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1. 发明授权

US09845521B2 Copper alloy 有权
公开(公告)号：US09845521B2
公开(公告)日：2017-12-19
申请号：US13299828
申请日：2011-11-18
申请人： Hisao Shishido , Shinya Katsura , Yasuhiro Aruga , Katsushi Matsumoto
发明人： Hisao Shishido , Shinya Katsura , Yasuhiro Aruga , Katsushi Matsumoto
IPC分类号： C22C9/06 , C22C9/02 , C22F1/08 , H01B1/02 , C22C1/02 , H05K1/09
CPC分类号： C22C9/06 , C22C1/02 , C22F1/08 , H01B1/026 , H05K1/09
摘要： A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 μm; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%.

2. 发明授权

US07928541B2 Copper alloy sheet and QFN package 有权
标题翻译：铜合金板和QFN封装
公开(公告)号：US07928541B2
公开(公告)日：2011-04-19
申请号：US12363974
申请日：2009-02-02
申请人： Yosuke Miwa , Masayasu Nishimura , Ryoichi Ozaki , Shinya Katsura
发明人： Yosuke Miwa , Masayasu Nishimura , Ryoichi Ozaki , Shinya Katsura
IPC分类号： H01L23/495
CPC分类号： C22C9/00 , C22C9/02 , C22C9/04 , C22C9/06 , H01L2924/0002 , H01L2924/00
摘要： A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.
摘要翻译： QFN封装具有通过加工含有0.01〜0.50质量％Fe，0.01〜0.20质量％P的铜合金板和作为其他成分的Cu和不可避免的杂质，微维氏硬度为150或者或均匀伸长率在5％以下，局部伸长率在10％以下，或含有0.05〜2质量％的Ni，0.001〜0.3质量％的P，0.005〜5质量％的Zn， Cu和不可避免的杂质作为其他组分，其微维氏硬度为150以上，均匀伸长率为5％以下，局部伸长率为10％以下。在QFN封装切割过程中形成的引脚毛刺很短，用于切割QFN封装的切割刀片以较低的磨损率磨损。

3. 发明申请

US20120148439A1 COPPER ALLOY 有权
标题翻译：铜合金
公开(公告)号：US20120148439A1
公开(公告)日：2012-06-14
申请号：US13299828
申请日：2011-11-18
申请人： Hisao SHISHIDO , Shinya Katsura , Yasuhiro Aruga , Katsushi Matsumoto
发明人： Hisao SHISHIDO , Shinya Katsura , Yasuhiro Aruga , Katsushi Matsumoto
IPC分类号： C22C9/06 , C22C9/04
CPC分类号： C22C9/06 , C22C1/02 , C22F1/08 , H01B1/026 , H05K1/09
摘要： A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 μm; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%.
摘要翻译：含有Ni：1.5％〜3.6％，Si：0.3％〜1.0％的铜合金，其余由铜和不可避免的杂质组成，其中：铜合金中晶粒的平均晶粒尺寸为 5〜30μm; 晶粒尺寸不小于平均晶粒尺寸的两倍的晶粒的面积比不小于3％; 并且立方取向晶粒面积与晶粒尺寸不小于平均晶粒尺寸的两倍的晶粒面积的比率不小于50％。

4. 发明授权

US09514856B2 Copper alloy 有权
标题翻译：铜合金
公开(公告)号：US09514856B2
公开(公告)日：2016-12-06
申请号：US14127724
申请日：2011-08-04
申请人： Hisao Shishido , Yasuhiro Aruga , Shinya Katsura , Katsushi Matsumoto
发明人： Hisao Shishido , Yasuhiro Aruga , Shinya Katsura , Katsushi Matsumoto
IPC分类号： C22C9/00 , C22C9/02 , C22C9/06 , H01B1/02 , C22C1/10 , C22C9/04 , C22F1/00 , C22F1/08
CPC分类号： H01B1/026 , C22C1/10 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/06 , C22F1/00 , C22F1/08
摘要： Disclosed is a copper alloy containing 1.0% to 3.6% of Ni, 0.2% to 1.0% of Si, 0.05% to 3.0% of Sn, 0.05% to 3.0% of Zn, with the remainder including copper and inevitable impurities. The copper alloy has an average grain size of 25 μm or less and has a texture having an average area percentage of cube orientation of 20% to 60% and an average total area percentage of brass orientation, S orientation and copper orientation of 20% to 50%. The copper alloy has a KAM value of 0.8 to 3.0 and does not suffer from cracking even when subjected to U-bending. The copper alloy has excellent balance between strengths (particularly yield strength in a direction perpendicular to the rolling direction) and bending workability.
摘要翻译：公开了含有1.0％至3.6％的Ni，0.2％至1.0％的Si，0.05％至3.0％的Sn，0.05％至3.0％的Zn，其余包括铜和不可避免的杂质的铜合金。铜合金的平均粒径为25μm以下，具有立方取向平均面积百分比为20〜60％，黄铜取向，S取向和铜取向的平均面积百分比为20％〜 50％。铜合金的KAM值为0.8〜3.0，即使经受U形弯曲也不会发生龟裂。铜合金在强度（特别是与轧制方向垂直的方向上的屈服强度）和弯曲加工性之间具有优异的平衡。

5. 发明申请

US20090224379A1 COPPER ALLOY SHEET AND QFN PACKAGE 有权
标题翻译：铜合金板和QFN封装
公开(公告)号：US20090224379A1
公开(公告)日：2009-09-10
申请号：US12363974
申请日：2009-02-02
申请人： Yosuke MIWA , Masayasu Nishimura , Ryoichi Ozaki , Shinya Katsura
发明人： Yosuke MIWA , Masayasu Nishimura , Ryoichi Ozaki , Shinya Katsura
IPC分类号： H01L23/52 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/05 , C22C9/01 , C22C9/06
CPC分类号： C22C9/00 , C22C9/02 , C22C9/04 , C22C9/06 , H01L2924/0002 , H01L2924/00
摘要： A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.
摘要翻译： QFN封装具有通过加工含有0.01〜0.50质量％Fe，0.01〜0.20质量％P的铜合金板和作为其他成分的Cu和不可避免的杂质，微维氏硬度为150或者或均匀伸长率在5％以下，局部伸长率在10％以下，或含有0.05〜2质量％的Ni，0.001〜0.3质量％的P，0.005〜5质量％的Zn， Cu和不可避免的杂质作为其他组分，其微维氏硬度为150以上，均匀伸长率为5％以下，局部伸长率为10％以下。在QFN封装切割过程中形成的引脚毛刺很短，用于切割QFN封装的切割刀片以较低的磨损率磨损。

6. 发明申请

US20140193293A1 COPPER ALLOY 有权
标题翻译：铜合金
公开(公告)号：US20140193293A1
公开(公告)日：2014-07-10
申请号：US14127724
申请日：2011-08-04
申请人： Hisao Shishido , Yasuhiro Aruga , Shinya Katsura , Katsushi Matsumoto
发明人： Hisao Shishido , Yasuhiro Aruga , Shinya Katsura , Katsushi Matsumoto
IPC分类号： H01B1/02
CPC分类号： H01B1/026 , C22C1/10 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/06 , C22F1/00 , C22F1/08
摘要： Disclosed is a copper alloy containing 1.0% to 3.6% of Ni, 0.2% to 1.0% of Si, 0.05% to 3.0% of Sn, 0.05% to 3.0% of Zn, with the remainder including copper and inevitable impurities. The copper alloy has an average grain size of 25 pm or less and has a texture having an average area percentage of cube orientation of 20% to 60% and an average total area percentage of brass orientation, S orientation and copper orientation of 20% to 50%. The copper alloy has a KAM value of 0.8 to 3.0 and does not suffer from cracking even when subjected to U-bending. The copper alloy has excellent balance between strengths (particularly yield strength in a direction perpendicular to the rolling direction) and bending workability.
摘要翻译：公开了含有1.0％至3.6％的Ni，0.2％至1.0％的Si，0.05％至3.0％的Sn，0.05％至3.0％的Zn，其余包括铜和不可避免的杂质的铜合金。铜合金的平均粒径为25μm以下，具有立方取向平均面积百分比为20〜60％，黄铜取向，S取向和铜取向的平均面积百分比为20％〜 50％。铜合金的KAM值为0.8〜3.0，即使经受U形弯曲也不会发生龟裂。铜合金在强度（特别是与轧制方向垂直的方向上的屈服强度）和弯曲加工性之间具有优异的平衡。

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