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    • 2. 发明申请
    • Integrated magnetoresitive speed and direction sensor
    • 集成磁阻速度和方向传感器
    • US20060006864A1
    • 2006-01-12
    • US10940091
    • 2004-09-14
    • Curtis JohnsonGregory FurlongWayne LambWayne Kilian
    • Curtis JohnsonGregory FurlongWayne LambWayne Kilian
    • G01R33/02
    • G01P13/04G01D5/145G01D5/2451G01P3/487
    • An integrated circuit magnetoresistive speed and direction sensor generally utilizes an AMR bridge circuit thereby allowing for increased air gap performance as compared to conventional Hall-effect element based sensors. The AMR sensor is capable of sensing ring magnets or bar magnets magnetized with one or more magnet poles along the desired travel. The number of poles of the magnet should be optimized based upon the application design. In order to obtain speed and direction information, two bridge circuits can be placed within proximity (I.e., the exact location and shape of the bridge can be determined based upon the target and desired performance) of each other. The signals of the two bridge circuits can be compared on integrated electronics. The bridges are generally rotated 45 degrees to reduce and/or eliminate offsets, which provide the sensor with a large air gap performance.
    • 与传统的基于霍尔效应元件的传感器相比,集成电路磁阻速度和方向传感器通常利用AMR桥式电路,从而允许增加气隙性能。 AMR传感器能够沿着所需的行程感应环形磁铁或磁铁磁棒磁棒。 应根据应用设计优化磁体的极数。 为了获得速度和方向信息,可以将两个桥接电路放置在邻近处(即,可以基于目标和期望的性能来确定桥的确切位置和形状)。 可以在集成电路上比较两个桥接电路的信号。 桥通常旋转45度以减少和/或消除偏移,这为传感器提供了大的气隙性能。
    • 4. 发明申请
    • Thermoplastic overmolding for small package turbocharger speed sensor
    • 小包装涡轮增压器速度传感器的热塑性包覆成型
    • US20070139044A1
    • 2007-06-21
    • US11314328
    • 2005-12-20
    • Wayne LambScott MichelhaughPeter SchelonkaJoel Stolfus
    • Wayne LambScott MichelhaughPeter SchelonkaJoel Stolfus
    • G01B7/30
    • G01P1/026G01D11/245H05K3/202Y10T29/53052
    • A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.
    • 传感器封装装置包括支撑一个或多个电气部件的引线框架基板,其连接到并位于引线框架基板上。 还提供了多个引线键合,其将电气部件电连接到引线框架基板,其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件,从而提供传感器 包括引线框架基板,电气部件和引线接合的封装装置,同时不需要印刷电路板(PCB)或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂和/或焊料以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件(例如,磁阻部件)或感测芯片。
    • 5. 发明申请
    • Chip on lead frame for small package speed sensor
    • 芯片在引线框架上用于小型封装速度传感器
    • US20070126088A1
    • 2007-06-07
    • US11295371
    • 2005-12-05
    • Lawrence FrazeeWayne LambJohn PatinPeter SchelonkaJoel Stolfus
    • Lawrence FrazeeWayne LambJohn PatinPeter SchelonkaJoel Stolfus
    • H01L23/495
    • H01L23/49575G01D11/245H01L2224/48091H01L2224/49171H01L2924/00014
    • A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.
    • 传感器封装装置包括支撑一个或多个电气部件的引线框架基板,其连接到并位于引线框架基板上。 还提供了多个引线键合,其将电气部件电连接到引线框架基板,其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件,从而提供传感器 包括引线框架基板,电气部件和引线接合的封装装置,同时不需要印刷电路板(PCB)或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件(例如,磁阻部件)或感测芯片。
    • 6. 发明申请
    • Centrifugal clutch balanced design
    • 离心式离合器平衡设计
    • US20060020436A1
    • 2006-01-26
    • US10955313
    • 2004-09-30
    • Kenneth BechtoldWayne Lamb
    • Kenneth BechtoldWayne Lamb
    • G06G7/48
    • F16D43/16F16D2250/00
    • A methodology and system for balancing a centrifugal clutch can be implemented that includes a 3-dimensional model of a centrifugal clutch assembly in an engaged position thereof. A mass center of the centrifugal clutch assembly can be calculated, and a distance from the axis of rotation of the centrifugal clutch assembly can be determined. Thereafter, associated part features of the centrifugal clutch assembly can be modified in order to move the mass center; and repeating as necessary establishing a 3-dimensional model of a centrifugal clutch assembly in an engaged position thereof, calculating a mass center of the centrifugal clutch assembly, determining a particular distance from an axis of rotation of the centrifugal clutch assembly, and modifying part features of the centrifugal clutch assembly in order to move the mass center in order to verify the axis of rotation and thereby balance the centrifugal clutch assembly.
    • 可以实现用于平衡离心式离合器的方法和系统,其包括处于其接合位置的离心式离合器组件的三维模型。 可以计算离心式离合器组件的质量中心,并且可以确定离心离合器组件的旋转轴线的距离。 此后,可以改变离心式离合器组件的相关部件特征以移动质心; 并根据需要重复地建立其离合离合器组件的接合位置的三维模型,计算离心离合器组件的质量中心,确定离心离合器组件的旋转轴线的特定距离,以及修改部件特征 以便移动质心,以便验证旋转轴线,从而平衡离心离合器组件。