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1. 发明授权

US4954878A Method of packaging and powering integrated circuit chips and the chip assembly formed thereby 失效
标题翻译：集成电路芯片的封装和供电方法以及由此形成的芯片组件
公开(公告)号：US4954878A
公开(公告)日：1990-09-04
申请号：US373960
申请日：1989-06-29
申请人： Leslie R. Fox , Paul C. Wade , William L. Schmidt
发明人： Leslie R. Fox , Paul C. Wade , William L. Schmidt
IPC分类号： H01L21/60 , H01L23/40 , H01L23/498 , H01R13/24
CPC分类号： H01R13/2414 , H01L23/4006 , H01L23/49827 , H01L23/49833 , H01L24/50 , H01L24/73 , H01L2023/4043 , H01L2023/4062 , H01L2224/16225 , H01L2924/00013 , H01L2924/12042 , H01L2924/14 , H01R12/714 , H05K2201/10681
摘要： An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.

2. 发明授权

US08864415B1 Buoyancy shifting apparatus for underwater plow 有权
标题翻译：用于水下犁的浮力换挡装置
公开(公告)号：US08864415B1
公开(公告)日：2014-10-21
申请号：US13543985
申请日：2012-07-09
申请人： Steven K. Whiteside , Robert M. Lee , Ronald A. Skala , Paul C. Wade , Bret R. Thomson , Daniel T. Bridge , Tyler J. Browe
发明人： Steven K. Whiteside , Robert M. Lee , Ronald A. Skala , Paul C. Wade , Bret R. Thomson , Daniel T. Bridge , Tyler J. Browe
IPC分类号： E02F5/10
CPC分类号： E02F5/104 , B63B21/66 , B63B35/04 , B63B43/06 , B63C11/00 , B63H5/125 , B63H2005/1254 , E02F3/8875 , E02F3/905 , E02F5/106 , H02G1/10
摘要： The present invention provides a means by which an underwater plow can avoid large obstacles that otherwise would prevent the plow from executing its desired path. The underwater plow is released into the water, drops to the sea floor, orients itself, and begins to deploy the sensor array along a pre-programmed path. If the plow encounters a sea floor obstacle, the plow 10 automatically maneuvers to overcome the obstacle and continues deployment of the sensor array. The buoyancy shifting apparatus 110 allows the plow to automatically maneuver. The present invention shifts the center of buoyancy of the underwater plow, thereby allowing the plow to float over obstructions.
摘要翻译：本发明提供了一种水下犁可以避免大的障碍物，否则将阻止犁执行其所需路径的手段。水下犁被释放到水中，落到海底，定位自身，并开始沿预编程的路径部署传感器阵列。如果犁遇到海底障碍物，则犁10自动地操纵以克服障碍物并继续展开传感器阵列。浮力移动装置110允许犁自动操纵。本发明改变了水下犁的浮力中心，从而允许犁摆在障碍物上。

3. 发明授权

US5285347A Hybird cooling system for electronic components 失效
标题翻译： Hybird冷却系统用于电子元器件
公开(公告)号：US5285347A
公开(公告)日：1994-02-08
申请号：US830952
申请日：1992-02-06
申请人： Leslie Fox , Paul C. Wade
发明人： Leslie Fox , Paul C. Wade
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , G06F1/20 , G06F2200/201
摘要： An improved method for removing heat from electronic devices, such as computer modules, is described. A flow of gas, such as air, cools the components. The gas flow is sufficient to cool so called "hot" components to their maximum operating temperature, and to cool the other components to their normal operating range. A liquid cooling system is also provided to cool the "hot" components to their normal operating range.
摘要翻译：描述了一种用于从诸如计算机模块的电子设备移除热量的改进方法。诸如空气的气体流使部件冷却。气流足以将所谓的“热”组分冷却至其最大工作温度，并将其它组分冷却至正常工作范围。还提供液体冷却系统以将“热”组件冷却至其正常工作范围。

4. 发明授权

US4135168A Reverse channel GaAsFET oscillator 失效
标题翻译：反向沟道GaAsFET振荡器
公开(公告)号：US4135168A
公开(公告)日：1979-01-16
申请号：US874703
申请日：1978-02-02
申请人： Paul C. Wade
发明人： Paul C. Wade
IPC分类号： H03B5/12 , H03B5/00
CPC分类号： H03B5/1203 , H03B5/1231
摘要： A common-drain high frequency power oscillator is configured by electrically reversing the channel of a GaAsFET transistor. Such an oscillator can be flip-chip mounted for reduced thermal resistance and has superior oscillation characteristics as compared with conventional common-source oscillators. Specifically, its gain is nearly constant with frequency, oscillation is less critically dependent on terminal impedance, and it can be operated with a single polarity voltage supply.
摘要翻译：公共漏极高频功率振荡器通过电反转GaAsFET晶体管的沟道来配置。与传统的共源振荡器相比，这种振荡器可以倒装安装以降低热阻并且具有优异的振荡特性。具体来说，其增益与频率几乎恒定，振荡较少严重依赖于端子阻抗，并且可以使用单极性电压供电。

5. 发明授权

US5481555A System and method for error detection and reducing simultaneous switching noise 失效
标题翻译：用于错误检测和降低同时开关噪声的系统和方法
公开(公告)号：US5481555A
公开(公告)日：1996-01-02
申请号：US206914
申请日：1994-03-07
申请人： Paul C. Wade , Samuel H. Duncan , Donald W. Smelser
发明人： Paul C. Wade , Samuel H. Duncan , Donald W. Smelser
IPC分类号： G06F11/00 , G06F11/10 , H03K17/16 , H03K19/003 , H03M5/14 , H03M7/00 , H03M7/14 , H03M7/20 , H03M13/00 , H03M13/51 , H04L1/00 , H04L25/02
CPC分类号： H03M5/145 , H03M7/20
摘要： A system and method that reduces the simultaneous switching noise of outputs and the processing delays caused by inductance by using an encoding scheme that results in a net signaling current of substantially zero at each cycle time for the fast parallel switching networks of digital integrated circuit chips and that provides multiple types of error detection.
摘要翻译：一种通过使用编码方案来减少输出的同时开关噪声和由电感引起的处理延迟的系统和方法，所述编码方案导致数字集成电路芯片的快速并行交换网络在每个周期时间内的净信令电流基本为零，它提供了多种类型的错误检测。

6. 发明授权

US5359630A Method and apparatus for realignment of synchronous data 失效
标题翻译：用于重新对准同步数据的方法和装置
公开(公告)号：US5359630A
公开(公告)日：1994-10-25
申请号：US929623
申请日：1992-08-13
申请人： Paul C. Wade , David J. Sager , Andrey Varpahovsky
发明人： Paul C. Wade , David J. Sager , Andrey Varpahovsky
IPC分类号： G06F1/10 , H04L7/00 , H04L7/033 , H04L7/04
CPC分类号： G06F1/10 , H04L7/0012 , H04L7/0338
摘要： A method and device for receiving data in a synchronous communication system. Data can be accurately transferred between two subsystems in a synchronous system even where the clock skew and propagation delay between the two subsystems is unlimited. The receiving subsystem is initialized to ensure synchronous data transfer over a theoretically infinite range. The transmitting subsystem transmits data and a forwarded clock to the receiving subsystem. Data is captured in three state devices arranged in parallel to eliminate minimum delay requirements and to expand data valid time. The captured data is then aligned to the clock of the receiving subsystem by controlling a multiplexer which selects the proper state device output to pass to another state device for alignment to the receiving subsystem's clock. The multiplexer is controlled by a circuit which monitors the capturing of the incoming data and determines the correct state device output to select for proper data alignment.
摘要翻译：一种用于在同步通信系统中接收数据的方法和装置。即使在两个子系统之间的时钟偏移和传播延迟是无限制的情况下，也可以在同步系统中的两个子系统之间精确地传输数据。接收子系统被初始化以确保在理论上无限范围内的同步数据传输。发送子系统向接收子系统发送数据和转发时钟。在并行布置的三个状态设备中捕获数据，以消除最小延迟要求并扩展数据有效时间。捕获的数据然后通过控制多路复用器对准接收子系统的时钟，多路复用器选择适当的状态设备输出传递到另一个状态设备以与接收子系统的时钟对准。多路复用器由监视输入数据的捕获的电路控制，并确定正确的状态设备输出以选择正确的数据对准。

7. 发明授权

US5068715A High-power, high-performance integrated circuit chip package 失效
标题翻译：大功率，高性能的集成电路芯片封装
公开(公告)号：US5068715A
公开(公告)日：1991-11-26
申请号：US546569
申请日：1990-06-29
申请人： Paul C. Wade , JJ Grady, III
发明人： Paul C. Wade , JJ Grady, III
IPC分类号： H01L23/04 , H01L23/051 , H01L23/36
CPC分类号： H01L23/04 , H01L23/051 , H01L23/36 , H01L2924/0002 , H01L2924/01079 , H01L2924/3011
摘要： The high-power, high-performance integrated circuit chip package comprises a chip constructed to contain top and bottom surfaces to which top and bottom metallization planes are fixed. Top and bottom heat sinks are fixedly mounted to the top metallization plane and bottom metallization plane, respectively. The metallization planes and heat sink combination functions as both a power lead and a heat dissipation means, allowing for the chip to contain signal connections which may be dedicated to input and output signal paths. The chip further comprises a plurality of contiguous top layers of thin dielectric material, at least one epitaxial layer on whichis mounted a plurality of transistors and associated circuitry, and at least one bottom layer of crystalline silicon material. The plurality of transistors and associated circuitry generates heat. Such heat may then be dissipated by following a first or second thermal path, the first path proceeding through the plurality of contiguous top layers, through the top metallization plane to the top heat sink and the second thermal path proceeding through at least one bottom layer through the bottom metallization plane to the bottom heat sink.
摘要翻译：大功率，高性能的集成电路芯片封装包括一个构造成容纳顶部和底部金属化平面固定的顶表面和底表面的芯片。顶部和底部散热器分别固定地安装在顶部金属化平面和底部金属化平面上。金属化平面和散热器组合既用作电源引线又用作散热装置，从而允许芯片包含专用于输入和输出信号路径的信号连接。芯片还包括多个连续的薄介电材料的顶层，至少一个外延层上安装有多个晶体管和相关电路，以及至少一个结晶硅材料的底层。多个晶体管和相关电路产生热量。然后可以通过跟随第一或第二热路径，第一路径穿过多个相邻顶层，穿过顶部金属化平面到顶部散热器，并且第二热路径通过至少一个底层通过底部金属化平面到底部散热器。

8. 发明授权

US5010038A Method of cooling and powering an integrated circuit chip using a compliant interposing pad 失效
标题翻译：使用兼容的插入式块来对集成电路芯片进行冷却和供电的方法
公开(公告)号：US5010038A
公开(公告)日：1991-04-23
申请号：US549611
申请日：1990-07-09
申请人： Leslie R. Fox , Paul C. Wade , William L. Schmidt
发明人： Leslie R. Fox , Paul C. Wade , William L. Schmidt
IPC分类号： H01L23/40 , H01L23/498 , H01R13/24 , H05K3/32
CPC分类号： H01R13/2414 , H01L23/4006 , H01L23/49827 , H01L23/49833 , H01L24/73 , H05K3/325 , H01L2023/4043 , H01L2023/4062 , H01L2224/16225 , H01L2924/12042 , H01L2924/14 , H01R12/714 , H05K2201/10681
摘要： An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.
摘要翻译： IC芯片组件包括在其第一面处具有暴露触点阵列的芯片，具有在其表面处具有暴露触点阵列的基板和具有位于芯片和基板之间的相对面处的暴露触点的柔性插入器，使得插入器的相对面上的触点分别接合在所述芯片和衬底上的触点。热传递构件接触芯片的相对面并与衬底接合，以便压缩插入器，从而同时在芯片触点和衬底触点之间建立相对低的电感电连接，并且芯片与热转印之间具有良好的热接触会员。该组件特别适于向TAB型集成电路组件的芯片提供电力，其包括连接在芯片和衬底之间的柔性引线框架。

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