , Tadashi Sakairi , Yasutomo Funakoshi , Kohji Hiya
发明人： Sadao Watanabe , Mitsuru Itoh , Tadashi Sakairi , Yasutomo Funakoshi , Kohji Hiya
IPC分类号： H01F7/02 , H01F41/02
CPC分类号： H01F7/02 , H01F41/028
摘要： A magnet device having magnetic poles of opposite polarities on the same surface comprises a plurality of plastic matix magnet elements providing a magnetic circuit arranged to concentrate the magnetic energy of the magnet elements so as to derive a great magnetic force from the magnetic poles.
摘要翻译：在相同表面上具有相反极性的磁极的磁体装置包括多个塑料矩形磁体元件，提供一个磁路，该磁路被设置成集中磁体元件的磁能，以便从磁极导出很大的磁力。

5. 发明授权

US4734477A Method for cast molding plastic substrate 失效
标题翻译：铸造塑料基材的方法
公开(公告)号：US4734477A
公开(公告)日：1988-03-29
申请号：US886167
申请日：1986-07-16
申请人： Takao Inoue , Tadashi Sakairi , Mitsutoshi Aritomi , Tadao Takeyama , Takahiro Matsuo
发明人： Takao Inoue , Tadashi Sakairi , Mitsutoshi Aritomi , Tadao Takeyama , Takahiro Matsuo
IPC分类号： B29C35/02 , B29C35/08 , B29C39/00 , C08F18/00
CPC分类号： B29C35/0222 , B29C39/006 , B29C35/02 , B29C35/08 , B29K2033/04
摘要： A method for producing a plastic substrate having Tg of 110.degree. C. or more is disclosed, which comprises radical polymerizing a polyfunctional (meth)acrylate compound in a mold by a cast molding method, removing the resulting substrate from the mold when the glass transition temperature of the substrate reaches 10.degree. to 100.degree. C., and then post-curing the substrate. The method of the present invention can provide high quality plastic substrates with high productivity.
摘要翻译：公开了一种Tg为110℃以上的塑料基板的制造方法，该方法包括通过流延成型法在模具中自由基聚合多官能（甲基）丙烯酸酯化合物，当玻璃化转变基板的温度达到10〜100℃，然后对基材进行后固化。本发明的方法可以以高生产率提供高质量的塑料基材。

6. 发明授权

US4519761A Combined molding and assembling apparatus 失效
标题翻译：组合成型和组装设备
公开(公告)号：US4519761A
公开(公告)日：1985-05-28
申请号：US647825
申请日：1984-09-05
申请人： Kazuei Kenmochi , Tadashi Sakairi , Yoshio Maruyama , Eizi Itemadani
发明人： Kazuei Kenmochi , Tadashi Sakairi , Yoshio Maruyama , Eizi Itemadani
IPC分类号： B23P19/00 , B23P21/00 , B29C45/00 , B29C69/00 , B29C1/00 , B29D3/00
CPC分类号： B29C45/006 , Y10T29/53013 , Y10T29/53039 , Y10T29/53087 , Y10T29/53435
摘要： A combined molding and assembling apparatus which comprises a conveyor movable from one position to another position spaced apart from such one position, a pallet frictionally engageable with the conveyor for movement together therewith, a catch mechanism releaseably engageable with the pallet to hold the pallet at a working position, a molding machine fixedly mounted on a bench of the apparatus adjacent the conveyor and including a movable plate movable in a direction perpendicular to the direction of movement of the conveyor means for selectively closing and opening a mold assembly, and a handling machine including a head capable of moving selectively into and away from the space, in which the mold assembly operates, during the opening of the mold assembly.
摘要翻译：一种组合的模制和组装装置，其包括可从一个位置移动到与该一个位置间隔开的另一位置的输送器，与所述输送机摩擦接合以与其一起运动的托盘，可释放地与托盘接合以将托盘保持在工作位置，固定地安装在邻近输送机的设备的工作台上的成型机，并且包括可沿垂直于输送机装置的运动方向的方向移动的活动板，用于选择性地关闭和打开模具组件;以及处理机，包括在打开模具组件期间，能够选择性地移动和离开模具组件操作的空间的头部。

7. 发明授权

US4954696A Self-regulating heating article having electrodes directly connected to a PTC layer 失效
标题翻译：具有直接连接到PTC层的电极的自调节加热制品
公开(公告)号：US4954696A
公开(公告)日：1990-09-04
申请号：US190562
申请日：1988-05-05
申请人： Kazunori Ishii , Seishi Terakado , Yasutomo Funakoshi , Tadashi Sakairi
发明人： Kazunori Ishii , Seishi Terakado , Yasutomo Funakoshi , Tadashi Sakairi
IPC分类号： H01C1/14 , H05B3/06 , H05B3/14
CPC分类号： H01C1/1406 , H05B3/06 , H05B3/146
摘要： A self-regulating heating article includes a first elongate layer formed by a crystalline polymeric composition of high crystallinity and conductive particles dispersed in the polymeric composition to exhibit a positive temperature coefficient of resistance. A pair of elongate electrodes, which are adapted for connection to a power supply, are secured one on each surface of the first layer to develop a potential in the direction of thickness of the first layer. The electrodes are arranged so that a creeping distance which is greater than the thickness of the first layer is established between the electrodes along peripheral edges thereof. The creeping distance prevents insulation breakdown and ensures safe, high wattage operation at power supply voltages.

8. 发明授权

US4783587A Self-regulating heating article having electrodes directly connected to a PTC layer 失效
标题翻译：具有直接连接到PTC层的电极的自调节加热制品
公开(公告)号：US4783587A
公开(公告)日：1988-11-08
申请号：US809966
申请日：1985-12-17
申请人： Kazunori Ishii , Seishi Terakado , Yasutomo Funakoshi , Tadashi Sakairi
发明人： Kazunori Ishii , Seishi Terakado , Yasutomo Funakoshi , Tadashi Sakairi
IPC分类号： H01C1/14 , H05B3/06 , H05B3/14 , H05B3/10
CPC分类号： H01C1/1406 , H05B3/06 , H05B3/146
摘要： A self-regulating heating article comprises a first elongate layer formed by a crystalline polymeric composition of high crystallinity and conductive particles dispersed in the polymeric composition to exhibit a positive temperature coefficient of resistance. A pair of elongate electrodes, which are adapted for connection to a mains supply, are secured one on each surface of the first layer to develop a potential in the direction of thickness of the first layer. The electrodes are arranged so that a creeping distance which is greater than the thickness of the first layer is established between the electrodes along peripheral edges thereof. The creeping distance prevents insulation breakdown and ensures safe, high wattage operation at mains voltages.
摘要翻译：自调节加热制品包括由高结晶度的结晶聚合物组合物形成的第一细长层和分散在聚合物组合物中的导电颗粒以呈现正温度系数的电阻。适于连接到主电源的一对细长电极被固定在第一层的每个表面上，以在第一层的厚度方向上形成电位。电极被布置成使得沿着电极沿其周边边缘建立大于第一层的厚度的蠕变距离。蠕变距离防止绝缘击穿，确保电源电压下的安全，高功率运行。

9. 发明授权

US4657714A Method and press molding apparatus for forming information carrier discs of granular thermoplastic material 失效
标题翻译：用于形成颗粒状热塑性材料的信息载体盘的方法和压制成型装置
公开(公告)号：US4657714A
公开(公告)日：1987-04-14
申请号：US753575
申请日：1985-07-10
申请人： Kazuei Kenmochi , Tadashi Sakairi , Masamitsu Miyazaki
发明人： Kazuei Kenmochi , Tadashi Sakairi , Masamitsu Miyazaki
IPC分类号： G11B7/26 , B29C43/02 , B29C43/50 , B29C43/52 , B29C43/56 , B29D17/00 , B29D11/00
CPC分类号： B29D17/005 , B29C43/021 , B29C43/50 , B29C43/52 , B29C43/56 , B29C2043/025 , Y10S425/81
摘要： A press molding apparatus and its method of operation for making an information carrier disc which comprises the steps of maintaining a mass of granular transparent synthetic material in a vacuum, radiating heat from an infrared heating unit to plasticize the synthetic material, and press-molding the plasticized synthetic material.
摘要翻译：一种用于制造信息载体盘的压制成型装置及其操作方法，包括以下步骤：将颗粒状透明合成材料的质量保持在真空中，从红外线加热单元辐射热量以使合成材料塑化，并且将模制塑化合成材料。

10. 发明授权

US4395817A Method of making keyboard switches 失效
标题翻译：制作键盘开关的方法
公开(公告)号：US4395817A
公开(公告)日：1983-08-02
申请号：US241040
申请日：1981-03-06
申请人： Takafumi Asada , Kazuyoshi Shinohara , Kanji Kiyohara , Tadashi Sakairi
发明人： Takafumi Asada , Kazuyoshi Shinohara , Kanji Kiyohara , Tadashi Sakairi
IPC分类号： G06F3/02 , B29C45/14 , H01H11/00 , H01H13/702 , H01H13/703 , H01H13/785
CPC分类号： H01H13/785 , B29C45/14311 , H01H11/00 , H01H13/702 , B29C2045/14319 , B29K2715/006 , B29L2031/466 , H01H13/703 , H01H2201/032 , H01H2209/014 , H01H2211/006 , H01H2215/004 , H01H2221/002 , H01H2221/004 , H01H2221/03 , H01H2227/004 , H01H2229/034 , H01H2229/044 , H01H2229/05 , H01H2229/052 , H01H2231/05 , Y10T156/1092 , Y10T29/49105
摘要： A method of making a keyboard including, a number of switch keys fixedly provided on one surface of a resilient plastic sheet a number of moving contacts formed on the other surface of the resilient plastic sheet. The keys are formed of a plastic material having a melting temperature lower than that of the resilient plastic sheet.Thermoplastic bond layers are deposited on both surfaces of the resilient plastic sheet. The melting point of the thermoplastic bond layers is lower than that of the switch keys.The resilient plastic sheet is placed in a metal mold which has cavities (101a) at predetermined places.Melted plastic material is injected into the cavities to form the switch keys and at the same time cause the portions of thermoplastic bond layers which contact the injected melted plastic to be melted by the heat of the injected melted plastic material and to bond the switch keys onto the resilient plastic sheet.
摘要翻译：一种制造键盘的方法，包括：在弹性塑料片的一个表面上固定地设置多个形成在弹性塑料片的另一个表面上的多个移动触点的开关键。键由具有低于弹性塑料片的熔化温度的塑性材料形成。热塑性粘合层沉积在弹性塑料片的两个表面上。热塑性接合层的熔点低于开关键的熔点。将弹性塑料片放置在在预定位置具有空腔（101a）的金属模具中。将熔融的塑料材料注入到空腔中以形成开关键，并且同时使得与注入的熔融塑料接触的热塑性粘合层的部分被注入的熔融塑料材料的热量熔化并将开关键接合到弹性塑料片。

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