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1. 发明授权

US06231633B1 Granular coated fertilizer and method for producing the same 有权
标题翻译：颗粒状涂层肥料及其生产方法
公开(公告)号：US06231633B1
公开(公告)日：2001-05-15
申请号：US09313985
申请日：1999-05-19
申请人： Yasuhiro Hirano , Yutaka Yamaguchi , Hiroshi Nakamura
发明人： Yasuhiro Hirano , Yutaka Yamaguchi , Hiroshi Nakamura
IPC分类号： C05G500
CPC分类号： C05G3/0035
摘要： Provided is a granular fertilizer coated with a thermosetting resin coating, characterized in that a dissolution rate of the fertilizer is retarded by containing a hydrophobic compound in at least one of the coating portion and the fertilizer portion thereof. The dissolution rate is further retarded than that of a conventional granular coated fertilizer coated with a thermosetting resin.
摘要翻译：提供涂覆有热固性树脂涂层的颗粒肥料，其特征在于通过在其涂覆部分和肥料部分中的至少一个中含有疏水性化合物来抑制肥料的溶解速率。溶解速度比涂覆有热固性树脂的常规颗粒包覆肥料的溶解速度进一步延迟。

2. 发明授权

US5854370A Epoxy resin stilbenes and process for producing the same by photoisomerization 失效
标题翻译：环氧树脂二苯乙烯及其通过光异构化制备其的方法
公开(公告)号：US5854370A
公开(公告)日：1998-12-29
申请号：US863300
申请日：1997-05-27
申请人： Akira Yokota , Yasuhiro Hirano , Masatsugu Akiba , Hiroshi Nakamura , Shigeki Naitoh
发明人： Akira Yokota , Yasuhiro Hirano , Masatsugu Akiba , Hiroshi Nakamura , Shigeki Naitoh
IPC分类号： C07D303/24 , C08G59/06 , C08G59/24
CPC分类号： C08G59/063 , C07D303/24 , C08G59/245
摘要： The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.
摘要翻译：本发明提供了一种具有比迄今已知的反茋系环氧树脂更低的熔点和更低的粘度的顺式 - 二苯乙烯型环氧树脂。二苯乙烯型环氧树脂的顺式异构体含量基本上为100％，或者替代地，至少约10％，其余为反式异构体，并且基于以下通式（1）：（1）其中R1至R8独立地为非环状或环状烷基，氢原子或卤素原子。还公开了这些环氧树脂的生产方法。

3. 发明授权

US5939473A Epoxy resin, resin composition, and resin-encapsulated semiconductor device 失效
标题翻译：环氧树脂，树脂组合物和树脂封装的半导体器件
公开(公告)号：US5939473A
公开(公告)日：1999-08-17
申请号：US639506
申请日：1996-04-29
申请人： Yasuhiro Hirano , Masatsugu Akiba , Akira Yokota , Hiroshi Nakamura , Shigeki Naitoh
发明人： Yasuhiro Hirano , Masatsugu Akiba , Akira Yokota , Hiroshi Nakamura , Shigeki Naitoh
IPC分类号： C07C39/21 , C07C39/215 , C07D301/28 , C07D303/23 , C07D303/24 , C08G59/24 , H01L23/29 , H05K1/03
CPC分类号： C07D303/24 , C07C39/21 , C07C39/215 , C08G59/245 , H01L23/293 , H01L2924/0002 , H05K1/0326
摘要： The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.
摘要翻译：具有两个不同芳基的二苯乙烯环氧树脂和包含该二苯乙烯环氧树脂的环氧树脂混合物具有比具有两个相同芳基的二苯乙烯环氧树脂和后者二苯乙烯环氧树脂的环氧树脂混合物的熔点低的熔点。与常规树脂相比，本发明的树脂或树脂混合物具有改进的加工和成型性能，缩短了成型和加工过程所需的时间，从而产生经济上的优点和对生产率的优选影响。本发明的环氧树脂或树脂混合物优选用作粘合剂，涂料，绝缘材料，层压片材的电气或电子材料等。它特别适用于封装电子部件的材料。

4. 发明授权

US5705596A Epoxy resin and process for producing the same 失效
标题翻译：环氧树脂及其制造方法
公开(公告)号：US5705596A
公开(公告)日：1998-01-06
申请号：US657363
申请日：1996-06-03
申请人： Akira Yokota , Yasuhiro Hirano , Masatsugu Akiba , Hiroshi Nakamura , Shigeki Naitoh
发明人： Akira Yokota , Yasuhiro Hirano , Masatsugu Akiba , Hiroshi Nakamura , Shigeki Naitoh
IPC分类号： C07D303/24 , C08G59/06 , C08G59/24
CPC分类号： C08G59/063 , C07D303/24 , C08G59/245
摘要： The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.
摘要翻译：本发明提供了一种具有比迄今已知的反茋系环氧树脂更低的熔点和更低的粘度的顺式 - 二苯乙烯型环氧树脂。二苯乙烯型环氧树脂的顺式异构体含量基本上为100％，或者替代地，至少约10％，其余为反式异构体，并且基于以下通式（1）：（1）其中R1至R8独立地为非环状或环状烷基，氢原子或卤素原子。还公开了这些环氧树脂的生产方法。

5. 发明授权

US5939509A Epoxy resin, resin composition, and resin-encapsulated semiconductor device 失效
标题翻译：环氧树脂，树脂组合物和树脂封装的半导体器件
公开(公告)号：US5939509A
公开(公告)日：1999-08-17
申请号：US879600
申请日：1997-06-20
申请人： Yasuhiro Hirano , Masatsugu Akiba , Akira Yokota , Hiroshi Nakamura , Shigeki Naitoh
发明人： Yasuhiro Hirano , Masatsugu Akiba , Akira Yokota , Hiroshi Nakamura , Shigeki Naitoh
IPC分类号： C07C39/21 , C07C39/215 , C07D301/28 , C07D303/23 , C07D303/24 , C08G59/24 , H01L23/29 , H05K1/03 , C08G59/16
CPC分类号： C07D303/24 , C07C39/21 , C07C39/215 , C08G59/245 , H01L23/293 , H01L2924/0002 , H05K1/0326
摘要： The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which. shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.
摘要翻译：具有两个不同芳基的二苯乙烯环氧树脂和包含该二苯乙烯环氧树脂的环氧树脂混合物具有比具有两个相同芳基的二苯乙烯环氧树脂和后者二苯乙烯环氧树脂的环氧树脂混合物的熔点低的熔点。与常规树脂相比，本发明的树脂或树脂混合物具有改进的加工和成型性能。缩短了成型和加工过程所需的时间，从而带来经济优势和对生产率的优选影响。本发明的环氧树脂或树脂混合物优选用作粘合剂，涂料，绝缘材料，层压片材的电气或电子材料等。它特别适用于封装电子部件的材料。

6. 发明授权

US07734547B2 Display control apparatus, display control method, and storage medium storing display control program 失效
标题翻译：显示控制装置，显示控制方法和存储显示控制程序的存储介质
公开(公告)号：US07734547B2
公开(公告)日：2010-06-08
申请号：US11354953
申请日：2006-02-16
申请人： Yasuhiro Hirano
发明人： Yasuhiro Hirano
IPC分类号： G06F21/00
CPC分类号： G06Q99/00 , G06Q20/3674 , G06Q20/382
摘要： A display control apparatus for controlling display of a document on a display part, includes an acquiring section that acquires authentication information associated with a user entering a predefined area, a deciding section that decides whether or not the authentication information acquired by the acquiring section satisfies a display authorization condition associated with the document, and a limiting section that limits display of the document on the display part when the deciding section decides that the authentication information does not satisfy the display authorization condition.
摘要翻译：一种显示控制装置，用于控制显示部件上的文档的显示，所述显示控制装置包括：获取部，其获取与进入预定区域的用户相关联的认证信息;判定部，判定由所述获取部获取的认证信息是否满足显示与所述文档相关联的授权条件;以及限制部，其在所述判定部判定出所述认证信息不满足所述显示授权条件时，限制所述文档在所述显示部上的显示。

7. 发明授权

US5498687A Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor 失效
标题翻译：含有脂环结构的不饱和酰亚胺化合物，其制备方法和中间体
公开(公告)号：US5498687A
公开(公告)日：1996-03-12
申请号：US411880
申请日：1995-03-28
申请人： Yasuhiro Hirano , Yasuhiro Endo , Kazuo Takebe , Mitsuhiro Shibata , Shuichi Kanagawa , Yutaka Shiomi , Masatsugu Akiba , Shinichiro Kitayama
发明人： Yasuhiro Hirano , Yasuhiro Endo , Kazuo Takebe , Mitsuhiro Shibata , Shuichi Kanagawa , Yutaka Shiomi , Masatsugu Akiba , Shinichiro Kitayama
IPC分类号： C07C205/38 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C08G59/18
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/12
摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.
摘要翻译：由式（1）表示的不饱和酰亚胺化合物：其中Q是含有4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

8. 发明授权

US5329047A Aromatic allyl amine thermosetting resin composition 失效
标题翻译：芳香烯丙胺热固性树脂组合物
公开(公告)号：US5329047A
公开(公告)日：1994-07-12
申请号：US806328
申请日：1991-12-13
申请人： Shigeki Naitoh , Yasuhisa Saito , Yasuhiro Hirano , Kazuo Takebe , Kunimasa Kamio , Youichi Ueda
发明人： Shigeki Naitoh , Yasuhisa Saito , Yasuhiro Hirano , Kazuo Takebe , Kunimasa Kamio , Youichi Ueda
IPC分类号： B32B15/08 , C08G73/12 , H05K1/03 , C07C217/90
CPC分类号： C08G73/121 , B32B15/08 , H05K1/0346
摘要： A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.
摘要翻译：提供了一种用于覆铜层压板的热固性树脂组合物，其包含（A）由下式表示的芳族二胺化合物：其中Ar为二价芳族残基，R1，R2，R3和R4各自为烯丙基或氢原子，但其中至少一个为烯丙基，（B）分子中具有2个以上马来酰亚胺基的聚马来酰亚胺化合物。

9. 发明授权

US5109087A Aromatic allyl amine thermosetting resin composition 失效
标题翻译：芳香聚氨酯热固性树脂组合物
公开(公告)号：US5109087A
公开(公告)日：1992-04-28
申请号：US464228
申请日：1990-01-12
申请人： Shigeki Naitoh , Yasuhisa Saito , Yasuhiro Hirano , Kazuo Takebe , Kunimasa Kamio , Youichi Ueda
发明人： Shigeki Naitoh , Yasuhisa Saito , Yasuhiro Hirano , Kazuo Takebe , Kunimasa Kamio , Youichi Ueda
IPC分类号： B32B15/08 , C08G73/12 , H05K1/03
CPC分类号： C08G73/121 , B32B15/08 , H05K1/0346
摘要： A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.

10. 发明授权

US5780145A Filler-containing resin composition suitable for injection molding and transfer molding 失效
标题翻译：适用于注射成型和传递成型的含填料的树脂组合物
公开(公告)号：US5780145A
公开(公告)日：1998-07-14
申请号：US885196
申请日：1997-06-30
申请人： Yasuhiro Hirano , Masatsugu Akiba , Yutaka Shiomi , Noriaki Saito
发明人： Yasuhiro Hirano , Masatsugu Akiba , Yutaka Shiomi , Noriaki Saito
IPC分类号： C08K7/18 , C08L71/10 , B23B5/16 , B23B27/26 , B23B27/38
CPC分类号： C08K7/18 , Y10S428/901 , Y10T428/25 , Y10T428/259 , Y10T428/31511 , Y10T428/31721
摘要： A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.
摘要翻译：一种成型树脂组合物，其在树脂中含有平均粒径不小于0.1μm且不大于1.5μm（x组分）的球状粉末的填料，其平均粒径不为球状粉末小于2μm，不大于15μm（y成分）和平均粒径不小于20μm且不大于70μm（z成分）的球状粉末，其中x，基于x，y和z成分的总体积的y和z成分不小于体积的10体积％且不大于24体积％，不小于体积的0.1体积％且不大于36体积％小于57体积％且不大于76体积％，即使在加载高比例填料时也具有优异的流动性。此外，由于固化物中存在的树脂本身，其固化物的吸湿性和热膨胀系数增加，其固化产物降低。此外，用树脂组合物密封的半导体封装具有高封装抗裂性。该树脂组合物适合用作半导体的密封材料，并且广泛适用于需要高填料填充量的其它用途。

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