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    • 2. 发明授权
    • Solder paste stencil manufacturing system
    • 焊膏模板制造系统
    • US07003871B2
    • 2006-02-28
    • US10677640
    • 2003-10-01
    • Michael Ray
    • Michael Ray
    • H01R43/00
    • H05K3/1225H05K1/0269H05K3/1233H05K2203/107H05K2203/163Y10T29/49117Y10T29/49124Y10T29/49126Y10T29/49128Y10T29/4913Y10T29/49135Y10T29/49144Y10T29/49155Y10T29/49204
    • A method and apparatus for manufacturing or assembling a plurality of printed circuit boards to reduce rework at a printed circuit board assembly facility, which may include the following: cutting a first solder paste stencil based on a first solder paste stencil data set on a solder paste stencil cutting machine or device; utilizing the first stencil to apply solder paste to a first printed circuit board at a manufacturing or assembly facility; identifying a solder paste error condition with solder paste error information on the first printed circuit board; transmitting the solder paste error information for remote analysis; generating an adjusted first data set; transmitting the adjusted first data set to the printed circuit board manufacturing or assembly facility; utilizing the adjusted first data set to cut another solder paste stencil based on the adjusted stencil data; and utilizing the adjusted first solder paste stencil to manufacture a second printed circuit board without the solder paste error condition.
    • 一种用于制造或组装多个印刷电路板以减少印刷电路板组装设备的返工的方法和装置,其可以包括以下步骤:基于在焊膏上设置的第一焊膏模版数据来切割第一焊膏模版 模切机或设备; 利用第一模板在制造或组装设施中将焊膏施加到第一印刷电路板; 在第一印刷电路板上识别焊膏误差信息,焊膏误差信息; 发送用于远程分析的焊膏错误信息; 生成调整后的第一数据集; 将经调整的第一数据集发送到印刷电路板制造或组装设施; 利用经调整的第一数据集,根据经调整的模板数据切割另一焊膏模版; 并利用调整后的第一焊锡膏模板制造第二印刷电路板,而没有焊膏错误状况。
    • 4. 发明授权
    • Integrated IR, visible and NIR sensor and methods of fabricating same
    • 集成IR,可见光和近红外传感器及其制造方法
    • US5808350A
    • 1998-09-15
    • US778934
    • 1997-01-03
    • Michael D. JackMichael RayRichard H. Wyles
    • Michael D. JackMichael RayRichard H. Wyles
    • G01J5/10G01J5/34H01L27/146H01L37/02H01L31/0256H01L27/148H01L31/0232
    • H01L37/02G01J5/10G01J5/34H01L27/14652
    • An imaging device (10) has a plurality of unit cells that contribute to forming an image of a scene. The imaging device includes a layer of semiconductor material (16), for example silicon, that has low noise photogate charge-mode readout circuitry (20, 21, 26, 28) (e.g., CCD or CMOS readout circuitry and structures) that is disposed upon a first surface (18) of the layer. A second, opposing surface of the layer is a radiation admitting surface of the layer. The layer has a bandgap selected for absorbing electromagnetic radiation having wavelengths shorter than about one micrometer and for generating charge carriers from the absorbed radiation. The generated charge carriers are collected by the photogate charge-mode readout circuitry. A thermal sensing element (22) is disposed above and is thermally isolated from the first surface of the layer. The thermal sensing element may be, by example, one of a bolometer element, a pyroelectric element, or a thermopile element. A layer (12) of narrower bandgap semiconductor material can also be employed with this invention, wherein the layer of narrower bandgap semiconductor material (such as InGaAs or HgCdTe) is atomically bonded to the second surface along a heterojunction interface that is continuous or apertured across the second surface. The bonded layer is used to absorb NIR and visible light.
    • 成像装置(10)具有有助于形成场景图像的多个单位单元。 该成像装置包括半导体材料层(16),例如硅,其具有低噪声光栅充电模式读出电路(20,21,26,28)(例如,CCD或CMOS读出电路和结构),其被布置 在该层的第一表面(18)上。 层的第二相对表面是该层的辐射入射表面。 该层具有选择用于吸收波长短于约一微米的电磁辐射的带隙,并用于从吸收的辐射产生电荷载流子。 产生的电荷载流子由光栅充电模式读出电路收集。 热敏元件(22)设置在层的第一表面的上方并与之隔离。 热敏元件可以是例如测辐射热计元件,热电元件或热电堆元件之一。 窄带隙半导体材料的层(12)也可以用于本发明,其中较窄带隙半导体材料(例如InGaAs或HgCdTe)的层沿着连续或有孔跨越的异质结界面原子键合到第二表面 第二个表面。 接合层用于吸收近红外和可见光。
    • 8. 发明申请
    • Solder paste stencil manufacturing system
    • 焊膏模板制造系统
    • US20050071996A1
    • 2005-04-07
    • US10677640
    • 2003-10-01
    • Michael Ray
    • Michael Ray
    • H05K1/02H05K3/12H05K3/00
    • H05K3/1225H05K1/0269H05K3/1233H05K2203/107H05K2203/163Y10T29/49117Y10T29/49124Y10T29/49126Y10T29/49128Y10T29/4913Y10T29/49135Y10T29/49144Y10T29/49155Y10T29/49204
    • A method and apparatus for manufacturing or assembling a plurality of printed circuit boards to reduce rework at a printed circuit board assembly facility, which may include the following: cutting a first solder paste stencil based on a first solder paste stencil data set on a solder paste stencil cutting machine or device; utilizing the first stencil to apply solder paste to a first printed circuit board at a manufacturing or assembly facility; identifying a solder paste error condition with solder paste error information on the first printed circuit board; transmitting the solder paste error information for remote analysis; generating an adjusted first data set; transmitting the adjusted first data set to the printed circuit board manufacturing or assembly facility; utilizing the adjusted first data set to cut another solder paste stencil based on the adjusted stencil data; and utilizing the adjusted first solder paste stencil to manufacture a second printed circuit board without the solder paste error condition.
    • 一种用于制造或组装多个印刷电路板以减少印刷电路板组装设备的返工的方法和装置,其可以包括以下步骤:基于在焊膏上设置的第一焊膏模版数据来切割第一焊膏模版 模切机或设备; 利用第一模板在制造或组装设施中将焊膏施加到第一印刷电路板; 在第一印刷电路板上识别焊膏误差信息,焊膏误差信息; 发送用于远程分析的焊膏错误信息; 生成调整后的第一数据集; 将经调整的第一数据集发送到印刷电路板制造或组装设施; 利用经调整的第一数据集,根据经调整的模板数据切割另一焊膏模版; 并利用调整后的第一焊锡膏模板制造第二印刷电路板,而没有焊膏错误状况。
    • 9. 发明授权
    • Method and apparatus providing focal plane array active thermal control elements
    • 提供焦平面阵列有源热控元件的方法和装置
    • US06649913B1
    • 2003-11-18
    • US10084687
    • 2002-02-26
    • Adam M. KennedyMichael RayRichard H. WylesJessica K. WylesWilliam A. Radford
    • Adam M. KennedyMichael RayRichard H. WylesJessica K. WylesWilliam A. Radford
    • G01J500
    • G01J5/061G01J5/20H04N5/33
    • A focal plane array (FPA) of infrared (IR) radiation detectors (20), such as an array of microbolometers, includes an active area (20A) containing a plurality of IR radiation detectors, a readout integrated circuit (ROIC) (12) that is mechanically and electrically coupled to the active area and, disposed on the ROIC, a plurality of heater elements (30A) that are located and operated so as to provide a substantially uniform thermal distribution across at least the active area. The FPA further includes a plurality of temperature sensors (30B), individual ones of which are spatially associated with one of the heater elements for sensing the temperature in the vicinity of the associated heater element for providing closed loop operation of the associated heater element. In one embodiment pairs of the heater elements and associated temperature sensors are distributed in a substantially uniform manner across at least a top or a bottom surface of the ROIC, while in another embodiment pairs of the heater elements and associated temperature sensors, or only the heater elements, are distributed in accordance with a predetermined thermal profile of the FPA. The plurality of heater elements may each be composed of a silicon resistance, and the plurality of temperature sensors may each be each composed of a silicon temperature sensor.
    • 红外线(IR)辐射探测器(20)的焦平面阵列(FPA),例如微电流计阵列,包括一个包含多个红外辐射探测器的有源区域(20A),一个读出集成电路(ROIC) 机械地和电耦合到有源区域,并且设置在ROIC上,多个加热器元件(30A)被定位和操作以便在至少有效区域上提供基本均匀的热分布。 FPA还包括多个温度传感器(30B),其中单独的温度传感器在空间上与一个加热器元件相关联,用于感测相关联的加热器元件附近的温度,以提供相关加热器元件的闭环操作。 在一个实施例中,成对的加热器元件和相关联的温度传感器以基本上均匀的方式分布在ROIC的至少顶部或底部表面上,而在另一个实施例中,加热器元件和相关联的温度传感器对,或仅加热器 元件,根据FPA的预定热剖面分布。 多个加热器元件可以各自由硅电阻组成,并且多个温度传感器可以各自由硅温度传感器组成。
    • 10. 发明授权
    • Search routine for ellipsometers
    • 椭圆仪的搜索程序
    • US5410409A
    • 1995-04-25
    • US752818
    • 1991-08-30
    • Michael Ray
    • Michael Ray
    • G01N21/21G01J4/00
    • G01N21/211
    • A method of locating a predetermined variation in the surface of a film such as selected depression or elevation on a film deposited on a surface and for measuring the depth of the depression or height of the elevation comprising the steps of establishing a datum plane based on the average level of the surface of the film, scanning the surface of the film with a laser beam until a predetermined variation from said datum plane is located, on the surface of the film, incrementally stepping the laser beam around and across the located variation, measuring the beam reflected at various points along the variation to determine the contour of the variation by establishing the slope of the variation between various measurements, establishing the apex of an elevation or bottom of a depression by determining when the measured slope goes to zero, and measuring the height of the established apex or depth of the established bottom of the depression with respect to the established datum plane of the film.
    • 一种在沉积在表面上的薄膜上定位薄膜表面的预定变化例如选定的凹陷或仰角的方法,以及用于测量凹陷深度或仰角高度的方法,包括以下步骤:基于 膜的表面的平均水平,用激光束扫描膜的表面直到与所述基准平面的预定变化位于膜的表面上,逐渐地将激光束逐步地跨越所定位的变化,测量 光束在沿着变化的各个点反射,以通过确定各种测量之间的变化的斜率来确定变化的轮廓,通过确定测量的斜率何时变为零,建立凹陷的高度或底部的顶点,以及测量 相对于已建立的基准平面,所建立的顶点的高度或凹陷的已建立的底部的深度 电影