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    • 1. 发明授权
    • Method and device for converting number of frames of image signals
    • 用于转换图像信号帧数的方法和装置
    • US06611294B1
    • 2003-08-26
    • US09720327
    • 2000-12-22
    • Yasuhiro HiranoKazuo IshikuraMasato SugiyamaMitsuo NakajimaYasutaka TsuruTakaaki MatonoHaruki TakataTakashi Kanehachi
    • Yasuhiro HiranoKazuo IshikuraMasato SugiyamaMitsuo NakajimaYasutaka TsuruTakaaki MatonoHaruki TakataTakashi Kanehachi
    • H04N701
    • H04N7/012H04N5/145H04N5/4401H04N7/014H04N19/513H04N19/61
    • The present invention provides a movement correction frame count transformation apparatus for carrying out frame count transformation processing on a picture signal. In the apparatus, an input picture signal (S1) of interlaced scanning is converted into a signal (S2) of sequential scanning by an IP conversion unit (1). A movement detecting unit (3) detects movement detection signals (MD1 and MD2). A block unit movement vector searching unit (4) detects a block unit movement vector (BMV) by carrying out block matching processing. A movement vector correcting unit (5) carries out miniblock division processing to generate a movement vector (BV) if a movement correction error is equal to or greater than a threshold value. A pixel unit movement vector generating unit (6) generates a movement vector with a smallest error component between a frame signal of a current frame and a frame signal of an immediately preceding frame as a movement vector of a pixel. An MC interpolation frame signal generating unit (7) generates an interpolation frame in movement correction processing carried out by a median filter in order to produce a signal (S4) of sequential scanning as a result of frame count transformation based on movement correction.
    • 本发明提供一种用于对图像信号执行帧计数变换处理的移动校正帧计数变换装置。 在该装置中,隔行扫描的输入图像信号(S1)被IP转换单元(1)转换成顺序扫描的信号(S2)。 移动检测单元(3)检测移动检测信号(MD1和MD2)。 块单元移动向量搜索单元(4)通过执行块匹配处理来检测块单元移动向量(BMV)。 如果移动校正误差等于或大于阈值,则运动矢量校正单元(5)执行小块分割处理以生成运动矢量(BV)。 像素单元移动向量生成单元(6)生成当前帧的帧信号与前一帧的帧信号之间的最小误差分量的运动矢量作为像素的运动矢量。 MC内插帧信号生成单元(7)生成由中值滤波器执行的移动校正处理中的内插帧,以便基于移动校正产生作为帧计数变换的结果的顺序扫描的信号(S4)。
    • 10. 发明授权
    • Filler-containing resin composition suitable for injection molding and
transfer molding
    • 适用于注射成型和传递成型的含填料的树脂组合物
    • US5780145A
    • 1998-07-14
    • US885196
    • 1997-06-30
    • Yasuhiro HiranoMasatsugu AkibaYutaka ShiomiNoriaki Saito
    • Yasuhiro HiranoMasatsugu AkibaYutaka ShiomiNoriaki Saito
    • C08K7/18C08L71/10B23B5/16B23B27/26B23B27/38
    • C08K7/18Y10S428/901Y10T428/25Y10T428/259Y10T428/31511Y10T428/31721
    • A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.
    • 一种成型树脂组合物,其在树脂中含有平均粒径不小于0.1μm且不大于1.5μm(x组分)的球状粉末的填料,其平均粒径不为球状粉末 小于2μm,不大于15μm(y成分)和平均粒径不小于20μm且不大于70μm(z成分)的球状粉末,其中x, 基于x,y和z成分的总体积的y和z成分不小于体积的10体积%且不大于24体积%,不小于体积的0.1体积%且不大于36体积% 小于57体积%且不大于76体积%,即使在加载高比例填料时也具有优异的流动性。 此外,由于固化物中存在的树脂本身,其固化物的吸湿性和热膨胀系数增加,其固化产物降低。 此外,用树脂组合物密封的半导体封装具有高封装抗裂性。 该树脂组合物适合用作半导体的密封材料,并且广泛适用于需要高填料填充量的其它用途。