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    • 3. 发明授权
    • Process for making masks with structures in the submicron range
    • 用于制作带有结构的遮罩的方法
    • US5055383A
    • 1991-10-08
    • US420870
    • 1989-10-12
    • Otto KoblingerKlaus MeissnerReinhold MuhlHans-Joachim TrumppWerner Zapka
    • Otto KoblingerKlaus MeissnerReinhold MuhlHans-Joachim TrumppWerner Zapka
    • G03F1/08G03F7/00G03F7/09H01L21/027H01L21/30H01L21/306H01L21/3065H01L21/308H01L21/311
    • G03F7/0035G03F7/094H01L21/0271H01L21/30608H01L21/3065H01L21/3081H01L21/31144
    • In the course of the process for making masks with structures in the submicrometer range, initially structures of photoresist or polymer material with horizontal and substantially vertical sidewalls are produced on a silicon substrate covered with an oxide layer. This is followed by a layer of silicon nitride which is deposited by LPCVD. The resultant structure is planarized with a photoresist which is etched back until the start of the vertical edges of the sidewall coating formed by the nitride layer is bared on the photoresist structures. In a photolithographic step, a trimming mask is produced on the surface of the nitride layer and the planarizing resist. The bared regions of the nitride layer are then removed by isotropic etching. The dimensions A-B of the openings defined after removal of the nitride layer from the vertical surfaces of the photoresist structures are transferred to the oxide layer by anisotropic etching. Concurrently with these structures of minimum line width, registration marks are generated which allow the adjustment necessary for a further photolithographic step to be carried out with maximum accuracy. After removal of the trimming mask, the planarizing resist, the photoresist structures and the remainder of the nitride layer, structures with coarser line widths are defined in a further photolithographic step, which are also transferred to the oxide layer. Using the oxide layer as a mask, trenches of the desired depth are produced in the silicon substrate by anisotropic etching. The mask is thinned by anisotropic etching, and the oxide layers are removed from the front and the back side by wet etching.
    • 在制造具有亚微米范围内的结构的掩模的过程中,最初在被氧化物层覆盖的硅衬底上产生具有水平和基本垂直侧壁的光致抗蚀剂或聚合物材料的结构。 之后是通过LPCVD沉积的一层氮化硅。 所得到的结构被蚀刻后的光致抗蚀剂平坦化,直到由氮化物层形成的侧壁涂层的垂直边缘的开始在光致抗蚀剂结构上露出。 在光刻步骤中,在氮化物层和平坦化抗蚀剂的表面上制造修整掩模。 然后通过各向同性蚀刻除去氮化物层的裸露区域。 在从光致抗蚀剂结构的垂直表面去除氮化物层之后限定的开口的尺寸A-B通过各向异性蚀刻转移到氧化物层。 与最小线宽度的这些结构同时产生对准标记,其允许以最大精度执行进一步的光刻步骤所必需的调整。 在去除修剪掩模之后,在另外的光刻步骤中限定平坦化抗蚀剂,光致抗蚀剂结构和氮化物层的其余部分,具有较宽线宽的结构也被转移到氧化物层。 使用氧化物层作为掩模,通过各向异性蚀刻在硅衬底中产生所需深度的沟槽。 通过各向异性蚀刻使掩模变薄,并且通过湿蚀刻从前侧和后侧去除氧化物层。
    • 5. 发明授权
    • Mask for ion, electron or X-ray lithography and method of making it
    • 用于离子,电子或X射线光刻的掩模及其制作方法
    • US4855197A
    • 1989-08-08
    • US44929
    • 1987-05-01
    • Werner ZapkaJurgen KempfJoachim KeyserKarl Asch
    • Werner ZapkaJurgen KempfJoachim KeyserKarl Asch
    • G03F1/20G03F1/22G03F7/20H01L21/027
    • G03F1/20G03F1/22G03F7/70875Y10S430/167
    • A mask for radiation beam lithography is formed from a semiconductor wafer by thinning a region into a membrane with a hole pattern defining the pattern of the mask. The membrane is doped with a tensile stress-generating material so that minimum doping exists at the periphery of the membrane with the maximum at its center. The difference in doping between the periphery and the center is chosen so that when the mask is irradiated with a given beam current intensity, the membrane is tension-free. To make a mask in the wafer, a hole pattern is formed by etching holes in the membrane or by depositing a layer on the membrane. The wafer is thinned from the opposite surface until the holes in the hole pattern are throughholes or until the desired thickness is reached. The membrane is doped with tensile-stress-generating material using ion implantation or diffusion proportionally to the temperature distribution existing in the membrane during irradiation with exposure beams.
    • 用半导体晶片形成用于辐射束光刻的掩模,通过将区域变薄成具有限定掩模图案的孔图案的膜。 膜被拉伸应力产生材料掺杂,使得最小掺杂存在于膜的周边处,其中心处具有最大值。 选择周边和中心之间的掺杂差异,使得当以给定的束电流强度照射掩模时,膜是无张力的。 为了在晶片中制作掩模,通过蚀刻膜中的孔或通过在膜上沉积一层形成孔图案。 晶片从相对表面变薄,直到孔图案中的孔为通孔,或直到达到所需厚度。 使用离子注入或扩散成膜时,利用曝光光束照射期间膜与存在于膜中的温度分布成比例地掺入拉伸应力产生材料。
    • 10. 发明授权
    • Error-corrected corpuscular beam lithography
    • 误差校正微粒束光刻
    • US4578587A
    • 1986-03-25
    • US694888
    • 1985-01-25
    • Uwe BehringerHarald BohlenPeter NehmizWerner Zapka
    • Uwe BehringerHarald BohlenPeter NehmizWerner Zapka
    • G03F1/00G01B11/00G03F1/08G03F1/16G03F7/20H01J37/304H01J37/317H01L21/027H01L21/30H01L21/66
    • B82Y10/00B82Y40/00H01J37/304H01J37/3174H01J2237/30455H01J2237/31794H01J2237/31798
    • An apparatus and method for testing transmission masks for corpuscular lithography, in which an image of a portion of mask is guided across a pinhole diaphragm, comprising at least one aperture with submicron dimensions, by inclining the corpuscular beam. The relative spacing of two measuring points is derived from the interferometrically measured table displacement and the beam inclination. This test for geometrical errors is effected by placing below the single hold in the diaphragm a scintillator followed by a photomultiplier coupled to an output circuit.For testing the entire mask area for errors and impurity particles, a multihole diaphragm, having submicron apertures arranged in matrix fashion, can be used above an integrated circuit of the charge transfer type which provides a MOS capacitor as a particle detector underneath each diaphragm opening. The exposure mask is scanned in steps, effecting several single exposures at each position by inclining the beam.
    • 一种用于测试用于微粒光刻的透射掩模的装置和方法,其中通过使颗粒光束倾斜,掩模的一部分的图像被引导穿过针孔膜片,包括至少一个具有亚微米尺寸的孔。 两个测量点的相对间距来自干涉测量台位移和梁倾角。 这种几何误差的测试是通过放置在隔膜中的单个保持下面的闪烁器,然后耦合到输出电路的光电倍增管来实现的。 为了测试整个掩模区域的误差和杂质颗粒,可以在电荷转移类型的集成电路之上使用具有以矩阵方式布置的亚微米孔的多孔隔膜,其提供MOS电容器作为每个隔膜开口下方的颗粒检测器。 曝光掩模逐步扫描,通过倾斜光束在每个位置进行几次单次曝光。