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1. 发明授权

US08080874B1 Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween 有权
标题翻译：在集成电路和电路板之间提供额外的空间，用于在其间定位组件
公开(公告)号：US08080874B1
公开(公告)日：2011-12-20
申请号：US11855826
申请日：2007-09-14
申请人： Jeremy Werner , Daniel L. Rosenband , Jeremy Matthew Plunkett , William L. Schmidt , David T. Wang , Wael O. Zohni , Philip Arnold Ferolito , Michael John Sebastian Smith , Suresh Natarajan Rajan , Joseph C. Fjelstad
发明人： Jeremy Werner , Daniel L. Rosenband , Jeremy Matthew Plunkett , William L. Schmidt , David T. Wang , Wael O. Zohni , Philip Arnold Ferolito , Michael John Sebastian Smith , Suresh Natarajan Rajan , Joseph C. Fjelstad
IPC分类号： H01L23/34 , H01L23/48
CPC分类号： H05K1/181 , H01L23/13 , H01L23/3128 , H01L23/5387 , H01L24/16 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01087 , H01L2924/1203 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1304 , H01L2924/14 , H01L2924/1424 , H01L2924/1436 , H01L2924/15159 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/0281 , H05K1/141 , H05K1/147 , H05K2201/10454 , H05K2201/10484 , H05K2201/10515 , H05K2201/10522 , H05K2201/2018 , Y02P70/611 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.
摘要翻译：包括系统，方法和装置，用于在集成电路封装和电路板之间提供额外的空间。提供了包括多个集成电路封装触点的集成电路封装。还提供了与集成电路封装电通信的电路板。此外，集成电路封装，集成电路触点和/或电路板被配置为在集成电路封装和电路板之间提供额外的空间，以将至少一部分的至少一部分置于集成电路封装和电路板。

2. 发明授权

US08705240B1 Embossed heat spreader 有权
公开(公告)号：US08705240B1
公开(公告)日：2014-04-22
申请号：US13620412
申请日：2012-09-14
申请人： Wael O. Zohni , William L. Schmidt , Michael John Sebastian Smith , Jeremy Matthew Plunkett
发明人： Wael O. Zohni , William L. Schmidt , Michael John Sebastian Smith , Jeremy Matthew Plunkett
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： H05K7/20509 , H01L23/367 , H01L23/4093 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

3. 发明授权

US08081474B1 Embossed heat spreader 有权
标题翻译：压花散热器
公开(公告)号：US08081474B1
公开(公告)日：2011-12-20
申请号：US12203100
申请日：2008-09-02
申请人： Wael O. Zohni , William L. Schmidt , Michael John Sebastian Smith , Jeremy Matthew Plunkett
发明人： Wael O. Zohni , William L. Schmidt , Michael John Sebastian Smith , Jeremy Matthew Plunkett
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： H05K7/20509 , H01L23/367 , H01L23/4093 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.
摘要翻译：本发明的一个实施例提出了一种散热器模块，用于耗散由电子部件产生的热量热。组件包括印刷电路板（PCB），布置在PCB上的电子部件，热耦合到电子部件的热界面材料（TIM）和热耦合到TIM的散热板。散热板包括压花图案。因此，相对于现有技术的设计，可以增加散热板和周围介质之间可用于热传导的表面积。

4. 发明申请

US20120118246A1 SEALED AND SELF-CONTAINED TANKLESS WATER HEATER FLUSHING SYSTEM 有权
标题翻译：密封和自包含TANKING水加热器冲洗系统
公开(公告)号：US20120118246A1
公开(公告)日：2012-05-17
申请号：US12947222
申请日：2010-11-16
申请人： Deron B. Oberkorn , Gary L. Nichols , William L. Schmidt
发明人： Deron B. Oberkorn , Gary L. Nichols , William L. Schmidt
IPC分类号： F24H9/00
CPC分类号： F04B23/021 , F24D19/0092
摘要： A sealed and self-contained tankless water heater flushing system including a holding basin, a cover lid for the holding basin firmly securable and sealed liquid tight to the holding basin, a submersible pump contained within the holding basin, a submersible pump hose, securable from the submersible pump within the holding basin to a discharge opening in the cover of the holding basin, a filter system, securable within the holding basin to a filter opening contained in the cover lid, wherein the filter system includes a filter for filtering solid substances from the tankless water heater during a flushing process, a discharge hose for connecting the discharge opening to the water heater, and a filter hose for connecting the filter opening to the water heater.
摘要翻译：一个密封且独立的无罐式热水器冲洗系统，包括一个保持盆，一个用于保持盆盖的盖子，牢固地固定和密封到液体保持盆中，一个包含在保持盆内的潜水泵，一个潜水泵软管，所述保持盆内的潜水泵到所述保持盆的盖中的排出口，过滤器系统，其保持在所述保持盆内，所述过滤器系统包括在所述盖盖中的过滤器开口，其中，所述过滤器系统包括用于过滤固体物质的过滤器在冲洗过程中的无罐式热水器，用于将排出口连接到热水器的排出软管和用于将过滤器开口连接到热水器的过滤软管。

5. 发明授权

US5010038A Method of cooling and powering an integrated circuit chip using a compliant interposing pad 失效
标题翻译：使用兼容的插入式块来对集成电路芯片进行冷却和供电的方法
公开(公告)号：US5010038A
公开(公告)日：1991-04-23
申请号：US549611
申请日：1990-07-09
申请人： Leslie R. Fox , Paul C. Wade , William L. Schmidt
发明人： Leslie R. Fox , Paul C. Wade , William L. Schmidt
IPC分类号： H01L23/40 , H01L23/498 , H01R13/24 , H05K3/32
CPC分类号： H01R13/2414 , H01L23/4006 , H01L23/49827 , H01L23/49833 , H01L24/73 , H05K3/325 , H01L2023/4043 , H01L2023/4062 , H01L2224/16225 , H01L2924/12042 , H01L2924/14 , H01R12/714 , H05K2201/10681
摘要： An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.
摘要翻译： IC芯片组件包括在其第一面处具有暴露触点阵列的芯片，具有在其表面处具有暴露触点阵列的基板和具有位于芯片和基板之间的相对面处的暴露触点的柔性插入器，使得插入器的相对面上的触点分别接合在所述芯片和衬底上的触点。热传递构件接触芯片的相对面并与衬底接合，以便压缩插入器，从而同时在芯片触点和衬底触点之间建立相对低的电感电连接，并且芯片与热转印之间具有良好的热接触会员。该组件特别适于向TAB型集成电路组件的芯片提供电力，其包括连接在芯片和衬底之间的柔性引线框架。

6. 发明授权

US5710733A Processor-inclusive memory module 失效
公开(公告)号：US5710733A
公开(公告)日：1998-01-20
申请号：US589532
申请日：1996-01-22
申请人： David P. Chengson , William L. Schmidt , Unmesh Agarwala , Alan D. Foster , Edward C. Priest , John C. Manton , Ali Mira
发明人： David P. Chengson , William L. Schmidt , Unmesh Agarwala , Alan D. Foster , Edward C. Priest , John C. Manton , Ali Mira
IPC分类号： G06F15/78 , G11C5/00 , H01L25/18 , H05K7/14 , H03H11/00 , H05K7/02
CPC分类号： H05K7/1422 , G06F15/7864 , H01L25/18 , H01L2924/0002 , H01L2924/3011
摘要： A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon. Electrical connectors extend from the second surface of the printed circuit board. The electrical connectors are electrically coupled to respective contact pads of the processor. In the present PIMM, the electrical connectors are adapted to be removably attached to a mother board. In so doing, the present PIMM is removably attachable to a mother board.

7. 发明授权

US4954878A Method of packaging and powering integrated circuit chips and the chip assembly formed thereby 失效
标题翻译：集成电路芯片的封装和供电方法以及由此形成的芯片组件
公开(公告)号：US4954878A
公开(公告)日：1990-09-04
申请号：US373960
申请日：1989-06-29
申请人： Leslie R. Fox , Paul C. Wade , William L. Schmidt
发明人： Leslie R. Fox , Paul C. Wade , William L. Schmidt
IPC分类号： H01L21/60 , H01L23/40 , H01L23/498 , H01R13/24
CPC分类号： H01R13/2414 , H01L23/4006 , H01L23/49827 , H01L23/49833 , H01L24/50 , H01L24/73 , H01L2023/4043 , H01L2023/4062 , H01L2224/16225 , H01L2924/00013 , H01L2924/12042 , H01L2924/14 , H01R12/714 , H05K2201/10681
摘要： An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.

8. 发明授权

US4935864A Localized cooling apparatus for cooling integrated circuit devices 失效
标题翻译：用于冷却集成电路器件的本地化冷却装置
公开(公告)号：US4935864A
公开(公告)日：1990-06-19
申请号：US368741
申请日：1989-06-20
申请人： William L. Schmidt , Richard E. Olson , Dennis J. Solley
发明人： William L. Schmidt , Richard E. Olson , Dennis J. Solley
IPC分类号： H01L23/38 , H05K7/20
CPC分类号： H01L23/38 , H05K7/20545 , H01L2924/0002 , Y10S257/93 , Y10S323/907
摘要： A localized cooling apparatus is provided for individually cooling integrated circuit chips mounted on a circuit board for insertion into a computer backplane. The cooling apparatus consists of a circuit board occupying a first slot and having an integrated circuit chip mounted thereon, the performance of which is known to improve by cooling, a heat removal assembly consisting of a heat sink attached to a card edge portion and occupying an adjacent second slot, and a thermoelectric cooler intimately bonded to both the chip and heat removal assembly. A controller provides power via the connector of the second slot to the thermoelectric cooler and stabilizes the temperature of the chip to a predetermined value.
摘要翻译：提供一种局部冷却装置，用于单独冷却安装在电路板上用于插入计算机背板的集成电路芯片。冷却装置包括占据第一槽的电路板，其上安装有集成电路芯片，其性能已知通过冷却而改善，散热组件由散热片组成，该散热片附接到卡边缘部分并占据一个相邻的第二狭槽和与芯片和散热组件两者紧密结合的热电冷却器。控制器通过第二槽的连接器向热电冷却器提供电力，并将芯片的温度稳定在预定值。

9. 发明授权

US3930658A Plastic ski and method of making the same 失效
标题翻译：塑料滑雪及其制作方法
公开(公告)号：US3930658A
公开(公告)日：1976-01-06
申请号：US410825
申请日：1973-10-29
申请人： John G. Howe , William L. Schmidt
发明人： John G. Howe , William L. Schmidt
IPC分类号： A63C5/12
CPC分类号： A63C5/12
摘要： A snow ski having a plastic foam core formed in situ between preformed top and bottom subassemblies.
摘要翻译：一个具有塑料泡沫芯的雪地滑雪板，原来形成在预先形成的顶部和底部组件之间。

10. 发明授权

US5867419A Processor-inclusive memory module 失效
标题翻译：包含处理器的内存模块
公开(公告)号：US5867419A
公开(公告)日：1999-02-02
申请号：US903042
申请日：1997-07-29
申请人： David P. Chengson , William L. Schmidt , Unmesh Agarwala , Alan D. Foster , Edward C. Priest , John C. Manton , Ali Mira
发明人： David P. Chengson , William L. Schmidt , Unmesh Agarwala , Alan D. Foster , Edward C. Priest , John C. Manton , Ali Mira
IPC分类号： G11C5/00 , H01L25/18 , H03H11/00
CPC分类号： H01L25/18 , H01L2924/0002 , H01L2924/3011
摘要： A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon. Electrical connectors extend from the second surface of the printed circuit board. The electrical connectors are electrically coupled to respective contact pads of the processor. In the present PIMM, the electrical connectors are adapted to be removably attached to a mother board. In so doing, the present PIMM is removably attachable to a mother board.
摘要翻译：公开了一种包含处理器的存储器模块（PIMM）。在本发明的一个实施例中，PIMM包括具有第一和第二相对表面的印刷电路板。印刷电路板还具有形成在其中的地址线。第一SRAM安装在印刷电路板的第一表面上。本PIMM还包括安装在印刷电路板的第二表面上的第二SRAM。第二SRAM安装在印刷电路板的与安装在印刷电路板的第一表面上的第一SRAM直接相对的第二表面上。第一和第二SRAM通过相应的高速缓存总线耦合到地址线。处理器也安装在印刷电路板的第一表面上，并且耦合到地址线。在本发明的一个实施例中，散热器热耦合到处理器。处理器具有设置在其上的多个接触垫。电连接器从印刷电路板的第二表面延伸。电连接器电耦合到处理器的相应接触垫。在目前的PIMM中，电连接器适于可拆卸地连接到母板。这样做，现在的PIMM可拆卸地连接到母板上。

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