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1. 发明授权

US08146902B2 Hybrid composite wafer carrier for wet clean equipment 失效
标题翻译：用于湿式清洁设备的混合复合晶片载体
公开(公告)号：US08146902B2
公开(公告)日：2012-04-03
申请号：US11743516
申请日：2007-05-02
申请人： Wing Lau Cheng , Helen Cheng, legal representative , Arnold Kholodenko
发明人： Wing Lau Cheng , Arnold Kholodenko
IPC分类号： B23Q3/00
CPC分类号： B32B5/26 , B32B5/28 , B32B27/04 , H01L21/67051 , H01L21/67346 , H01L21/67748 , H01L21/68764 , Y10S269/90 , Y10S269/901 , Y10T428/237 , Y10T428/24995 , Y10T428/31515
摘要： A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.
摘要翻译：描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。载体包括具有开口尺寸的接收基板的框架和用于在开口内支撑基板的多个支撑销，该开口略大于基板，使得基板和开口之间存在间隙。框架包括复合芯，顶片，底片，顶片和芯之间的芳族聚酰胺织物层，以及在底片和芯之间的第二层芳族聚酰胺织物。顶片和底片由聚合物材料形成。还描述了一种制造方法。

2. 发明申请

US20120168079A1 Method for Manufacturing a Hybrid Composite Wafer Carrier for Wet Clean Equipment 失效
标题翻译：制造用于湿式清洁设备的混合复合晶片载体的方法
公开(公告)号：US20120168079A1
公开(公告)日：2012-07-05
申请号：US13403839
申请日：2012-02-23
申请人： Wing Lau Cheng , Arnold Kholodenko , Helen Cheng
发明人： Wing Lau Cheng , Arnold Kholodenko , Helen Cheng
IPC分类号： B29C70/02 , C09J5/00
CPC分类号： B32B5/26 , B32B5/28 , B32B27/04 , H01L21/67051 , H01L21/67346 , H01L21/67748 , H01L21/68764 , Y10S269/90 , Y10S269/901 , Y10T428/237 , Y10T428/24995 , Y10T428/31515
摘要： A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. A method of manufacturing the carrier further described. The method includes forming a composite frame having a carbon fiber core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom are each formed from a polymer material. The method further includes forming an opening sized for receiving a substrate and providing a plurality of support pins extending into the opening for supporting the substrate within the opening. The opening is formed slightly larger than the substrate such that a gap exists between the substrate and the opening.
摘要翻译：描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。进一步描述制造载体的方法。该方法包括在顶片和芯之间形成具有碳纤维芯，顶片，底片，芳族聚酰胺织物层的复合框架和在底片和芯之间的第二层芳族聚酰胺织物。顶片和底部均由聚合物材料形成。该方法还包括形成开口，该开口的尺寸设置成用于接收基底并提供延伸到开口中的多个支撑销，以支撑开口内的基底。该开口形成为稍微大于基板，使得在基板和开口之间存在间隙。

3. 发明申请

US20080152922A1 HYBRID COMPOSITE WAFER CARRIER FOR WET CLEAN EQUIPMENT 失效
标题翻译：用于湿巾清洁设备的混合复合波浪载体
公开(公告)号：US20080152922A1
公开(公告)日：2008-06-26
申请号：US11743516
申请日：2007-05-02
申请人： Wing Lau Cheng , Helen Cheng , Arnold Kholodenko
发明人： Wing Lau Cheng , Helen Cheng , Arnold Kholodenko
IPC分类号： B32B27/38
CPC分类号： B32B5/26 , B32B5/28 , B32B27/04 , H01L21/67051 , H01L21/67346 , H01L21/67748 , H01L21/68764 , Y10S269/90 , Y10S269/901 , Y10T428/237 , Y10T428/24995 , Y10T428/31515
摘要： A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.
摘要翻译：描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。载体包括具有开口尺寸的接收基板的框架和用于在开口内支撑基板的多个支撑销，该开口略大于基板，使得基板和开口之间存在间隙。框架包括复合芯，顶片，底片，顶片和芯之间的芳族聚酰胺织物层，以及在底片和芯之间的第二层芳族聚酰胺织物。顶片和底片由聚合物材料形成。还描述了一种制造方法。

4. 发明授权

US08292697B2 Method for manufacturing a hybrid composite wafer carrier for wet clean equipment 失效
标题翻译：湿式清洁设备用混合复合晶片载体的制造方法
公开(公告)号：US08292697B2
公开(公告)日：2012-10-23
申请号：US13403839
申请日：2012-02-23
申请人： Wing Lau Cheng , Helen Cheng, legal representative , Arnold Kholodenko
发明人： Wing Lau Cheng , Arnold Kholodenko
IPC分类号： B24B1/00
CPC分类号： B32B5/26 , B32B5/28 , B32B27/04 , H01L21/67051 , H01L21/67346 , H01L21/67748 , H01L21/68764 , Y10S269/90 , Y10S269/901 , Y10T428/237 , Y10T428/24995 , Y10T428/31515
摘要： A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. A method of manufacturing the carrier further described. The method includes forming a composite frame having a carbon fiber core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom are each formed from a polymer material. The method further includes forming an opening sized for receiving a substrate and providing a plurality of support pins extending into the opening for supporting the substrate within the opening. The opening is formed slightly larger than the substrate such that a gap exists between the substrate and the opening.
摘要翻译：描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。进一步描述制造载体的方法。该方法包括在顶片和芯之间形成具有碳纤维芯，顶片，底片，芳族聚酰胺织物层的复合框架和在底片和芯之间的第二层芳族聚酰胺织物。顶片和底部均由聚合物材料形成。该方法还包括形成开口，该开口的尺寸设置成用于接收基底并提供延伸到开口中的多个支撑销，以支撑开口内的基底。该开口形成为稍微大于基板，使得在基板和开口之间存在间隙。

5. 发明申请

US20080038448A1 Chemical resistant semiconductor processing chamber bodies 审中-公开
标题翻译：耐化学腐蚀的半导体加工室体
公开(公告)号：US20080038448A1
公开(公告)日：2008-02-14
申请号：US11731075
申请日：2007-03-30
申请人： Arnold Kholodenko , Wing Cheng , Helen Cheng , Mark Mardelboym , Grant Peng , Katrina Mikhaylichenko
发明人： Arnold Kholodenko , Wing Cheng , Helen Cheng , Mark Mardelboym , Grant Peng , Katrina Mikhaylichenko
IPC分类号： B05C11/00 , B05D3/00
CPC分类号： H01L21/67051 , H01L21/6719
摘要： In one embodiment a chamber body enabling semiconductor processing equipment to be at least partially housed in the chamber body, the semiconductor processing equipment being configured to process a substrate using fluids is disclosed. The chamber body being comprised of a base material implemented to form the chamber body, the chamber body defined by at least a bottom surface and wall surfaces that are integrally connected to the bottom surface to enable capture of overflows of fluids during the processing of the substrate over the chamber body. Additionally, the base material is metallic. The chamber body also has a primer coat material disposed over and on the base material. The primer coat material has metallic constituents to define an integrated bond with the base material along with non-metallic constituents. The chamber body further includes a main coat material disposed over and on the primer coat material. The main coat material being defined from non-metallic constituents, the non-metallic constituents of the main coat material defining an integrated bond with the primer coat material. The main coat material defined to completely overlie all the metallic constituents of the primer coat.
摘要翻译：在一个实施例中，公开了使半导体处理设备能够至少部分地容纳在室主体中的室主体，半导体处理设备被配置为使用流体处理衬底。腔室主体包括被实施成形成腔室主体的基底材料，至少由底部表面限定的腔体主体和与底部表面一体连接的壁表面，以在衬底的处理期间捕获流体溢出物在房间的身体。另外，基材是金属的。腔室主体还具有设置在基底材料上方的底漆涂层材料。底涂层材料具有金属成分，以与非金属组分一起界定与基材的整体结合。室主体还包括设置在底漆涂层材料上和之上的主涂层材料。主涂层材料由非金属组分定义，主涂层材料的非金属组分限定与底漆涂层材料的整体结合。主涂层材料被定义为完全覆盖底漆涂层的所有金属成分。

6. 发明申请

US20130048765A1 Proximity Head Having a Fluid Resistor 有权
标题翻译：具有流体电阻的接近头
公开(公告)号：US20130048765A1
公开(公告)日：2013-02-28
申请号：US13661969
申请日：2012-10-26
申请人： Arnold Kholodenko , Cheng-Yu (Sean) Lin , Russell Martin
发明人： Arnold Kholodenko , Cheng-Yu (Sean) Lin , Russell Martin
IPC分类号： B05B1/00
CPC分类号： H01L21/67051 , Y10S134/902 , Y10T29/49826
摘要： A proximity head defined by a body having a length. The body includes a main bore defined therein and extending along the length. A resistor bore is defined in the body and extends along the length. The resistor bore defined below the main bore. A first plurality of bores defined between the main bore and the resistor bore and a second plurality of bores defined between the resistor bore and an exterior surface of the body. The exterior surface of the body defining a proximity surface of the proximity head.
摘要翻译：由具有长度的主体限定的邻近头。主体包括限定在其中并沿着长度延伸的主孔。电阻孔定义在主体中并沿着长度延伸。电阻孔位于主孔下方。限定在主孔和电阻器孔之间的第一多个孔和限定在电阻器孔和主体的外表面之间的第二多个孔。主体的外表面限定了邻近头部的接近表面。

7. 发明授权

US08313582B2 System, method and apparatus for maintaining separation of liquids in a controlled meniscus 有权
标题翻译：用于在受控弯液面中保持液体分离的系统，方法和装置
公开(公告)号：US08313582B2
公开(公告)日：2012-11-20
申请号：US13370119
申请日：2012-02-09
申请人： Robert O'Donnell , Cheng-Yu (Sean) Lin , Arnold Kholodenko
发明人： Robert O'Donnell , Cheng-Yu (Sean) Lin , Arnold Kholodenko
IPC分类号： B08B3/00
CPC分类号： B08B3/04 , H01L21/67034 , H01L21/67051
摘要： A system and method of forming and using a proximity head. The proximity head includes a head surface including a first zone, a second zone and an inner return zone. The first zone including a first flat surface region and multiple first discrete holes connected to a corresponding first conduit and arranged in a first row. The second zone including a second flat region and multiple second discrete holes connected to a corresponding second conduit. The inner return zone being disposed between and adjacent to the first zone and the second zone and including multiple inner return discrete holes connected to a corresponding inner return conduit and arranged in an inner return row. The first row and the inner return row are parallel. A portion of an edge of each of the inner return discrete holes is recessed into the head surface.
摘要翻译：形成和使用邻近头的系统和方法。邻近头包括头表面，其包括第一区域，第二区域和内部返回区域。所述第一区域包括第一平面区域和连接到对应的第一导管并且布置在第一排中的多个第一离散孔。所述第二区域包括连接到相应的第二导管的第二平坦区域和多个第二离散孔。所述内部返回区域设置在所述第一区域和所述第二区域之间并且邻近所述第二区域并且包括连接到相应的内部返回管道并布置在内部返回行中的多个内部返回离散孔。第一行和内部返回行是平行的。每个内部返回离散孔的边缘的一部分凹入头部表面。

8. 发明授权

US08141566B2 System, method and apparatus for maintaining separation of liquids in a controlled meniscus 有权
标题翻译：用于在受控弯液面中保持液体分离的系统，方法和装置
公开(公告)号：US08141566B2
公开(公告)日：2012-03-27
申请号：US11820590
申请日：2007-06-19
申请人： Robert O'Donnell , Cheng-Yu (Sean) Lin , Arnold Kholodenko
发明人： Robert O'Donnell , Cheng-Yu (Sean) Lin , Arnold Kholodenko
IPC分类号： B08B3/04
CPC分类号： B08B3/04 , H01L21/67034 , H01L21/67051
摘要： A system and method of forming and using a proximity head. The proximity head includes a head surface including a first zone, a second zone and an inner return zone. The first zone including a first flat surface region and multiple first discrete holes connected to a corresponding first conduit and arranged in a first row. The second zone including a second flat region and multiple second discrete holes connected to a corresponding second conduit. The inner return zone being disposed between and adjacent to the first zone and the second zone and including multiple inner return discrete hole connected to a corresponding inner return conduit and arranged in an inner return row. The first row and the inner return row are parallel. A portion of an edge of each of the inner return discrete holes is recessed into the head surface.
摘要翻译：形成和使用邻近头的系统和方法。邻近头包括头表面，其包括第一区域，第二区域和内部返回区域。所述第一区域包括第一平面区域和连接到对应的第一导管并且布置在第一排中的多个第一离散孔。所述第二区域包括连接到相应的第二导管的第二平坦区域和多个第二离散孔。内部返回区域设置在第一区域和第二区域之间并且邻近第一区域并且包括连接到相应的内部返回导管并且布置在内部返回行中的多个内部返回离散孔。第一行和内部返回行是平行的。每个内部返回离散孔的边缘的一部分凹入头部表面。

9. 发明授权

US06795292B2 Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber 失效
标题翻译：用于调节半导体晶片处理室中的处理套件的温度的装置
公开(公告)号：US06795292B2
公开(公告)日：2004-09-21
申请号：US09861984
申请日：2001-05-15
申请人： Dennis Grimard , Arnold Kholodenko , Alex Veytser , Senh Thach , Wing Cheng
发明人： Dennis Grimard , Arnold Kholodenko , Alex Veytser , Senh Thach , Wing Cheng
IPC分类号： H01G2300
CPC分类号： H01L21/67109 , H01L21/67103
摘要： An apparatus for reducing by-product formation in a semiconductor wafer-processing chamber. In a first embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange. A collar is disposed over the peripheral flange defining a first gap therebetween, and circumscribes the chuck. A heater element is embedded within the collar and adapted for connection to a power source. In a second embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, and a collar having a heater element embedded therein. The collar is disposed over the peripheral flange to define a gap therebetween, and circumscribes the chuck. Moreover, a pedestal having a gas delivery system therein is disposed below the chuck and collar. In a third embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, a collar, and a waste ring having a heater element embedded therein. The waste ring is disposed over the peripheral flange defining a gap therebetween, and circumscribes the chuck. The collar is chucked to the waste ring, and the waste ring is chucked to a pedestal support. Moreover, the waste ring and pedestal each have a gas delivery system therein for regulating the temperature of the collar.
摘要翻译：一种用于减少半导体晶片处理室中副产物形成的装置。在第一实施例中，该装置包括具有夹紧电极和径向延伸的周边凸缘的卡盘。套环设置在周边凸缘之上，限定了它们之间的第一间隙，并限制卡盘。加热器元件嵌入在轴环内并且适于连接到电源。在第二实施例中，该装置包括具有夹紧电极和径向延伸的周边凸缘的卡盘以及嵌入其中的加热器元件的套环。套环设置在周边凸缘上方以在其间形成间隙并限制卡盘。此外，其中具有气体输送系统的基座设置在卡盘和轴环的下方。在第三实施例中，该装置包括具有夹紧电极和径向延伸的周边凸缘，套环和具有嵌入其中的加热器元件的废料环的卡盘。废环设置在周边凸缘之上，限定了它们之间的间隙，并且围绕卡盘。将衣领卡在废物环上，将废物环卡在基座支架上。此外，废环和底座各自具有用于调节套环温度的气体输送系统。

10. 发明授权

US06572814B2 Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas 失效
标题翻译：制造具有用于分配传热气体的小直径气体分配端口的半导体晶片支撑卡盘装置的方法
公开(公告)号：US06572814B2
公开(公告)日：2003-06-03
申请号：US09866353
申请日：2001-05-24
申请人： Shamouil Shamoulian , Arnold Kholodenko , Senh Thach , Wing Cheng
发明人： Shamouil Shamoulian , Arnold Kholodenko , Senh Thach , Wing Cheng
IPC分类号： B22F704
CPC分类号： H02N13/00 , Y10T29/49149
摘要： A method of fabricating a semiconductor wafer support chuck apparatus having a first sintered layer and a second sintered layer. The method comprising the steps of providing the first sintered layer having a plurality of gas distribution ports and providing the second sintered layer having a plurality of grooves. The first sintered layer is stacked on top of the second sintered layer, where a diffusion bonding layer is disposed between the first sintered layer and the second sintered layer. Thereafter, the stacked first and second sintered layers are resintered such that the diffusion bonding layer joins the first and second sintered layers together to form a semiconductor wafer support apparatus.
摘要翻译：一种制造具有第一烧结层和第二烧结层的半导体晶片支撑卡盘装置的方法。该方法包括以下步骤：提供具有多个气体分配端口的第一烧结层，并提供具有多个凹槽的第二烧结层。第一烧结层堆叠在第二烧结层的顶部，在第一烧结层和第二烧结层之间设置扩散接合层。然后，堆叠的第一和第二烧结层重新烧结，使得扩散接合层将第一和第二烧结层与第二烧结层结合在一起形成半导体晶片支撑装置。

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