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1. 发明授权

US4442449A Binary germanium-silicon interconnect and electrode structure for integrated circuits 失效
标题翻译：用于集成电路的二元锗硅互连和电极结构
公开(公告)号：US4442449A
公开(公告)日：1984-04-10
申请号：US243986
申请日：1981-03-16
申请人： William I. Lehrer , Bruce E. Deal
发明人： William I. Lehrer , Bruce E. Deal
IPC分类号： H01L29/78 , H01L21/28 , H01L21/3205 , H01L21/768 , H01L23/52 , H01L23/532 , H01L29/43 , H01L29/163 , H01L29/54
CPC分类号： H01L23/53271 , H01L21/76886 , H01L2924/0002 , Y10S428/929 , Y10T428/12528 , Y10T428/12674
摘要： An interconnect structure for use in integrated circuits comprises a germanium-silicon binary alloy. Such an alloy is deposited on the semiconductor wafer from the co-deposition of germanium and silicon using chemical vapor deposition techniques of a type commonly used in the semiconductor industry. The resulting alloy can be oxidized, selectively removed and doped with selected impurities to provide a conductive lead pattern of a desired shape on the surface of a wafer.
摘要翻译：用于集成电路的互连结构包括锗 - 硅二元合金。使用在半导体工业中通常使用的类型的化学气相沉积技术，这种合金由锗和硅的共沉积沉积在半导体晶片上。所得合金可以被氧化，选择性地除去并掺杂选定的杂质，以在晶片的表面上提供所需形状的导电引线图形。

2. 发明授权

US4935095A Germanosilicate spin-on glasses 失效
标题翻译：德硅硅酸盐旋涂眼镜
公开(公告)号：US4935095A
公开(公告)日：1990-06-19
申请号：US747470
申请日：1985-06-21
申请人： William I. Lehrer
发明人： William I. Lehrer
IPC分类号： H01L29/78 , C03B8/02 , C03B19/12 , H01L21/316 , H01L21/3205 , H01L21/768 , H01L23/532
CPC分类号： H01L21/76819 , H01L21/316 , H01L23/5329 , H01L2924/0002
摘要： A process is disclosed for forming a planarized or smooth surface binary glass insulating film comprised of germanium dioxide and silicon dioxide by a spin-on process. The resulting structure has a film thickness uniformity which varies less than 5% over the surface of the wafer. The structure is formed by mixing a predetermined solution of TEOS and TEOG in a lower alcohol or ketone solvent and catalyzing by the addition of sufficient acid to raise the pH to 1.5 to 2.0 to favor gel formation. The resultant solution is then spun on at an RPM selected to give the desired film thickness for a given solids content of the solution.
摘要翻译：公开了通过旋涂工艺形成由二氧化锗和二氧化硅组成的平坦化或平滑表面二元玻璃绝缘膜的方法。所得到的结构具有在晶片表面上变化小于5％的膜厚度均匀性。通过将TEOS和TEOG的预定溶液混合在低级醇或酮溶剂中并通过加入足够的酸催化以将pH升高至1.5至2.0以有利于凝胶形成而形成结构。然后将所得溶液以选定的RPM旋转，以给出溶液的给定固体含量所需的膜厚度。

3. 发明授权

US4267012A Process for patterning metal connections on a semiconductor structure by using a tungsten-titanium etch resistant layer 失效
标题翻译：通过使用钨钛耐蚀刻层在半导体结构上图案化金属连接的工艺
公开(公告)号：US4267012A
公开(公告)日：1981-05-12
申请号：US34781
申请日：1979-04-30
申请人： John M. Pierce , William I. Lehrer , Kenneth J. Radigan
发明人： John M. Pierce , William I. Lehrer , Kenneth J. Radigan
IPC分类号： H01L21/302 , H01L21/306 , H01L21/3065 , H01L21/308 , H01L21/3213 , H01L21/283
CPC分类号： H01L21/32137 , H01L21/3081 , H01L21/3085 , H01L21/32134 , H01L21/32136
摘要： A process for patterning regions on a semiconductor structure comprises the steps of forming a first layer of an alloy of tungsten and titanium on the semiconductor structure, forming a conductive layer of aluminum or chemically similar material on the surface of the tungsten-titanium alloy, removing the undesired portions of the conductive layer by etching with a plasma and removing the thereby exposed portions of the tungsten-titanium alloy layer by chemical etching.
摘要翻译：用于图案化半导体结构上的区域的工艺包括以下步骤：在半导体结构上形成钨和钛合金的第一层，在钨钛合金的表面上形成铝或化学相似材料的导电层，去除通过用等离子体蚀刻并通过化学蚀刻去除钨 - 钛合金层的暴露部分来导致导电层的不希望的部分。

4. 发明授权

US4727048A Process for making isolated semiconductor structure 失效
标题翻译：制造隔离半导体结构的工艺
公开(公告)号：US4727048A
公开(公告)日：1988-02-23
申请号：US891792
申请日：1986-10-02
申请人： John M. Pierce , William I. Lehrer
发明人： John M. Pierce , William I. Lehrer
IPC分类号： H01L21/3105 , H01L21/316 , H01L21/762 , H01L23/31 , H01L21/473
CPC分类号： H01L23/3178 , H01L21/3105 , H01L21/31604 , H01L21/76224 , H01L2924/0002
摘要： An integrated circuit structure comprises a plurality of islands of semiconductor material (16-1 through 16-5) each island being separated from adjacent islands by a groove formed in annular shape around said island to laterally define the dimensions of each such island, an oxide (12, 14) formed over the surface of said grooves (13-1 through 13-6) and said islands and a selected glass (15) deposited on said oxide (14) in the grooves and over the top surface of said device, said glass having the property that it flows at a temperature beneath the temperature at which dopants in the islands of semiconductor material substantially redistribute, said selected glass (15) having a substantially flat top surface thereby to give said structure a substantially flat top surface.
摘要翻译：集成电路结构包括多个岛状半导体材料（16-1至16-5），每个岛通过围绕所述岛形成为环形的沟槽与相邻的岛分离，以横向限定每个这样的岛的尺寸，氧化物（13-1至13-6）和所述岛的表面上形成的（12,14）和沉积在所述凹槽中的所述氧化物（14）上并且在所述装置的顶表面上的选定的玻璃（15）所述玻璃具有其在半导体材料岛的掺杂剂基本上重新分布的温度以下的温度下流动的性质，所述选定的玻璃（15）具有基本上平坦的顶表面，从而使所述结构基本上平坦的顶表面。

5. 发明授权

US4619844A Method and apparatus for low pressure chemical vapor deposition 失效
标题翻译：低压化学气相沉积的方法和装置
公开(公告)号：US4619844A
公开(公告)日：1986-10-28
申请号：US693401
申请日：1985-01-22
申请人： John M. Pierce , William I. Lehrer
发明人： John M. Pierce , William I. Lehrer
IPC分类号： C23C16/44 , C23C16/448 , C23C16/455 , C23C16/00 , B05C11/00
CPC分类号： C23C16/4485
摘要： A method of introducing a controlled flow of vapor from a high pressure sublimation chamber into a low pressure vapor deposition reactor, said vapor being derived from solid source material preferably, but not necessarily, having a vapor pressure above about one (1) Torr at a temperature not exceeding about 350.degree. C. The method comprises controllably heating the source material to a temperature sufficient to produce vapor therefrom at a desired pressure, and then controllably transferring the vapor through vapor transmission means to the vapor deposition reactor. During such transfer, the transmission means is maintained at a temperature sufficient to prevent condensation of the vapor therein during transfer. The vapor is delivered to the reactor in a pure state and is not mixed with any carrier medium.
摘要翻译：将受控的蒸汽流从高压升华室引入低压气相沉积反应器的方法，所述蒸汽源自固体源材料，优选但不一定具有高于约一（1）乇的蒸气压，温度不超过约350℃。该方法包括可控地将源材料加热到足以在所需压力下产生蒸汽的温度，然后通过蒸气传输装置将蒸汽可控地转移到气相沉积反应器。在这种转移期间，传动装置保持在足以防止在传送期间蒸气冷凝的温度。蒸汽以纯的状态输送到反应器中，并且不与任何载体介质混合。

6. 发明授权

US4387145A Lift-off shadow mask 失效
标题翻译：剥离阴影面具
公开(公告)号：US4387145A
公开(公告)日：1983-06-07
申请号：US306116
申请日：1981-09-28
申请人： William I. Lehrer , John H. Vincak
发明人： William I. Lehrer , John H. Vincak
IPC分类号： G03F7/09 , H01L21/027 , H01L21/033 , H01L21/316 , G03C5/00 , B44C1/22 , G03F5/00
CPC分类号： H01L21/02112 , G03F7/094 , H01L21/02164 , H01L21/022 , H01L21/02211 , H01L21/02271 , H01L21/0272 , H01L21/0332 , H01L21/0337 , H01L21/31608 , Y10S438/944 , Y10S438/951
摘要： A method for forming a predetermined configuration of a film material comprises the steps of forming a layer of a first material on a surface, forming a layer of a second material on the first material wherein the first material has an etch rate greater than that of the second material when the first material and the second material are exposed to a common etchant, etching portions of the second material and underlying portions of the first material to expose portions of the surface, forming a layer of film material on the exposed portions of the surface, forming a layer of film material on the exposed portions of the surface and on the remaining portions of the second material, and removing the remaining portions of the first material such that the overlying second material and the film material thereon is also removed.
摘要翻译：用于形成薄膜材料的预定构造的方法包括以下步骤：在表面上形成第一材料层，在第一材料上形成第二材料层，其中第一材料的蚀刻速率大于当第一材料和第二材料暴露于常见的蚀刻剂时，蚀刻第二材料，蚀刻第二材料的部分和第一材料的下面部分以暴露表面的部分，在表面的暴露部分上形成薄膜材料层在所述表面的暴露部分和所述第二材料的剩余部分上形成薄膜材料层，以及去除所述第一材料的剩余部分，使得其上覆盖的第二材料和所述薄膜材料也被去除。

7. 发明授权

US4704342A Photomask having a patterned carbon light-blocking coating 失效
标题翻译：具有图案化的碳阻挡涂层的光掩模
公开(公告)号：US4704342A
公开(公告)日：1987-11-03
申请号：US719020
申请日：1985-04-02
申请人： William I. Lehrer , P. Anthony Crossley
发明人： William I. Lehrer , P. Anthony Crossley
IPC分类号： G03F1/54 , G03F1/56 , G03F9/00
CPC分类号： G03F1/56 , G03F1/54 , Y10S430/146
摘要： A photomask for use in manufacturing integrated circuits is fabricated by coating a thin film of organic material, generally a solution of a thermally decomposable hydrocarbon, onto a glass plate and heating it in a reducing atmosphere to convert it into carbon. The carbon layer is masked and etched; for example, in an oxygen plasma, to produce the mask.
摘要翻译：用于制造集成电路的光掩模通过将有机材料薄膜（通常为可热分解的烃的溶液）涂覆在玻璃板上并在还原气氛中加热以将其转化为碳来制造集成电路。对碳层进行掩模蚀刻; 例如在氧等离子体中制造掩模。

8. 发明授权

US4654269A Stress relieved intermediate insulating layer for multilayer metalization 失效
标题翻译：应力消除用于多层金属化的中间绝缘层
公开(公告)号：US4654269A
公开(公告)日：1987-03-31
申请号：US747471
申请日：1985-06-21
申请人： William I. Lehrer
发明人： William I. Lehrer
IPC分类号： C23C18/12 , C23C16/40 , C23C28/04 , H01L21/31 , H01L21/3105 , H01L21/316 , H01L21/3205 , H01L21/768 , H01L23/522 , H01L23/532 , B65D5/12
CPC分类号： H01L23/5329 , H01L21/3105 , H01L21/316 , H01L21/76801 , H01L21/76819 , H01L21/76828 , H01L2924/0002 , Y10S428/901
摘要： There is disclosed herein a stress relieved intermediate insulating layer consisting of one or more layers of spun-on glass lying over a metalization pattern. The spun-on layers are allowed to crack from thermal stress imposed upon the structure. The cracks in the spun-on layers are then filled with a glass layer deposited by CVD or LPCVD.
摘要翻译：本文公开了一种应力消除中间绝缘层，其由位于金属化图案上的一层或多层纺丝玻璃构成。允许旋转层从施加在结构上的热应力开裂。然后，通过CVD或LPCVD沉积的玻璃层填充旋涂层中的裂纹。

9. 发明授权

US4630343A Product for making isolated semiconductor structure 失效
标题翻译：用于制造隔离半导体结构的产品
公开(公告)号：US4630343A
公开(公告)日：1986-12-23
申请号：US773842
申请日：1985-09-06
申请人： John M. Pierce , William I. Lehrer
发明人： John M. Pierce , William I. Lehrer
IPC分类号： H01L21/3105 , H01L21/316 , H01L21/762 , H01L23/31 , H01L21/461
CPC分类号： H01L21/3105 , H01L21/316 , H01L21/31604 , H01L21/76224 , H01L23/3178 , H01L2924/0002
摘要： An integrated circuit structure comprises a plurality of islands of semiconductor material (16-1 through 16-5) each island being separated from adjacent islands by a groove formed in annular shape around said island to laterally define the dimensions of each such island, an oxide (12, 14) formed over the surface of said grooves (13-1 through 13-6) and said islands and a selected glass (15) deposited on said oxide (14) in the grooves and over the top surface of said device, said glass having the property that it flows at a temperature beneath the temperature at which dopants in the islands of semiconductor material substantially redistribute, said selected glass (15) having a substantially flat top surface thereby to give said structure a substantially flat top surface.
摘要翻译：集成电路结构包括多个岛状半导体材料（16-1至16-5），每个岛通过围绕所述岛形成为环形的沟槽与相邻的岛分离，以横向限定每个这样的岛的尺寸，氧化物（13-1至13-6）和所述岛的表面上形成的（12,14）和沉积在所述凹槽中的所述氧化物（14）上并且在所述装置的顶表面上的选定的玻璃（15）所述玻璃具有其在半导体材料岛的掺杂剂基本上重新分布的温度以下的温度下流动的性质，所述选定的玻璃（15）具有基本上平坦的顶表面，从而使所述结构基本上平坦的顶表面。

10. 发明授权

US4490737A Smooth glass insulating film over interconnects on an integrated circuit 失效
标题翻译：在集成电路上的互连上平滑的玻璃绝缘膜
公开(公告)号：US4490737A
公开(公告)日：1984-12-25
申请号：US362322
申请日：1982-03-26
申请人： John M. Pierce , William I. Lehrer
发明人： John M. Pierce , William I. Lehrer
IPC分类号： C03C3/062 , C03C3/097 , C03C4/16 , H01L21/316 , H01L23/29 , H01L23/532 , H05K1/03 , H05K3/28 , H01L23/30 , H01L29/34 , C03C3/04
CPC分类号： H01L23/291 , C03C3/062 , C03C3/097 , C03C4/16 , H01L21/316 , H01L23/5329 , H01L2924/0002 , H01L2924/3011 , H05K1/0306 , H05K3/28
摘要： A low temperature insulating glass for use in semiconductor devices comprises a mixture of germanium, silicon, oxygen and phosphorus. In the preferred embodiment, the glass comprises a mixture of about 40% to 55% silicon dioxide (SiO.sub.2), about 55% to 40% of germanium dioxide (GeO.sub.2) and from 1% to about 5% of phosphorus pentoxide (P.sub.2 O.sub.5), by mole percent.
摘要翻译：用于半导体器件的低温绝缘玻璃包括锗，硅，氧和磷的混合物。在优选的实施方案中，玻璃包含约40％至55％的二氧化硅（SiO 2），约55％至40％的二氧化锗（GeO 2）和1％至约5％的五氧化二磷（P 2 O 5）的混合物，按摩尔％计。

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