专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09429427B2 Inductive inertial sensor architecture and fabrication in packaging build-up layers 有权
标题翻译：感应惯性传感器结构和制造在包装堆积层
公开(公告)号：US09429427B2
公开(公告)日：2016-08-30
申请号：US13720876
申请日：2012-12-19
申请人： Qing Ma , Feras Eid , Kevin Lin , Johanna M. Swan , Weng Hong Teh , Valluri R. Rao
发明人： Qing Ma , Feras Eid , Kevin Lin , Johanna M. Swan , Weng Hong Teh , Valluri R. Rao
IPC分类号： G01C19/00 , G01C19/56 , G01C19/5776
CPC分类号： G01C19/56 , G01C19/5776
摘要： This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.
摘要翻译：本发明涉及采用磁驱动和/或感测架构的感应惯性传感器。在实施例中，平移陀螺仪利用在第一维度中制成的导电线圈作为在存在磁场的情况下驱动通过线圈的时变电流的函数。感应线圈记录在第二维度上作为角速度的函数变化的电感。在实施例中，振动线圈使得感测线圈中的第一和第二互感器作为角速度的函数彼此偏离。在实施例中，与一对曲折线圈相关联的自感量作为第二维度中的角速度的函数而变化。在实施例中，使用封装积层来制造感应惯性传感器，使得能够在诸如移动设备的小尺寸计算平台中有利的封装级集成惯性感测。

2. 发明申请

US20150002984A1 METHOD OF FORMING A MAGNETIC MEMS TUNABLE CAPACITOR 审中-公开
标题翻译：形成磁电MEMS电容器的方法
公开(公告)号：US20150002984A1
公开(公告)日：2015-01-01
申请号：US13931632
申请日：2013-06-28
申请人： Weng Hong TEH , Qing Ma , Johanna M. Swan , Valluri R. Rao
发明人： Weng Hong TEH , Qing Ma , Johanna M. Swan , Valluri R. Rao
IPC分类号： H01L25/16 , H01G7/00 , H01L43/02 , H01L49/02 , H01L43/12
CPC分类号： H01L25/16 , B81B3/0056 , B81B2201/0221 , H01G5/16 , H01G7/00 , H01L24/24 , H01L2224/04105 , H01L2224/24195 , H01L2224/32245 , H01L2224/73267 , H01L2924/12042 , H01L2924/19041 , H01L2924/19105 , H01L2924/00
摘要： An apparatus including a die; a carrier coupled to the die; and at least one capacitor positioned in or on the carrier, the at least one capacitor including a first electrode, a second electrode and a dielectric material; and a magnet positioned such that a magnetic field at least partially actuates the second electrode toward the first electrode. A method including disposing a die, a first electrode of a capacitor and a magnet on a sacrificial substrate; forming a dielectric layer on the first electrode; patterning a conductive material coupled to the first electrode; patterning a second electrode on the dielectric layer; and removing the sacrificial substrate. A method including exposing a suspended first electrode of a capacitor in a package to a magnetic field; driving a current in a first direction through the first electrode; and establishing a voltage difference between the first electrode and a second electrode.
摘要翻译：一种包括模具的设备; 耦合到管芯的载体; 以及位于所述载体中或载体上的至少一个电容器，所述至少一个电容器包括第一电极，第二电极和电介质材料; 以及定位成使得磁场至少部分地致动第二电极朝向第一电极的磁体。一种方法，包括在牺牲基板上设置管芯，电容器的第一电极和磁体; 在所述第一电极上形成介电层; 图案化耦合到所述第一电极的导电材料; 在所述电介质层上构图第二电极; 并去除牺牲衬底。一种包括将封装中的电容器的悬置的第一电极暴露于磁场的方法; 沿第一方向驱动电流通过第一电极; 以及在所述第一电极和第二电极之间建立电压差。

3. 发明申请

US20160284637A1 GLASS CORE SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES AND METHODS OF MAKING THE SAME 审中-公开
标题翻译：用于集成电路装置的玻璃核心基板及其制造方法
公开(公告)号：US20160284637A1
公开(公告)日：2016-09-29
申请号：US15172029
申请日：2016-06-02
申请人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
发明人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
IPC分类号： H01L23/498 , H01L21/48 , H01L23/367 , H01L23/15
CPC分类号： H05K1/112 , H01L21/4803 , H01L21/486 , H01L23/15 , H01L23/3675 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/10253 , H05K3/0014 , H05K3/4605 , H05K3/4644 , H05K2201/096 , H05K2201/09827 , H05K2201/10287 , H05K2201/10371 , H05K2201/10674 , H05K2203/0108 , H05K2203/0228 , H05K2203/025 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , H01L2924/00 , H01L2224/0401
摘要： Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.
摘要翻译：公开了用于集成电路（IC）装置的玻璃芯基板的实施例。玻璃芯基板包括在玻璃芯的相对侧上的玻璃芯和堆积结构。导电端子可以形成在玻璃芯基板的两侧。 IC芯片可以与衬底的一侧上的端子耦合，而相对侧上的端子可以与诸如电路板的下一级组件耦合。玻璃芯可以包括其中已经形成导体的单片玻璃，或者玻璃芯可以包括已经连接在一起的两个或更多个玻璃部分，每个部分具有导体。导体延伸穿过玻璃芯，并且一个或多个导体可以与设置在玻璃芯上的积聚结构电耦合。描述和要求保护其他实施例。

4. 发明授权

US10070524B2 Method of making glass core substrate for integrated circuit devices 有权
公开(公告)号：US10070524B2
公开(公告)日：2018-09-04
申请号：US13442092
申请日：2012-04-09
申请人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
发明人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
IPC分类号： H01R43/00 , H05K1/11 , H01L21/48 , H01L23/367 , H01L23/498 , H05K3/46 , H01L23/15 , H05K3/00
CPC分类号： H05K1/112 , H01L21/4803 , H01L21/486 , H01L23/15 , H01L23/3675 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/10253 , H05K3/0014 , H05K3/4605 , H05K3/4644 , H05K2201/096 , H05K2201/09827 , H05K2201/10287 , H05K2201/10371 , H05K2201/10674 , H05K2203/0108 , H05K2203/0228 , H05K2203/025 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , H01L2924/00 , H01L2224/0401
摘要： A glass core substrate for an integrated circuit (IC) device may be formed to include a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.

5. 发明申请

US20120192413A1 GLASS CORE SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES AND METHODS OF MAKING THE SAME 审中-公开
标题翻译：用于集成电路装置的玻璃核心基板及其制造方法
公开(公告)号：US20120192413A1
公开(公告)日：2012-08-02
申请号：US13442092
申请日：2012-04-09
申请人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
发明人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
IPC分类号： H01R43/00
CPC分类号： H05K1/112 , H01L21/4803 , H01L21/486 , H01L23/15 , H01L23/3675 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/10253 , H05K3/0014 , H05K3/4605 , H05K3/4644 , H05K2201/096 , H05K2201/09827 , H05K2201/10287 , H05K2201/10371 , H05K2201/10674 , H05K2203/0108 , H05K2203/0228 , H05K2203/025 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , H01L2924/00 , H01L2224/0401
摘要： Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.
摘要翻译：公开了用于集成电路（IC）装置的玻璃芯基板的实施例。玻璃芯基板包括在玻璃芯的相对侧上的玻璃芯和堆积结构。导电端子可以形成在玻璃芯基板的两侧。 IC芯片可以与衬底的一侧上的端子耦合，而相对侧上的端子可以与诸如电路板的下一级组件耦合。玻璃芯可以包括其中已经形成导体的单片玻璃，或者玻璃芯可以包括已经连接在一起的两个或更多个玻璃部分，每个部分具有导体。导体延伸穿过玻璃芯，并且一个或多个导体可以与设置在玻璃芯上的积聚结构电耦合。描述和要求保护其他实施例。

6. 发明申请

US20110147055A1 Glass core substrate for integrated circuit devices and methods of making the same 有权
标题翻译：用于集成电路器件的玻璃核心衬底及其制造方法
公开(公告)号：US20110147055A1
公开(公告)日：2011-06-23
申请号：US12653710
申请日：2009-12-17
申请人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
发明人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
IPC分类号： H05K1/03 , H05K3/10 , H05K3/36
CPC分类号： H05K1/112 , H01L21/4803 , H01L21/486 , H01L23/15 , H01L23/3675 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/10253 , H05K3/0014 , H05K3/4605 , H05K3/4644 , H05K2201/096 , H05K2201/09827 , H05K2201/10287 , H05K2201/10371 , H05K2201/10674 , H05K2203/0108 , H05K2203/0228 , H05K2203/025 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , H01L2924/00 , H01L2224/0401
摘要： Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.
摘要翻译：公开了用于集成电路（IC）装置的玻璃芯基板的实施例。玻璃芯基板包括在玻璃芯的相对侧上的玻璃芯和堆积结构。导电端子可以形成在玻璃芯基板的两侧。 IC芯片可以与衬底的一侧上的端子耦合，而相对侧上的端子可以与诸如电路板的下一级组件耦合。玻璃芯可以包括其中已经形成导体的单片玻璃，或者玻璃芯可以包括已经连接在一起的两个或更多个玻璃部分，每个部分具有导体。导体延伸穿过玻璃芯，并且一个或多个导体可以与设置在玻璃芯上的积聚结构电耦合。描述和要求保护其他实施例。

7. 发明授权

US08207453B2 Glass core substrate for integrated circuit devices and methods of making the same 有权
标题翻译：用于集成电路器件的玻璃核心衬底及其制造方法
公开(公告)号：US08207453B2
公开(公告)日：2012-06-26
申请号：US12653710
申请日：2009-12-17
申请人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
发明人： Qing Ma , Quan A. Tran , Robert L. Sankman , Johanna M. Swan , Valluri R. Rao
IPC分类号： H01L21/02
CPC分类号： H05K1/112 , H01L21/4803 , H01L21/486 , H01L23/15 , H01L23/3675 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/10253 , H05K3/0014 , H05K3/4605 , H05K3/4644 , H05K2201/096 , H05K2201/09827 , H05K2201/10287 , H05K2201/10371 , H05K2201/10674 , H05K2203/0108 , H05K2203/0228 , H05K2203/025 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , H01L2924/00 , H01L2224/0401
摘要： Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.
摘要翻译：公开了用于集成电路（IC）装置的玻璃芯基板的实施例。玻璃芯基板包括在玻璃芯的相对侧上的玻璃芯和堆积结构。导电端子可以形成在玻璃芯基板的两侧。 IC芯片可以与衬底的一侧上的端子耦合，而相对侧上的端子可以与诸如电路板的下一级组件耦合。玻璃芯可以包括其中已经形成导体的单片玻璃，或者玻璃芯可以包括已经连接在一起的两个或更多个玻璃部分，每个部分具有导体。导体延伸穿过玻璃芯，并且一个或多个导体可以与设置在玻璃芯上的积聚结构电耦合。描述和要求保护其他实施例。

8. 发明申请

US20140002178A1 SEMICONDUCTOR PACKAGE WITH MECHANICAL FUSE 有权
标题翻译：具有机械保险丝的半导体封装
公开(公告)号：US20140002178A1
公开(公告)日：2014-01-02
申请号：US13537573
申请日：2012-06-29
申请人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
发明人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
IPC分类号： H01L29/84 , H01H85/48
CPC分类号： H01L24/19 , H01H1/0036 , H01H59/0009 , H01L23/5382 , H01L23/5389 , H01L2224/04105 , H01L2224/73267 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
摘要翻译：描述了具有机械熔断器的半导体封装以及形成其中具有机械熔丝的半导体封装的方法。例如，半导体结构包括半导体封装。半导体管芯被容纳在半导体封装中。微机电系统（MEMS）装置容纳在半导体封装中。 MEMS器件具有悬挂部分。机械保险丝容纳在半导体封装中，并且耦合到MEMS器件的悬置部分或从MEMS器件的悬挂部分解耦。

9. 发明申请

US20140083858A1 HETEROGENEOUS INTEGRATION OF MICROFLUIDIC DEVICES IN PACKAGE STRUCTURES 有权
标题翻译：微型流体装置在包装结构中的异质整合
公开(公告)号：US20140083858A1
公开(公告)日：2014-03-27
申请号：US13624288
申请日：2012-09-21
申请人： Weng Hong Teh , Kevin Lin , Feras Eid , Qing Ma
发明人： Weng Hong Teh , Kevin Lin , Feras Eid , Qing Ma
IPC分类号： B01D43/00 , H05K3/30
CPC分类号： H05K1/0272 , H01L21/568 , H01L24/19 , H01L24/20 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2924/1815 , H01L2924/18162 , H05K1/0212 , H05K1/185 , H05K3/0097 , H05K2201/097 , H05K2203/1536 , H05K2203/308 , Y10T29/4913
摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.
摘要翻译：描述了形成微电子封装结构的方法及由此形成的相关结构。这些方法可以包括将微流体管芯附接到封装结构，其中微流体管芯包括可以与设置在封装结构内的信号焊盘耦合的多个不对称电极。

10. 发明授权

US08633551B1 Semiconductor package with mechanical fuse 有权
标题翻译：半导体封装带机械保险丝
公开(公告)号：US08633551B1
公开(公告)日：2014-01-21
申请号：US13537573
申请日：2012-06-29
申请人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
发明人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
IPC分类号： H01L27/14
CPC分类号： H01L24/19 , H01H1/0036 , H01H59/0009 , H01L23/5382 , H01L23/5389 , H01L2224/04105 , H01L2224/73267 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
摘要翻译：描述了具有机械熔断器的半导体封装以及形成其中具有机械熔丝的半导体封装的方法。例如，半导体结构包括半导体封装。半导体管芯被容纳在半导体封装中。微机电系统（MEMS）装置容纳在半导体封装中。 MEMS器件具有悬挂部分。机械保险丝容纳在半导体封装中，并且耦合到MEMS器件的悬置部分或从MEMS器件的悬挂部分解耦。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式