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    • 9. 发明授权
    • Copper alloy sheet and QFN package
    • 铜合金板和QFN封装
    • US07928541B2
    • 2011-04-19
    • US12363974
    • 2009-02-02
    • Yosuke MiwaMasayasu NishimuraRyoichi OzakiShinya Katsura
    • Yosuke MiwaMasayasu NishimuraRyoichi OzakiShinya Katsura
    • H01L23/495
    • C22C9/00C22C9/02C22C9/04C22C9/06H01L2924/0002H01L2924/00
    • A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.
    • QFN封装具有通过加工含有0.01〜0.50质量%Fe,0.01〜0.20质量%P的铜合金板和作为其他成分的Cu和不可避免的杂质,微维氏硬度为150或者 或均匀伸长率在5%以下,局部伸长率在10%以下,或含有0.05〜2质量%的Ni,0.001〜0.3质量%的P,0.005〜5质量%的Zn, Cu和不可避免的杂质作为其他组分,其微维氏硬度为150以上,均匀伸长率为5%以下,局部伸长率为10%以下。 在QFN封装切割过程中形成的引脚毛刺很短,用于切割QFN封装的切割刀片以较低的磨损率磨损。