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1. 发明申请

US20070139044A1 Thermoplastic overmolding for small package turbocharger speed sensor 有权
标题翻译：小包装涡轮增压器速度传感器的热塑性包覆成型
公开(公告)号：US20070139044A1
公开(公告)日：2007-06-21
申请号：US11314328
申请日：2005-12-20
申请人： Wayne Lamb , Scott Michelhaugh , Peter Schelonka , Joel Stolfus
发明人： Wayne Lamb , Scott Michelhaugh , Peter Schelonka , Joel Stolfus
IPC分类号： G01B7/30
CPC分类号： G01P1/026 , G01D11/245 , H05K3/202 , Y10T29/53052
摘要： A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.
摘要翻译：传感器封装装置包括支撑一个或多个电气部件的引线框架基板，其连接到并位于引线框架基板上。还提供了多个引线键合，其将电气部件电连接到引线框架基板，其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件，从而提供传感器包括引线框架基板，电气部件和引线接合的封装装置，同时不需要印刷电路板（PCB）或陶瓷基板代替引线框架基板作为传感器封装的一部分仪器。还可以提供导电环氧树脂和/或焊料以保持电气部件与引线框架基板的连接。电气部件可以构成例如IC芯片和/或感测元件（例如，磁阻部件）或感测芯片。

2. 发明申请

US20060283232A1 Magnet orientation and calibration for small package turbocharger speed sensor 有权
标题翻译：小型涡轮增压器速度传感器的磁铁取向和校准
公开(公告)号：US20060283232A1
公开(公告)日：2006-12-21
申请号：US11155203
申请日：2005-06-15
申请人： Wayne Lamb , Lawrence Frazee , Peter Schelonka , Joel Stolfus
发明人： Wayne Lamb , Lawrence Frazee , Peter Schelonka , Joel Stolfus
IPC分类号： G01P21/02
CPC分类号： G01D11/245 , F02B39/16 , F05B2220/40 , G01D5/147 , G01P1/026 , G01P3/488 , Y10T29/4978
摘要： A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.
摘要翻译：一种用于定向和校准用于速度传感器的磁体的方法和系统。可以将磁体映射到其两个或更多个平面，以便相对于保持在速度传感器壳体内的一个或多个磁阻元件精确地定位磁体。然后可以响应于磁体的映射来识别磁体相对于磁阻元件和传感器外壳的光学位置。此后，可以将磁体接合到速度传感器壳体，以便实现由速度传感器壳体保持的用于速度检测操作的速度传感器。

3. 发明申请

US20070126088A1 Chip on lead frame for small package speed sensor 有权
标题翻译：芯片在引线框架上用于小型封装速度传感器
公开(公告)号：US20070126088A1
公开(公告)日：2007-06-07
申请号：US11295371
申请日：2005-12-05
申请人： Lawrence Frazee , Wayne Lamb , John Patin , Peter Schelonka , Joel Stolfus
发明人： Lawrence Frazee , Wayne Lamb , John Patin , Peter Schelonka , Joel Stolfus
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , G01D11/245 , H01L2224/48091 , H01L2224/49171 , H01L2924/00014
摘要： A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.
摘要翻译：传感器封装装置包括支撑一个或多个电气部件的引线框架基板，其连接到并位于引线框架基板上。还提供了多个引线键合，其将电气部件电连接到引线框架基板，其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件，从而提供传感器包括引线框架基板，电气部件和引线接合的封装装置，同时不需要印刷电路板（PCB）或陶瓷基板代替引线框架基板作为传感器封装的一部分仪器。还可以提供导电环氧树脂以保持电气部件与引线框架基板的连接。电气部件可以构成例如IC芯片和/或感测元件（例如，磁阻部件）或感测芯片。

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