基本信息:
- 专利标题： COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PARTS
- 申请号：US13283012 申请日：2011-10-27
- 公开(公告)号：US20120039743A1 公开(公告)日：2012-02-16
- 发明人： Yasuhiro ARUGA , Ryoichi Ozaki , Yosuke Miwa
- 申请人： Yasuhiro ARUGA , Ryoichi Ozaki , Yosuke Miwa
- 申请人地址： JP Kobe-shi
- 专利权人： Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- 当前专利权人： Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- 当前专利权人地址： JP Kobe-shi
- 优先权： JP2006-270918 20061002; JP2006-274309 20061005; JP2006-311899 20061117; JP2006-311900 20061117
- 主分类号： C22C9/02
- IPC分类号： C22C9/02 ; C22C9/00 ; C22C9/04
摘要：
A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.