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1. 外观设计

USD730047S1 Holder 有权
公开(公告)号：USD730047S1
公开(公告)日：2015-05-26
申请号：US29471551
申请日：2013-11-01
申请人： Sung Yi
设计人： Sung Yi

2. 发明授权

US08911989B2 Microfluidic biochip 有权
标题翻译：微流体生物芯片
公开(公告)号：US08911989B2
公开(公告)日：2014-12-16
申请号：US12795445
申请日：2010-06-07
申请人： Gwo-Bin Lee , Sung-Yi Yang , Song-Bin Huang , Kang-Yi Lien , Chen-Hsun Weng
发明人： Gwo-Bin Lee , Sung-Yi Yang , Song-Bin Huang , Kang-Yi Lien , Chen-Hsun Weng
IPC分类号： C12M1/00 , C12P19/34 , B01L3/00 , B01F11/00 , B01F13/00 , F16K99/00 , B01L7/00
CPC分类号： F16K99/0001 , B01F11/0071 , B01F13/0059 , B01L3/50273 , B01L3/502738 , B01L7/52 , B01L2300/0819 , B01L2300/0867 , B01L2400/043 , B01L2400/049 , F16K99/0015 , F16K99/0059 , F16K2099/008 , F16K2099/0084 , Y10T137/0396
摘要： The present invention provides a microfluidic biochip, which comprises: a fluid transportation unit having a fluid transportation reservoir and a fluid transportation air chamber; a first fluid storage reservoir; a second fluid storage reservoir; a first valve unit having a first valve and a first valve control air chamber; and a second valve unit having a second valve and a second valve control air chamber; wherein the first valve unit is located between the first fluid storage reservoir and the fluid transportation unit, the second valve unit is located between the second fluid storage reservoir and the fluid transportation unit, and the top portion of the fluid transportation reservoir and the valves are made of a flexible material. The structure of the present microfluidic biochip allows fluids to be transported and/or mixed therein.
摘要翻译：本发明提供了一种微流体生物芯片，其包括：流体输送单元，其具有流体输送储存器和流体输送空气室; 第一流体储存容器; 第二流体储存容器; 第一阀单元，具有第一阀和第一阀控制空气室; 以及具有第二阀和第二阀控制空气室的第二阀单元; 其中所述第一阀单元位于所述第一流体储存容器和所述流体输送单元之间，所述第二阀单元位于所述第二流体储存容器和所述流体输送单元之间，并且所述流体输送储存器的顶部和所述阀为由柔性材料制成。本发明微流体生物芯片的结构允许流体在其中运输和/或混合。

3. 发明授权

US08893380B2 Method of manufacturing a chip embedded printed circuit board 有权
标题翻译：芯片嵌入式印刷电路板的制造方法
公开(公告)号：US08893380B2
公开(公告)日：2014-11-25
申请号：US12320492
申请日：2009-01-27
申请人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
发明人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
IPC分类号： H05K3/30 , H01L23/00 , H05K1/18 , H01L21/683 , H05K3/42
CPC分类号： H05K1/185 , H01L21/568 , H01L21/6835 , H01L24/18 , H01L24/19 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/18 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01078 , H05K3/426 , H05K2201/10515 , H05K2201/10674 , H05K2203/1461 , Y10T29/4913 , Y10T29/49146 , Y10T29/49165
摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having vias formed therethrough; a first chip and a second chip embedded in the insulating layer and having pads, which are respectively exposed to upper and lower surfaces of the insulating layer, on one surfaces thereof; an upper pattern formed on the upper surface of the insulating layer to be connected to the pads of the first chip and the vias; and a lower pattern formed on the lower surface of the insulating layer to be connected to the pads of the second chip and the vias. Also, the present invention provides a manufacturing method of a chip embedded printed circuit board.
摘要翻译：芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种芯片嵌入式印刷电路板及其制造方法，其特征在于，提供一种芯片嵌入式印刷电路基板，嵌入绝缘层中的第一芯片和第二芯片，并且在其一个表面上分别暴露于绝缘层的上表面和下表面的焊盘; 形成在绝缘层的上表面上以连接到第一芯片的焊盘和通孔的上部图案; 以及形成在绝缘层的下表面上以连接到第二芯片的焊盘和通孔的下图案。另外，本发明提供一种嵌入式芯片的印刷电路板的制造方法。

4. 发明授权

US08823910B2 Display panel, method of manufacturing the same and alignment mask for manufacturing the same 有权
标题翻译：显示面板及其制造方法及其制造方法
公开(公告)号：US08823910B2
公开(公告)日：2014-09-02
申请号：US13475287
申请日：2012-05-18
申请人： Jin-Soo Jung , Baek-Kyun Jeon , Jun-Woo Lee , Hyun-Ku Ahn , Yong-Hwan Shin , Byoung-Hun Sung , Sung-Yi Kim
发明人： Jin-Soo Jung , Baek-Kyun Jeon , Jun-Woo Lee , Hyun-Ku Ahn , Yong-Hwan Shin , Byoung-Hun Sung , Sung-Yi Kim
IPC分类号： G02F1/1337 , B32B3/02
CPC分类号： B32B3/02 , G02F1/1337 , G02F1/133753 , G02F1/133788 , G02F2001/133757 , G02F2001/133761 , Y10T428/24777
摘要： A display panel includes a lower substrate, an upper substrate and a liquid crystal layer. The liquid crystal layer includes a plurality of domains, a horizontal domain boundary texture area and a vertical domain boundary texture area. The domains are disposed in a matrix shape. The horizontal domain boundary texture area extends in a first direction in a boundary between the domains adjacent to each other in a second direction and has a slope of a liquid crystal slowly (e.g., less) inclined compared to that of the domains. The vertical domain boundary texture area extends in the second direction in a boundary between the domains adjacent to each other in the first direction and has a width larger than that of the horizontal domain boundary texture area.
摘要翻译：显示面板包括下基板，上基板和液晶层。液晶层包括多个域，水平域边界纹理区域和垂直域边界纹理区域。这些区域以矩阵形状设置。水平域边界纹理区域在第二方向上彼此相邻的畴之间的边界中沿第一方向延伸，并且与畴的缓冲（例如，较少）倾斜的液晶的斜率倾斜。垂直域边界纹理区域在第二方向上在第一方向上彼此相邻的区域之间的边界中延伸，并且具有比水平域边界纹理区域的宽度更大的宽度。

5. 发明授权

US08779580B2 Electronic component package and manufacturing method thereof 有权
标题翻译：电子元件封装及其制造方法
公开(公告)号：US08779580B2
公开(公告)日：2014-07-15
申请号：US12010321
申请日：2008-01-23
申请人： Joon-Seok Kang , Sung Yi , Jae-Cheon Doh , Do-Jae Yoo , Sun-Kyong Kim , Jong-Hwan Baek
发明人： Joon-Seok Kang , Sung Yi , Jae-Cheon Doh , Do-Jae Yoo , Sun-Kyong Kim , Jong-Hwan Baek
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H05K1/0203 , H01L21/50 , H01L23/3675 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24227 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01078 , H01L2924/15153 , H01L2924/1517 , H05K2201/066 , Y10T29/49146
摘要： An electronic component package and a manufacturing method thereof are disclosed. The electronic component package manufacturing method, which includes mounting an electronic component in one surface of a first insulation layer; bonding a heat sink to the one surface of the first insulation layer, corresponding to the electronic component, to cover the electronic component, the heat sink being formed with a cavity; charging the cavity with an adhesive; and forming a circuit pattern in the other surface of the first insulation layer, can prevent a void from being generated in the adhesive, make the handling stable and make the size small by allowing the heat sink formed with the cavity to cover the electronic component before the pattern build-up and supplying the adhesive through one side of the cavity while providing negative pressure through the other side.
摘要翻译：公开了一种电子部件封装及其制造方法。电子部件封装制造方法，其包括将电子部件安装在第一绝缘层的一个表面中; 将散热器与对应于电子部件的第一绝缘层的一个表面接合以覆盖电子部件，散热器形成有空腔; 用粘合剂填充空腔; 并且在第一绝缘层的另一个表面上形成电路图案，可以防止在粘合剂中产生空隙，使得处理稳定并且通过使形成有空腔的散热器覆盖电子元件的尺寸变小，图案积聚并通过腔的一侧供应粘合剂，同时通过另一侧提供负压。

6. 发明授权

US08552305B2 Electronic component-embedded printed circuit board 有权
标题翻译：电子元件嵌入式印刷电路板
公开(公告)号：US08552305B2
公开(公告)日：2013-10-08
申请号：US12491043
申请日：2009-06-24
申请人： Jin Seon Park , Sung Yi , Jung Won Lee
发明人： Jin Seon Park , Sung Yi , Jung Won Lee
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01L21/568 , H01L21/6835 , H01L23/49894 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2221/68345 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/07811 , H01L2924/3511 , H05K3/321 , H05K2201/0191 , H05K2201/0195 , H05K2201/0355 , H05K2201/10674 , H05K2203/063 , H05K2203/1469 , H01L2924/00
摘要： Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same.
摘要翻译：这里公开了一种电子部件嵌入式印刷电路板，包括：基板，包括绝缘树脂层和电路层; 以及埋设在所述绝缘树脂层中的电子部件，所述绝缘树脂层的厚度为所述电子部件的厚度的1.3〜3倍。电子元件嵌入式印刷电路板具有其成分的最佳厚度比，以便使其制造时的翘曲最小化。

7. 发明申请

US20120037937A1 LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译： LED封装结构及其制造方法
公开(公告)号：US20120037937A1
公开(公告)日：2012-02-16
申请号：US12987296
申请日：2011-01-10
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H01L33/56
CPC分类号： H01L33/642 , H01L33/486 , H01L33/54 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
摘要： An LED package structure includes a substrate unit, a conductive unit, a heat-dissipating unit, a light-emitting unit and a package unit. The substrate unit includes an insulating substrate. The conductive unit includes two top conductive pads disposed on top surface of the insulating substrate, two bottom conductive pads disposed on bottom surface of the insulating substrate, and a plurality of penetrating conductive posts passing the insulating substrate. The two top conducive pads respectively electrically connect the two bottom conductive pads through the penetrating conductive posts. The heat-dissipating unit includes a top heat-dissipating block and a bottom heat-dissipating block respectively disposed on top and bottom surfaces of the insulating substrate. The light-emitting unit includes a light-emitting element on the top heat-dissipating block and electrically connected between the two top conductive pads. The package unit includes a package resin on the conductive unit and the heat-dissipating unit to cover the light-emitting element.
摘要翻译： LED封装结构包括基板单元，导电单元，散热单元，发光单元和封装单元。基板单元包括绝缘基板。导电单元包括设置在绝缘基板的顶表面上的两个顶部导电焊盘，设置在绝缘基板的底表面上的两个底部导电焊盘以及穿过绝缘基板的多个穿透导电柱。两个顶部导电垫分别通过穿透导电柱电连接两个底部导电焊盘。散热单元包括顶部散热块和分别设置在绝缘基板的顶表面和底表面上的底部散热块。发光单元包括顶部散热块上的发光元件，并电连接在两个顶部导电焊盘之间。封装单元包括导电单元上的封装树脂和覆盖发光元件的散热单元。

8. 外观设计

USD645421S1 LED base 有权
标题翻译： LED底座
公开(公告)号：USD645421S1
公开(公告)日：2011-09-20
申请号：US29383417
申请日：2011-01-18
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
设计人： Bily Wang , Sung-Yi Hsiao , Jack Chen

9. 外观设计

USD641666S1 Automobile 有权
公开(公告)号：USD641666S1
公开(公告)日：2011-07-19
申请号：US29383162
申请日：2011-01-13
申请人： Jin-Sung Yi
设计人： Jin-Sung Yi

10. 发明申请

US20110155436A1 CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY USING A TWO-SIDED CUT APPROACH AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有通过使用双面切割方法形成的导电通道的导电基板结构及其制造方法
公开(公告)号：US20110155436A1
公开(公告)日：2011-06-30
申请号：US12649824
申请日：2009-12-30
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H05K1/11 , B26D3/00
CPC分类号： B26D3/06 , H05K3/0044 , H05K3/0052 , H05K3/107 , H05K3/403 , Y10T29/49155 , Y10T29/49156 , Y10T83/0524
摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.
摘要翻译：导电基板结构包括基板单元，导电焊盘单元和导电层单元。基板单元具有顶表面，底表面，两个相对的侧表面和前表面。导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层到两个第二导电焊盘的两个相对的侧面。两个第一导电层分别与两个第二导电层电连接。

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