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    • 7. 发明授权
    • Electrically erasable, directly overwritable, multibit single cell
memory elements and arrays fabricated therefrom
    • 电可擦除的直接可重写的多单元单元存储元件和由其制造的阵列
    • US5534711A
    • 1996-07-09
    • US423484
    • 1995-04-19
    • Stanford R. OvshinskyDavid A. StrandWolodymyr CzubatyjPatrick Klersy
    • Stanford R. OvshinskyDavid A. StrandWolodymyr CzubatyjPatrick Klersy
    • G11C11/56G11C16/02H01L27/24H01L45/00
    • G11C13/0004G11C11/56G11C11/5678H01L27/2409H01L27/2463H01L45/06H01L45/12H01L45/1233H01L45/144G11C13/04G11C2213/72
    • The present invention comprises an electrically operated, directly overwritable, multibit, single-cell memory element. The memory element includes a volume of memory material which defines the single cell memory element. The memory material is characterized by: (1) a large dynamic range of electrical resistance values; and (2) the ability to be set at one of a plurality of resistance values within said dynamic range in response to selected electrical input signals so as to provide said single cell with multibit storage capabilities. The memory element also includes a pair of spacedly disposed contacts for supplying the electrical input signal to set the memory material to a selected resistance value within the dynamic range. At least a filamentary portion of the singIe cell memory element being setable, by the selected electrical signal to any resistance value in said dynamic range, regardless of the previous resistance value of said material. The memory element further includes a filamentary portion controlling means disposed between the volume of memory material and at least one of the spacedly disposed contacts. The controlling means defining the size and position of the filamentary portion during electrical formation of the memory element and limiting the size and confining the location of the filamentary portion during use of the memory element, thereby providing for a high current density within the filamentary portion of the single cell memory element upon input of a very low total current electrical signal to the spacedly disposed contacts.
    • 本发明包括电操作的直接覆盖的多位单个单元存储元件。 存储元件包括限定单个单元存储元件的一定量的存储器材料。 记忆材料的特征在于:(1)电阻值的大动态范围; 以及(2)响应于所选择的电输入信号在所述动态范围内被设置为多个电阻值之一的能力,以便向所述单个单元提供多位存储能力。 存储元件还包括一对间隔设置的触点,用于提供电输入信号以将存储器材料设置在动态范围内的所选电阻值。 所述单元存储元件的至少一个细长部分可通过所选择的电信号被设置成所述动态范围内的任何电阻值,而与所述材料的先前电阻值无关。 存储元件还包括设置在存储器材料体积与间隔设置的触点中的至少一个之间的丝状部分控制装置。 控制装置在存储元件的电气形成期间限定丝状部分的尺寸和位置,并且在存储元件的使用期间限制尺寸并限制丝状部分的位置,由此提供丝网部分内的高电流密度 当输入非常低的总电流电信号到间隔布置的触点时,单个单元存储元件。
    • 8. 发明申请
    • Plasma Deposition of Amorphous Semiconductors at Microwave Frequencies
    • 微波频率下非晶半导体的等离子体沉积
    • US20120115274A1
    • 2012-05-10
    • US13355541
    • 2012-01-22
    • Stanford R OvshinskyDavid StrandPatrick KlersyBoil Pashmakov
    • Stanford R OvshinskyDavid StrandPatrick KlersyBoil Pashmakov
    • H01L31/18
    • C23C16/511C23C16/24C23C16/545H01L21/02425H01L21/02532H01L21/02592H01L21/0262
    • Apparatus and method for plasma deposition of thin film photovoltaic materials at microwave frequencies. The apparatus inhibits deposition on windows or other microwave transmission elements that couple microwave energy to deposition species. The apparatus includes a microwave applicator with conduits passing therethrough that carry deposition species. The applicator transfers microwave energy to the deposition species to transform them to a reactive state conducive to formation of a thin film material. The conduits physically isolate deposition species that would react to form a thin film material at the point of microwave power transfer. The deposition species are separately energized and swept away from the point of power transfer to prevent thin film deposition. The invention allows for the ultrafast formation of silicon-containing amorphous semiconductors that exhibit high mobility, low porosity, little or no Staebler-Wronski degradation, and low defect concentration.
    • 微波等离子体沉积薄膜光伏材料的设备和方法。 该装置抑制在将微波能量耦合到沉积物质的窗口或其它微波传输元件上的沉积。 该装置包括带有通过其的导管的微波施加器,其携带沉积物质。 施加器将微波能量传递到沉积物质以将它们转变成有助于形成薄膜材料的反应状态。 导管物理隔离在微波功率传递点反应以形成薄膜材料的沉积物质。 沉积物质分开通电并从功率传递点扫除,以防止薄膜沉积。 本发明允许超快速地形成显示高迁移率,低孔隙率,很少或没有Staebler-Wronski降解和低缺陷浓度的含硅非晶半导体。
    • 9. 发明申请
    • PLASMA DEPOSITION OF AMORPHOUS SEMICONDUCTORS AT MICROWAVE FREQUENCIES
    • 在微波频率下等离子体沉积非晶半导体
    • US20120040493A1
    • 2012-02-16
    • US12855645
    • 2010-08-12
    • Stanford R. OvshinskyDavid StrandPatrick KlersyBoil Pashmakov
    • Stanford R. OvshinskyDavid StrandPatrick KlersyBoil Pashmakov
    • H01L31/18
    • C23C16/511C23C16/24C23C16/545H01L21/02425H01L21/02532H01L21/02592H01L21/0262
    • Apparatus and method for plasma deposition of thin film photovoltaic materials at microwave frequencies. The apparatus avoids deposition on windows or other microwave transmission elements that couple microwave energy to deposition species. The apparatus includes a microwave applicator with conduits passing therethrough that carry deposition species. The applicator transfers microwave energy to the deposition species to transform them to a reactive state conducive to formation of a thin film material. The conduits physically isolate deposition species that would react to form a thin film material at the point of microwave power transfer. The deposition species are separately energized and swept away from the point of power transfer to prevent thin film deposition. The invention allows for the ultrafast formation of silicon-containing amorphous semiconductors that exhibit high mobility, low porosity, little or no Staebler-Wronski degradation, and low defect concentration.
    • 微波等离子体沉积薄膜光伏材料的设备和方法。 该装置避免了将微波能量耦合到沉积物质的窗户或其他微波传输元件上的沉积。 该装置包括带有通过其的导管的微波施加器,其携带沉积物质。 施加器将微波能量传递到沉积物质以将它们转变成有助于形成薄膜材料的反应状态。 导管物理隔离在微波功率传递点反应以形成薄膜材料的沉积物质。 沉积物质分开通电并从功率传递点扫除,以防止薄膜沉积。 本发明允许超快速地形成显示高迁移率,低孔隙率,很少或没有Staebler-Wronski降解和低缺陷浓度的含硅非晶半导体。