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1. 发明授权

US09250261B2 Method, apparatus and system for providing metering of acceleration 有权
标题翻译：用于提供加速度计量的方法，装置和系统
公开(公告)号：US09250261B2
公开(公告)日：2016-02-02
申请号：US13730634
申请日：2012-12-28
申请人： Kevin L. Lin , Feras Eid , Qing Ma
发明人： Kevin L. Lin , Feras Eid , Qing Ma
IPC分类号： G01P15/105 , G01P15/08
CPC分类号： G01P15/105 , G01P15/08
摘要： Techniques and mechanisms to provide for metering acceleration. In an embodiment, a microelectromechanical accelerometer includes a magnet, a mass, and a first support beam portion and second support beam portion for suspension of the mass. Resonance frequency characteristics of the first support beam portion and second support beam portion, based on the magnet and a current conducted by the first support beam portion and second support beam portion, are indicative of acceleration of the mass. In another embodiment, the accelerometer further includes a first wire portion and a second wire portion which are each coupled to the mass and further coupled to a respective anchor for exchanging a signal with the first wire portion and the second wire portion. The first wire portion and the second wire portion provide for biasing of the mass.
摘要翻译：提供计量加速度的技术和机制。在一个实施例中，微机电加速度计包括用于悬挂质量的磁体，质量块和第一支撑梁部分和第二支撑梁部分。基于磁体的第一支撑梁部分和第二支撑梁部分的共振频率特性以及由第一支撑梁部分和第二支撑梁部分传导的电流表示质量的加速度。在另一个实施例中，加速度计还包括第一线部分和第二线部分，每个第一线部分和第二线部分均耦合到质量块，并且还耦合到相应的锚，用于与第一线部分和第二线部分交换信号。第一线部分和第二线部分提供质量的偏压。

2. 发明申请

US20160076961A1 SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR 审中-公开
标题翻译：带空气压力传感器的半导体封装
公开(公告)号：US20160076961A1
公开(公告)日：2016-03-17
申请号：US14951422
申请日：2015-11-24
申请人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
IPC分类号： G01L9/00 , B81B7/00
CPC分类号： G01L9/0042 , B81B7/0058 , B81B7/0077 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00246 , G01L9/0047 , G01L9/007 , G01L9/0073 , H01L24/19 , H01L29/84 , H01L2224/04105 , H01L2224/24137 , H01L2924/1461 , H01L2924/18162
摘要： A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
摘要翻译：描述了具有空气压力传感器的半导体封装和形成具有气压传感器的半导体封装的方法。例如，半导体封装包括多个堆积层。空腔设置在一个或多个堆积层中。空气压力传感器设置在多个积聚层中，并且包括空腔和设置在空腔上方的电极。还描述了制造具有气密密封区域的半导体封装的各种方法。

3. 发明授权

US09200973B2 Semiconductor package with air pressure sensor 有权
标题翻译：半导体封装带气压传感器
公开(公告)号：US09200973B2
公开(公告)日：2015-12-01
申请号：US13536210
申请日：2012-06-28
申请人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
IPC分类号： G01L9/16 , G01L9/00 , B81B7/00 , B81C1/00 , H01L29/84
CPC分类号： G01L9/0042 , B81B7/0058 , B81B7/0077 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00246 , G01L9/0047 , G01L9/007 , G01L9/0073 , H01L24/19 , H01L29/84 , H01L2224/04105 , H01L2224/24137 , H01L2924/1461 , H01L2924/18162
摘要： A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
摘要翻译：描述了具有空气压力传感器的半导体封装和形成具有气压传感器的半导体封装的方法。例如，半导体封装包括多个堆积层。空腔设置在一个或多个堆积层中。空气压力传感器设置在多个积聚层中，并且包括空腔和设置在空腔上方的电极。还描述了制造具有气密密封区域的半导体封装的各种方法。

4. 发明授权

US08975138B2 Method of creating a maskless air gap in back end interconnects with double self-aligned vias 有权
标题翻译：在具有双自对准通孔的后端互连中产生无掩蔽气隙的方法
公开(公告)号：US08975138B2
公开(公告)日：2015-03-10
申请号：US13931219
申请日：2013-06-28
申请人： Manish Chandhok , Hui Jae Yoo , Yan A. Borodovsky , Florian Gstrein , David N. Shykind , Kevin L. Lin
发明人： Manish Chandhok , Hui Jae Yoo , Yan A. Borodovsky , Florian Gstrein , David N. Shykind , Kevin L. Lin
IPC分类号： H01L21/336 , H01L21/461 , H01L21/8234 , H01L23/535 , H01L21/768
CPC分类号： H01L23/5226 , H01L21/32133 , H01L21/32139 , H01L21/76802 , H01L21/7682 , H01L21/76877 , H01L21/76879 , H01L21/76883 , H01L21/76885 , H01L21/76886 , H01L21/76897 , H01L23/5222 , H01L23/528 , H01L23/53209 , H01L23/53271 , H01L23/5329 , H01L23/53295 , H01L23/535 , H01L2924/0002 , H01L2924/00
摘要： A method including patterning a thickness dimension of an interconnect material into a thickness dimension for a wiring line with one or more vias extending from the wiring line and introducing a dielectric material on the interconnect material. A method including depositing and patterning an interconnect material into a wiring line and one or more vias; and introducing a dielectric material on the interconnect material such that the one or more vias are exposed through the dielectric material. An apparatus including a first interconnect layer in a first plane and a second interconnect in a second plane on a substrate; and a dielectric layer separating the first and second interconnect layers, wherein the first interconnect layer comprises a monolith including a wiring line and at least one via, the at least one via extending from the wiring line to a wiring line of the second interconnect layer.
摘要翻译：一种方法，包括将互连材料的厚度尺寸图案化为具有从布线延伸的一个或多个通孔的布线的厚度尺寸，并将介电材料引入到互连材料上。一种包括将互连材料沉积和图案化成布线和一个或多个通孔的方法; 以及在所述互连材料上引入介电材料，使得所述一个或多个通孔通过所述介电材料暴露。一种装置，包括在第一平面中的第一互连层和在衬底上的第二平面中的第二互连; 以及分离所述第一和第二互连层的电介质层，其中所述第一互连层包括包括布线和至少一个通孔的整体，所述至少一个通孔从所述布线延伸到所述第二互连层的布线。

5. 发明授权

US08633551B1 Semiconductor package with mechanical fuse 有权
标题翻译：半导体封装带机械保险丝
公开(公告)号：US08633551B1
公开(公告)日：2014-01-21
申请号：US13537573
申请日：2012-06-29
申请人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
发明人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
IPC分类号： H01L27/14
CPC分类号： H01L24/19 , H01H1/0036 , H01H59/0009 , H01L23/5382 , H01L23/5389 , H01L2224/04105 , H01L2224/73267 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
摘要翻译：描述了具有机械熔断器的半导体封装以及形成其中具有机械熔丝的半导体封装的方法。例如，半导体结构包括半导体封装。半导体管芯被容纳在半导体封装中。微机电系统（MEMS）装置容纳在半导体封装中。 MEMS器件具有悬挂部分。机械保险丝容纳在半导体封装中，并且耦合到MEMS器件的悬置部分或从MEMS器件的悬挂部分解耦。

6. 发明申请

US20140000377A1 SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR 有权
标题翻译：带空气压力传感器的半导体封装
公开(公告)号：US20140000377A1
公开(公告)日：2014-01-02
申请号：US13536210
申请日：2012-06-28
申请人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
IPC分类号： H01L29/84 , G01L9/00
CPC分类号： G01L9/0042 , B81B7/0058 , B81B7/0077 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00246 , G01L9/0047 , G01L9/007 , G01L9/0073 , H01L24/19 , H01L29/84 , H01L2224/04105 , H01L2224/24137 , H01L2924/1461 , H01L2924/18162
摘要： A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
摘要翻译：描述了具有空气压力传感器的半导体封装和形成具有气压传感器的半导体封装的方法。例如，半导体封装包括多个堆积层。空腔设置在一个或多个堆积层中。空气压力传感器设置在多个积聚层中，并且包括空腔和设置在空腔上方的电极。还描述了制造具有气密密封区域的半导体封装的各种方法。

7. 发明申请

US20190393151A1 Nitrogen Assisted Oxide Gapfill 审中-公开
公开(公告)号：US20190393151A1
公开(公告)日：2019-12-26
申请号：US16015704
申请日：2018-06-22
申请人： Sudipto Naskar , Manish Chandhok , Kevin L. Lin , Ryan Pearce
发明人： Sudipto Naskar , Manish Chandhok , Kevin L. Lin , Ryan Pearce
IPC分类号： H01L23/528 , H01L27/118 , H01L21/768
摘要： An embodiment includes a dielectric material; a trench included in the dielectric material, the trench having first and second opposing sidewalls; wherein the trench includes: (a)(i) a first trench portion extending from the first sidewall to the second sidewall, (a)(ii) a second trench portion extending from the first sidewall to the second sidewall, and (a)(iii) a third trench portion extending from the first sidewall to the second sidewall; wherein the second trench portion is between the first trench portion and the third trench portion; wherein the first trench portion is substantially filled with a first material, the second trench portion is substantially filled with a second material, and the third trench portion is substantially filled with a third material; wherein (b)(i) the first material includes nitrogen, and (b)(ii) the first material includes more nitrogen than the third material. Other embodiments are described herein.

8. 发明申请

US20150091890A1 RENDERING TECHNIQUES FOR TEXTURED DISPLAYS 有权
标题翻译：用于纹理显示的渲染技术
公开(公告)号：US20150091890A1
公开(公告)日：2015-04-02
申请号：US14040101
申请日：2013-09-27
申请人： Nathan R. Andrysco , Kevin L. Lin
发明人： Nathan R. Andrysco , Kevin L. Lin
IPC分类号： G06T15/04
CPC分类号： G09G3/3473 , G09G3/002 , G09G2320/0233 , G09G2320/0242 , G09G2340/06
摘要： Rendering techniques are disclosed for displays capable of adjusting/changing the angle of individual pixels (or pixel groups), referred to herein as textured displays. The textured displays may be capable of creating on demand textures which may be used to simulate the surface of an object in a scene. The rendering techniques may be used to improve upon the realism of rendered scenes/objects and they may provide users with a unique rendering experience whereby the textured display physically changes to mimic textures of the rendered scenes/objects. This can be achieved by sending geometric data, such as surface normal information, to individual pixels of the textured display. Other factors may be considered when adjusting the angle of individual pixels of the textured display, such as whether the user is experiencing too much glare.
摘要翻译：公开了用于能够调整/改变单个像素（或像素组）的角度的显示器的渲染技术，这里称为纹理显示。有纹理的显示器可能能够创建可以用于模拟场景中的对象的表面的按需纹理。渲染技术可以用于改进渲染场景/对象的真实性，并且它们可以向用户提供独特的渲染体验，由此纹理化显示物理上改变以模拟渲染的场景/对象的纹理。这可以通过将几何数据（诸如表面法线信息）发送到纹理显示器的各个像素来实现。当调整纹理显示器的各个像素的角度时，例如用户是否经历过多的眩光，可以考虑其他因素。

9. 发明申请

US20140182377A1 METHOD, APPARATUS AND SYSTEM FOR PROVIDING METERING OF ACCELERATION 有权
标题翻译：方法，提供加速度计的装置和系统
公开(公告)号：US20140182377A1
公开(公告)日：2014-07-03
申请号：US13730634
申请日：2012-12-28
申请人： Kevin L. Lin , Faras Eid , Qing Ma
发明人： Kevin L. Lin , Faras Eid , Qing Ma
IPC分类号： G01P15/10 , B81C1/00 , B81B3/00
CPC分类号： G01P15/105 , G01P15/08
摘要： Techniques and mechanisms to provide for metering acceleration. In an embodiment, a microelectromechanical accelerometer includes a magnet, a mass, and a first support beam portion and second support beam portion for suspension of the mass. Resonance frequency characteristics of the first support beam portion and second support beam portion, based on the magnet and a current conducted by the first support beam portion and second support beam portion, are indicative of acceleration of the mass. In another embodiment, the accelerometer further includes a first wire portion and a second wire portion which are each coupled to the mass and further coupled to a respective anchor for exchanging a signal with the first wire portion and the second wire portion. The first wire portion and the second wire portion provide for biasing of the mass.
摘要翻译：提供计量加速度的技术和机制。在一个实施例中，微机电加速度计包括用于悬挂质量的磁体，质量块和第一支撑梁部分和第二支撑梁部分。基于磁体的第一支撑梁部分和第二支撑梁部分的共振频率特性以及由第一支撑梁部分和第二支撑梁部分传导的电流表示质量的加速度。在另一个实施例中，加速度计还包括第一线部分和第二线部分，每个第一线部分和第二线部分均耦合到质量块，并且还耦合到相应的锚，用于与第一线部分和第二线部分交换信号。第一线部分和第二线部分提供质量的偏压。

10. 发明申请

US20140002178A1 SEMICONDUCTOR PACKAGE WITH MECHANICAL FUSE 有权
标题翻译：具有机械保险丝的半导体封装
公开(公告)号：US20140002178A1
公开(公告)日：2014-01-02
申请号：US13537573
申请日：2012-06-29
申请人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
发明人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
IPC分类号： H01L29/84 , H01H85/48
CPC分类号： H01L24/19 , H01H1/0036 , H01H59/0009 , H01L23/5382 , H01L23/5389 , H01L2224/04105 , H01L2224/73267 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
摘要翻译：描述了具有机械熔断器的半导体封装以及形成其中具有机械熔丝的半导体封装的方法。例如，半导体结构包括半导体封装。半导体管芯被容纳在半导体封装中。微机电系统（MEMS）装置容纳在半导体封装中。 MEMS器件具有悬挂部分。机械保险丝容纳在半导体封装中，并且耦合到MEMS器件的悬置部分或从MEMS器件的悬挂部分解耦。

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