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    • 3. 发明授权
    • Semiconductor device socket
    • 半导体器件插座
    • US5917240A
    • 1999-06-29
    • US923254
    • 1997-09-04
    • Yasushi IdetaAkihiro WashitaniTsunenori UmetsuKeiko KanekoKunio Kobayashi
    • Yasushi IdetaAkihiro WashitaniTsunenori UmetsuKeiko KanekoKunio Kobayashi
    • G01R31/26H01L23/32H01R33/76H01R33/965H05K7/10H01L23/34
    • H05K7/1023
    • A semiconductor device test socket for connecting an external circuit to external leads of a semiconductor device to permit testing of the semiconductor device includes a body having a positioning base for supporting roots of external leads of a semiconductor device to be tested. A plurality of movable contact terminals are supported by the body and disposed opposite to the external leads of the semiconductor device when the semiconductor device is supported by the positioning base. The contact terminals are movable between a first position electrically contacting the external leads and a second position spaced from the external leads. The contact terminals are configured so as to be moved to their second positions when a conveyance tool for supporting the semiconductor device to be tested is moved towards the test socket and pressed against the contact terminals, and so as to move to their first positions when the conveyance tool is moved away from the test socket out of contact with the contact terminals.
    • 用于将外部电路连接到半导体器件的外部引线以允许半导体器件的测试的半导体器件测试插座包括具有用于支撑要测试的半导体器件的外部引线的根的定位基座的主体。 当半导体器件被定位基座支撑时,多个可动触点端子由主体支撑并且设置成与半导体器件的外部引线相对。 接触端子可以在与外部引线电接触的第一位置和与外部引线间隔开的第二位置之间移动。 接触端子被构造成当用于支撑被测半导体器件的输送工具朝向测试插座移动并按压接触端子时移动到其第二位置,并且当第二位置移动到其第一位置时 传送工具远离测试插座脱离与接触端子的接触。