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1. 发明申请

US20110124382A1 MOBILE PHONE 审中-公开
标题翻译：移动电话
公开(公告)号：US20110124382A1
公开(公告)日：2011-05-26
申请号：US12755764
申请日：2010-04-07
申请人： Woon-Chun Kim , Soon-Gyu Yim , Won-Tae Choi
发明人： Woon-Chun Kim , Soon-Gyu Yim , Won-Tae Choi
IPC分类号： H04B1/38 , H01L31/00
CPC分类号： H04M19/08 , G06F1/1656 , G06F1/181 , H01G9/2031 , H01G9/2059 , H01G9/2068 , H04B1/3833 , Y02E10/542 , Y02P70/521
摘要： Disclosed is a mobile phone that includes a body having a base layer formed on one surface thereof and a dye-sensitized solar cell mounted on one surface of the body to face the base layer and providing electricity to the body. The dye-sensitized solar cell includes a first transparent substrate, a first electrode, a second electrode, a light absorption layer, a catalytic layer, an electrolyte and a second substrate, and the base layer forms a background against a pattern formed by a dye such that the pattern can be identified when viewed from the outside.
摘要翻译：公开了一种移动电话，其包括具有在其一个表面上形成的基底层的主体和安装在主体的一个表面上以面向基底层并且向身体提供电力的染料敏化太阳能电池。染料敏化太阳能电池包括第一透明基板，第一电极，第二电极，光吸收层，催化层，电解质和第二基板，并且基层与由染料形成的图案形成背景使得当从外部观察时可以识别图案。

2. 发明申请

US20110061707A1 DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME 审中-公开
标题翻译：透明的太阳能电池和包括它的移动装置
公开(公告)号：US20110061707A1
公开(公告)日：2011-03-17
申请号：US12650198
申请日：2009-12-30
申请人： Woon-Chun KIM , Hyun-Seop Shim , Soon-Gyu Yim
发明人： Woon-Chun KIM , Hyun-Seop Shim , Soon-Gyu Yim
IPC分类号： H01L31/042
CPC分类号： H01G9/2068 , H01G9/2031 , H01G9/2059 , H01L51/0028 , Y02E10/542 , Y02E10/549 , Y02P70/521
摘要： A dye-sensitized solar cell and a mobile device including the same are disclosed. The dye-sensitized solar cell includes a first transparent substrate, which allows sunlight incident to pass through, a second substrate, which is formed apart from the first substrate, and a plurality of cells, which includes a first electrode, a second electrode, a light absorption layer and an electrolyte. Here, the first electrode and the second electrode are interposed between the first substrate and the second substrate, the first electrode is disposed on a rear surface of the first substrate, the second electrode is disposed on a front surface of the second substrate, the light absorption layer is interposed between the first electrode and the second electrode and includes metal oxide and a dye absorbed in the metal oxide, and the electrolyte is interposed between the first electrode and the second electrode.
摘要翻译：公开了一种染料敏化太阳能电池及其制造方法。染料敏化太阳能电池包括允许阳光入射通过的第一透明基板，与第一基板分开形成的第二基板，以及多个单元，其包括第一电极，第二电极，光吸收层和电解质。这里，第一电极和第二电极介于第一基板和第二基板之间，第一电极设置在第一基板的后表面上，第二电极设置在第二基板的前表面上，光吸收层插入在第一电极和第二电极之间，并且包括金属氧化物和吸收在金属氧化物中的染料，并且电解质介于第一电极和第二电极之间。

3. 发明申请

US20100101847A1 ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子元件嵌入式印刷电路板及其制造方法
公开(公告)号：US20100101847A1
公开(公告)日：2010-04-29
申请号：US12416472
申请日：2009-04-01
申请人： Woon-Chun KIM , Soon-Gyu Yim
发明人： Woon-Chun KIM , Soon-Gyu Yim
IPC分类号： H05K1/02 , H05K3/30
CPC分类号： H05K1/186 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H05K3/061 , H05K3/323 , H05K3/4652 , H05K2201/0367 , H05K2201/10674 , H05K2203/0152 , H05K2203/0376 , H05K2203/063 , H05K2203/1469 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49142 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.
摘要翻译：公开了一种具有电子部件嵌入式印刷电路板的印刷电路板及其制造方法。根据本发明的实施例，制造具有在其一个表面上形成有凹槽的嵌入式电子部件和形成在凹槽内的电极的印刷电路板的制造方法包括：在第一电极的一个表面上形成第一电路图案金属层将第一金属层压在第一绝缘体上; 通过选择性地蚀刻第一金属层的另一个表面来形成第一导电突起; 以及通过设置导电粘合剂层来安装第一电子部件，使得第一电子部件的电极和第一导电突起彼此电连接。因此，可以容易且可靠地安装不具有向外突出的电极的电子部件，并且可以缩短制造时间。

4. 发明申请

US20100142116A1 CAPACITOR 审中-公开
标题翻译：电容器
公开(公告)号：US20100142116A1
公开(公告)日：2010-06-10
申请号：US12482104
申请日：2009-06-10
申请人： Woon-Chun KIM , Sung Yi , Soon-Gyu Yim
发明人： Woon-Chun KIM , Sung Yi , Soon-Gyu Yim
IPC分类号： H01G4/255 , H01G4/06
CPC分类号： H01G4/206 , H01G4/255
摘要： A capacitor is disclosed. The capacitor in accordance with an embodiment of the present invention includes a first electrode, a dielectric substance, which is formed on the first electrode, a second electrode, which is formed on the dielectric substance, and a magnetic layer, which is interposed between the dielectric substance and at least one of the first electrode and the second electrode. In accordance with the present embodiment, dielectric loss can be reduced while minimizing the reduction of capacitance of the capacitor.
摘要翻译：公开了一种电容器。根据本发明的实施例的电容器包括形成在第一电极上的第一电极，电介质，形成在电介质上的第二电极和介于物质之间的磁性层，电介质物质和第一电极和第二电极中的至少一个。根据本实施例，可以减小电容器的电容的减小同时减小介质损耗。

5. 发明申请

US20100140100A1 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板的制造方法
公开(公告)号：US20100140100A1
公开(公告)日：2010-06-10
申请号：US12482122
申请日：2009-06-10
申请人： Woon-Chun KIM , Soon-Gyu Yim , Young-Ju Kim , Hwa-Jan Jung
发明人： Woon-Chun KIM , Soon-Gyu Yim , Young-Ju Kim , Hwa-Jan Jung
IPC分类号： H05K3/10 , C25D5/02
CPC分类号： H05K3/205 , H05K3/108 , H05K2201/0376 , H05K2203/1152 , H05K2203/1536
摘要： Disclosed is a method of manufacturing a printed circuit board. The method can include providing a carrier formed with a release layer, performing a roughening treatment on the release layer such that the release layer has surface roughness, forming a circuit pattern on the release layer, stacking the carrier on an insulating layer such that the circuit pattern is buried in the insulating layer, and separating the release layer and the carrier from the insulating layer and the circuit pattern.
摘要翻译：公开了印刷电路板的制造方法。该方法可以包括提供形成有释放层的载体，对剥离层进行粗糙化处理，使得剥离层具有表面粗糙度，在剥离层上形成电路图案，将载体堆叠在绝缘层上，使得电路将图案掩埋在绝缘层中，并且将隔离层和载体与绝缘层和电路图案分离。

6. 发明授权

US08130508B2 Electronic component embedded printed circuit board and manufacturing method thereof 有权
标题翻译：电子元件嵌入式印刷电路板及其制造方法
公开(公告)号：US08130508B2
公开(公告)日：2012-03-06
申请号：US12416472
申请日：2009-04-01
申请人： Woon-Chun Kim , Soon-Gyu Yim
发明人： Woon-Chun Kim , Soon-Gyu Yim
IPC分类号： H05K1/14
CPC分类号： H05K1/186 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H05K3/061 , H05K3/323 , H05K3/4652 , H05K2201/0367 , H05K2201/10674 , H05K2203/0152 , H05K2203/0376 , H05K2203/063 , H05K2203/1469 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49142 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.
摘要翻译：公开了具有电子部件嵌入式印刷电路板的印刷电路板及其制造方法。根据本发明的实施例，制造具有在其一个表面上形成有凹槽的嵌入式电子部件和形成在凹槽内的电极的印刷电路板的制造方法包括：在第一电极的一个表面上形成第一电路图案金属层将第一金属层压在第一绝缘体上; 通过选择性地蚀刻第一金属层的另一个表面来形成第一导电突起; 以及通过设置导电粘合剂层来安装第一电子部件，使得第一电子部件的电极和第一导电突起彼此电连接。因此，可以容易且可靠地安装不具有向外突出的电极的电子部件，并且可以缩短制造时间。

7. 发明申请

US20100059881A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20100059881A1
公开(公告)日：2010-03-11
申请号：US12388217
申请日：2009-02-18
申请人： Woon-Chun Kim , Soon-Gyu Yim , Joon-Seok Kang
发明人： Woon-Chun Kim , Soon-Gyu Yim , Joon-Seok Kang
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/05 , H01L24/03 , H01L24/11 , H01L24/13 , H01L2224/03462 , H01L2224/0347 , H01L2224/0401 , H01L2224/05569 , H01L2224/05572 , H01L2224/1132 , H01L2224/11849 , H01L2224/131 , H01L2924/00013 , H01L2924/0002 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： A semiconductor package and a method of manufacturing the semiconductor package are disclosed. The semiconductor package in accordance with an embodiment of the present invention includes: a substrate, in which a conductive pattern formed on one surface of the substrate; an insulation layer, which is formed on one surface of the substrate, in which a through-hole is formed in the insulation layer such that the conductive pattern is exposed; a metal post, which is formed in the through-hole such that one end of the metal post is in contact with the conductive pattern and the other end of the metal post is protruded from the insulation layer; and a solder bump, which is formed on the other end of the metal post.
摘要翻译：公开了一种半导体封装和半导体封装的制造方法。根据本发明的实施例的半导体封装包括：衬底，其中形成在衬底的一个表面上的导电图案; 绝缘层，其形成在所述基板的一个表面上，在所述绝缘层中形成有通孔，使得所述导电图案露出; 金属柱，其形成在通孔中，使得金属柱的一端与导电图案接触，并且金属柱的另一端从绝缘层突出; 以及形成在金属柱的另一端上的焊料凸块。

8. 发明授权

US08409981B2 Semiconductor package with a metal post and manufacturing method thereof 有权
标题翻译：具有金属柱的半导体封装及其制造方法
公开(公告)号：US08409981B2
公开(公告)日：2013-04-02
申请号：US13409737
申请日：2012-03-01
申请人： Woon-Chun Kim , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
发明人： Woon-Chun Kim , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
IPC分类号： H01L21/4763
CPC分类号： H01L21/76898 , H01L23/3114 , H01L23/481 , H01L23/525 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/10 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/05548 , H01L2224/13 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/00
摘要： Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.
摘要翻译：公开了半导体封装及其制造方法。半导体封装可以包括半导体衬底，其上形成有导电焊盘的一个表面; 绝缘层，形成在所述半导体衬底的一个表面上; 穿过导电垫，半导体衬底和绝缘层的金属柱; 以及电连接到金属柱的外层电路。通过本发明，可以不需要形成用于电连接半导体基板的两个表面的附加通孔，从而简化制造工艺，降低制造成本，并提高耦合可靠性。

9. 发明授权

US08266792B2 Method of manufacturing a printed circuit board with an embedded electronic component 有权
标题翻译：制造具有嵌入式电子部件的印刷电路板的方法
公开(公告)号：US08266792B2
公开(公告)日：2012-09-18
申请号：US13362619
申请日：2012-01-31
申请人： Woon-Chun Kim , Soon-Gyu Yim
发明人： Woon-Chun Kim , Soon-Gyu Yim
IPC分类号： H05K3/20
CPC分类号： H05K1/186 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H05K3/061 , H05K3/323 , H05K3/4652 , H05K2201/0367 , H05K2201/10674 , H05K2203/0152 , H05K2203/0376 , H05K2203/063 , H05K2203/1469 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49142 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.
摘要翻译：公开了一种具有电子部件嵌入式印刷电路板的印刷电路板及其制造方法。根据本发明的实施例，制造具有在其一个表面上形成有凹槽的嵌入式电子部件和形成在凹槽内的电极的印刷电路板的制造方法包括：在第一电极的一个表面上形成第一电路图案金属层将第一金属层压在第一绝缘体上; 通过选择性地蚀刻第一金属层的另一个表面来形成第一导电突起; 以及通过设置导电粘合剂层来安装第一电子部件，使得第一电子部件的电极和第一导电突起彼此电连接。因此，可以容易且可靠地安装不具有向外突出的电极的电子部件，并且可以缩短制造时间。

10. 发明申请

US20120164825A1 SEMICONDUCTOR PACKAGE WITH A METAL POST AND MANUFACTURING METHOD THEREOF 有权
标题翻译：具有金属柱的半导体封装及其制造方法
公开(公告)号：US20120164825A1
公开(公告)日：2012-06-28
申请号：US13409737
申请日：2012-03-01
申请人： Woon-Chun KIM , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
发明人： Woon-Chun KIM , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
IPC分类号： H01L21/768
CPC分类号： H01L21/76898 , H01L23/3114 , H01L23/481 , H01L23/525 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/10 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/05548 , H01L2224/13 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/00
摘要： Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.
摘要翻译：公开了半导体封装及其制造方法。半导体封装可以包括半导体衬底，其上形成有导电焊盘的一个表面; 绝缘层，形成在所述半导体衬底的一个表面上; 穿过导电垫，半导体衬底和绝缘层的金属柱; 以及电连接到金属柱的外层电路。通过本发明，可以不需要形成用于电连接半导体基板的两个表面的附加通孔，从而简化制造工艺，降低制造成本，并提高耦合可靠性。

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