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1. 发明申请

US20120009855A1 SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE 有权
标题翻译：用于抛光半导体基板的软抛光垫
公开(公告)号：US20120009855A1
公开(公告)日：2012-01-12
申请号：US12832908
申请日：2010-07-08
申请人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
发明人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
IPC分类号： B24D11/00 , B24D3/32 , B24D13/14
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , B24D11/003 , B32B3/30 , B32B5/142 , B32B5/18 , B32B7/06 , B32B7/12 , B32B25/045 , B32B25/08 , B32B27/065 , B32B27/08 , B32B27/308 , B32B27/36 , B32B2266/0278 , B32B2266/08 , B32B2307/40 , B32B2307/41 , B32B2307/412 , B32B2307/536 , B32B2307/72 , B32B2307/732 , B32B2457/00 , C08G18/3206 , C08G18/7621
摘要： Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
摘要翻译：描述了用于抛光半导体衬底的软抛光垫。软抛光垫包括具有大约在20肖氏D至45肖氏硬度范围内的硬度的热固性闭孔聚氨酯材料的模制均匀抛光体。

2. 发明申请

US20110171883A1 CMP pad with local area transparency 有权
标题翻译：具有局部透明度的CMP垫
公开(公告)号：US20110171883A1
公开(公告)日：2011-07-14
申请号：US12657135
申请日：2010-01-13
申请人： William Allison , Ping Huang , Diane Scott , Richard Frentzel , Robert Kerprich
发明人： William Allison , Ping Huang , Diane Scott , Richard Frentzel , Robert Kerprich
IPC分类号： B24D7/12 , B24B49/12 , B24D3/00 , B24D3/32 , B24D11/00
CPC分类号： B24B37/205
摘要： A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing layer; and (c) an adhesive layer interposed between said polishing layer and said release sheet; said adhesive layer capable of adhering the polishing layer to a platen of a CMP apparatus after said release sheet has been removed.
摘要翻译：一种CMP抛光垫，包括（a）具有抛光表面和与所述抛光表面相对的后表面的抛光层; 所述抛光层具有至少一个固化的不透明热固性聚氨酯区域和至少一个开口区域; 所述至少一个固化的不透明热固性区域具有约10体积％至约55体积％的孔隙率; 所述至少一个开口区域具有（1）位于抛光表面下方的顶部开口，（2）与所述后表面共面的底部开口和（3）从所述开口顶部开口延伸到所述开口顶部开口的直线垂直侧壁孔底开口; 所述至少一个孔区填充有热固性聚氨酯局部透明材料的固化塞，其在700至710纳米的波长下具有小于80％的透光率，并且直接化学键合到热固性聚氨酯不透明区域; （b）覆盖所述抛光层的所述后表面的至少一部分的无孔可移除的剥离片; 和（c）介于所述抛光层和所述剥离片之间的粘合剂层; 所述粘合剂层能够在去除所述剥离片之后将抛光层粘附到CMP设备的压板上。

3. 发明授权

US09156124B2 Soft polishing pad for polishing a semiconductor substrate 有权
标题翻译：用于抛光半导体衬底的软抛光垫
公开(公告)号：US09156124B2
公开(公告)日：2015-10-13
申请号：US12832908
申请日：2010-07-08
申请人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
发明人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
IPC分类号： B24D11/00 , B24B37/20 , B32B7/06 , B32B27/06 , B32B27/36 , B32B3/30
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , B24D11/003 , B32B3/30 , B32B5/142 , B32B5/18 , B32B7/06 , B32B7/12 , B32B25/045 , B32B25/08 , B32B27/065 , B32B27/08 , B32B27/308 , B32B27/36 , B32B2266/0278 , B32B2266/08 , B32B2307/40 , B32B2307/41 , B32B2307/412 , B32B2307/536 , B32B2307/72 , B32B2307/732 , B32B2457/00 , C08G18/3206 , C08G18/7621
摘要： Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
摘要翻译：描述了用于抛光半导体衬底的软抛光垫。软抛光垫包括具有大约在20肖氏D至45肖氏硬度范围内的硬度的热固性闭孔聚氨酯材料的模制均匀抛光体。

4. 发明授权

US09017140B2 CMP pad with local area transparency 有权
标题翻译：具有局部透明度的CMP垫
公开(公告)号：US09017140B2
公开(公告)日：2015-04-28
申请号：US12657135
申请日：2010-01-13
申请人： William Allison , Ping Huang , Diane Scott , Richard Frentzel , Robert Kerprich
发明人： William Allison , Ping Huang , Diane Scott , Richard Frentzel , Robert Kerprich
IPC分类号： B24B49/12 , B24B37/20
CPC分类号： B24B37/205
摘要： A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing layer; and (c) an adhesive layer interposed between said polishing layer and said release sheet; said adhesive layer capable of adhering the polishing layer to a platen of a CMP apparatus after said release sheet has been removed.
摘要翻译：一种CMP抛光垫，包括（a）具有抛光表面和与所述抛光表面相对的后表面的抛光层; 所述抛光层具有至少一个固化的不透明热固性聚氨酯区域和至少一个开口区域; 所述至少一个固化的不透明热固性区域具有约10体积％至约55体积％的孔隙率; 所述至少一个开口区域具有（1）位于抛光表面下方的顶部开口，（2）与所述后表面共面的底部开口和（3）从所述开口顶部开口延伸到所述开口顶部开口的直线垂直侧壁孔底开口; 所述至少一个孔区填充有热固性聚氨酯局部透明材料的固化塞，其在700至710纳米的波长下具有小于80％的透光率，并且直接化学键合到热固性聚氨酯不透明区域; （b）覆盖所述抛光层的所述后表面的至少一部分的无孔可移除的剥离片; 和（c）介于所述抛光层和所述剥离片之间的粘合剂层; 所述粘合剂层能够在去除所述剥离片之后将抛光层粘附到CMP设备的压板上。

5. 发明授权

US4044283A Electromechanical resonator 失效
标题翻译：机电谐振器
公开(公告)号：US4044283A
公开(公告)日：1977-08-23
申请号：US624791
申请日：1975-10-22
申请人： William Allison
发明人： William Allison
IPC分类号： H04N3/02 , G02B26/10 , H02K33/00 , H02K33/10
CPC分类号： G02B26/10 , H02K33/00 , H02K33/10
摘要： An electromechanical resonator is disclosed for use in optical scanning systems. The resonator comprises a torsionally resonant system including a torsion rod having one end fixed to a nodal zone member and an oscillatory mass at the free end. A flexurally resonant system includes a pair of oppositely disposed flexure arms extending transversely of the torsional axis and having their inner ends fixed to the nodal zone member. The nodal zone member is suspended by a coupling spring from a frame member and the coupling spring permits energy transfer from the flexurally resonant system to the torsional resonant system through nodal zone member. The resonant systems are maintained in oscillation by electrodynamic means coupled with the flexure arms.
摘要翻译：公开了一种用于光学扫描系统的机电谐振器。谐振器包括扭转谐振系统，其包括具有一端固定到节点构件的扭力杆和在自由端的振荡质量块。弯曲共振系统包括一对相对设置的弯曲臂，其横向于扭转轴线延伸并且其内端固定到节点区域构件。节点部件通过联接弹簧从框架构件悬挂，并且联接弹簧允许通过节点构件从挠曲共振系统到扭转谐振系统的能量传递。谐振系统通过与挠曲臂结合的电动装置保持振荡。

6. 发明授权

US07191880B2 Over-running clutch pulley with increased surface microhardness 失效
标题翻译：超跑离合器皮带轮具有增加的表面显微硬度
公开(公告)号：US07191880B2
公开(公告)日：2007-03-20
申请号：US10381773
申请日：2001-05-31
申请人： Mary-Jo Liston , John Miller , Robert Frayer, Jr. , Randall King , Russell Monahan , William Allison
发明人： Mary-Jo Liston , John Miller , Robert Frayer, Jr. , Randall King , Russell Monahan , William Allison
IPC分类号： F16D41/20 , F16D13/12 , F16H55/48
CPC分类号： F16H55/36 , B23P15/00 , F16D41/206 , Y10T29/49453
摘要： The over-running clutch pulley (10) of a preferred embodiment of the invention includes a sheave member (20), a hub member (22) located substantially concentrically within the sheave member, and a clutch member (24), which cooperate to rotationally engage an input device (12) and an output device (14). The sheave member preferably includes a sheave input section (26) adapted to engage the input device, and a sheave clutch section (28) defining a sheave clutch surface (30). Similarly, the hub member preferably includes a hub output section (32) adapted to engage the output device, and a hub clutch section (34) defining a hub clutch surface (36). In the preferred embodiment, either the sheave clutch surface, the hub clutch surface, or both, have a surface microhardness greater than the hub output section.
摘要翻译：本发明的优选实施例的超行走离合器滑轮（10）包括滑轮构件（20），大致同心地位于滑轮构件内的轮毂构件（22）和离合器构件（24）接合输入设备（12）和输出设备（14）。滑轮构件优选地包括适于接合输入装置的滑轮输入部分（26）和限定滑轮离合器表面（30）的滑轮离合器部分（28）。类似地，毂构件优选地包括适于接合输出装置的轮毂输出部分（32）和限定轮毂离合器表面（36）的轮毂离合器部分（34）。在优选实施例中，滑轮离合器表面，轮毂离合器表面或两者都具有比轮毂输出部分大的表面显微硬度。

7. 发明申请

US20060089093A1 Polyurethane urea polishing pad 审中-公开
标题翻译：聚氨酯尿素抛光垫
公开(公告)号：US20060089093A1
公开(公告)日：2006-04-27
申请号：US10974529
申请日：2004-10-27
申请人： Robert Swisher , Alan Wang , William Allison
发明人： Robert Swisher , Alan Wang , William Allison
IPC分类号： B29C44/00 , B24D11/00
CPC分类号： B24B37/24 , B24D3/32 , C08G18/10 , C08G18/3808 , C08G18/5024 , C08L23/10 , C08L75/02 , C08G18/6685 , C08G18/792 , C08L2666/04
摘要： The present invention relates to an article for altering a surface of a workpiece, or a polishing pad. In particular, the polishing pad includes a polyurethane urea material wherein at least a portion of the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers.
摘要翻译：本发明涉及一种用于改变工件表面或抛光垫的制品。特别地，抛光垫包括聚氨酯脲材料，其中至少一部分聚氨酯脲材料含有至少部分填充有气体的电池。聚氨酯脲材料可以通过将多异氰酸酯和/或聚氨酯预聚物，含羟基材料，含胺材料和发泡剂组合来制备。根据本发明的抛光垫可用于抛光制品，并且特别适用于微电子和光电子器件的化学机械抛光或平面化，例如但不限于半导体晶片。

8. 发明申请

US20060254706A1 Polyurethane urea polishing pad 失效
公开(公告)号：US20060254706A1
公开(公告)日：2006-11-16
申请号：US11489331
申请日：2006-07-19
申请人： Robert Swisher , Alan Wang , William Allison
发明人： Robert Swisher , Alan Wang , William Allison
IPC分类号： B29C44/04
CPC分类号： B24B37/205 , Y10T156/1057
摘要： The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

9. 发明申请

US20060089095A1 Polyurethane urea polishing pad 审中-公开
公开(公告)号：US20060089095A1
公开(公告)日：2006-04-27
申请号：US10974528
申请日：2004-10-27
申请人： Robert Swisher , Alan Wang , William Allison
发明人： Robert Swisher , Alan Wang , William Allison
IPC分类号： B24D11/00
CPC分类号： B24B37/205 , Y10T156/1057
摘要： The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

10. 发明申请

US20060089094A1 Polyurethane urea polishing pad 审中-公开
标题翻译：聚氨酯尿素抛光垫
公开(公告)号：US20060089094A1
公开(公告)日：2006-04-27
申请号：US10974517
申请日：2004-10-27
申请人： Robert Swisher , Alan Wang , William Allison
发明人： Robert Swisher , Alan Wang , William Allison
IPC分类号： B24D11/00
CPC分类号： B24B37/205 , B24D3/32 , B32B3/18 , B32B5/18 , B32B5/20 , B32B27/065 , B32B27/36 , B32B2264/102 , B32B2266/0278 , B32B2266/08 , B32B2307/412 , B32B2307/554 , B32B2432/00 , B32B2457/14 , B32B2475/00
摘要： The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.
摘要翻译：本发明涉及用于改变工件表面的制品或具有窗口的抛光垫。特别地，抛光垫包括聚氨酯脲材料，其中聚氨酯脲材料含有至少部分填充有气体的电池。聚氨酯脲材料可以通过混合多异氰酸酯和/或聚氨酯预聚物，含羟基的材料，含胺材料和发泡剂来制备。根据本发明的抛光垫可用于抛光制品，并且特别适用于微电子和光电子器件的化学机械抛光或平面化，例如但不限于半导体晶片。抛光垫的窗口至少部分是透明的，因此，可以特别有用于抛光或平面化具有通过压板晶片计量的工具。

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