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1. 发明授权

US06632377B1 Chemical-mechanical planarization of metallurgy 有权
标题翻译：化学机械平面化冶金
公开(公告)号：US06632377B1
公开(公告)日：2003-10-14
申请号：US09409798
申请日：1999-09-30
申请人： Vlasta Brusic , Daniel C. Edelstein , Paul M. Feeney , William Guthrie , Mark Jaso , Frank B. Kaufman , Naftali Lustig , Peter Roper , Kenneth Rodbell , David B. Thompson
发明人： Vlasta Brusic , Daniel C. Edelstein , Paul M. Feeney , William Guthrie , Mark Jaso , Frank B. Kaufman , Naftali Lustig , Peter Roper , Kenneth Rodbell , David B. Thompson
IPC分类号： C09K1300
CPC分类号： C09G1/02 , C09K13/04 , C23F3/00 , H01L21/3212
摘要： Copper or a copper alloy is removed by chemical-mechanical planarization (CMP) in a slurry of an oxidizer, an oxidation inhibitor, and an additive that appreciably regulates copper complexing with the oxidation inhibitor.
摘要翻译：铜或铜合金通过化学机械平面化（CMP）在氧化剂，氧化抑制剂和显着调节与氧化抑制剂络合铜的添加剂的浆料中去除。

2. 发明申请

US20080105652A1 CMP of copper/ruthenium/tantalum substrates 审中-公开
标题翻译：铜/钌/钽基板的CMP
公开(公告)号：US20080105652A1
公开(公告)日：2008-05-08
申请号：US11591730
申请日：2006-11-02
申请人： Vlasta Brusic , Renjie Zhou , Christopher C. Thompson , Paul M. Feeney
发明人： Vlasta Brusic , Renjie Zhou , Christopher C. Thompson , Paul M. Feeney
IPC分类号： C09K13/00 , B44C1/00
CPC分类号： C09K3/1409 , C09G1/02 , C09K3/1436 , C09K3/1463
摘要： The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an abrasive, an oxidizing agent, an amphiphilic nonionic surfactant, calcium ion or magnesium ion, a corrosion inhibitor for copper, and water, wherein the pH of the polishing composition is about 6 to about 12. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
摘要翻译：本发明提供了一种用于抛光基材的化学机械抛光组合物。抛光组合物包括研磨剂，氧化剂，两亲性非离子表面活性剂，钙离子或镁离子，铜的防腐蚀剂和水，其中抛光组合物的pH为约6至约12.本发明还提供了一种用上述抛光组合物对衬底进行化学机械研磨的方法。

3. 发明授权

US07998335B2 Controlled electrochemical polishing method 失效
标题翻译：控制电化学抛光方法
公开(公告)号：US07998335B2
公开(公告)日：2011-08-16
申请号：US11150944
申请日：2005-06-13
申请人： Paul M. Feeney , Vlasta Brusic
发明人： Paul M. Feeney , Vlasta Brusic
IPC分类号： C25F3/18
CPC分类号： C25F3/02 , B23H5/08 , C25D5/34 , C25D5/48 , C25D7/12 , H01L21/32125
摘要： The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or an oxidizing agent.
摘要翻译：本发明涉及一种通过在衬底和至少一个与包含还原剂或氧化剂的抛光组合物接触的电极之间施加电化学电势来抛光包含至少一个金属层的衬底的方法。

4. 发明授权

US09343330B2 Compositions for polishing aluminum/copper and titanium in damascene structures 有权
标题翻译：用于在镶嵌结构中抛光铝/铜和钛的组合物
公开(公告)号：US09343330B2
公开(公告)日：2016-05-17
申请号：US11634576
申请日：2006-12-06
申请人： Vlasta Brusic , Renjie Zhou , Paul Feeney , Christopher Thompson
发明人： Vlasta Brusic , Renjie Zhou , Paul Feeney , Christopher Thompson
IPC分类号： C09K3/14 , H01L21/321 , C09G1/02
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1409 , C09K3/1436 , C09K3/1463
摘要： The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an oxidizing agent, calcium ion, an organic carboxylic acid, and water, wherein the polishing composition has a pH of about 1.5 to about 7. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
摘要翻译：本发明提供了一种用于抛光基材的化学机械抛光组合物。抛光组合物包含氧化剂，钙离子，有机羧酸和水，其中抛光组合物的pH为约1.5至约7.本发明还提供了用上述抛光对基材进行化学机械研磨的方法组成。

5. 发明授权

US08425797B2 Compositions for polishing aluminum/copper and titanium in damascene structures 有权
标题翻译：用于在镶嵌结构中抛光铝/铜和钛的组合物
公开(公告)号：US08425797B2
公开(公告)日：2013-04-23
申请号：US12052970
申请日：2008-03-21
申请人： Vlasta Brusic , Christopher Thompson , Jeffrey Dysard
发明人： Vlasta Brusic , Christopher Thompson , Jeffrey Dysard
IPC分类号： C09K13/04
CPC分类号： H01L21/30625 , B24B37/044 , B24D3/00 , C09G1/02 , C09K3/1436 , C09K3/1463 , C23F3/03 , C23F3/06
摘要： The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive consisting of alumina particles optionally treated with a polymer, an α-hydroxycarboxylic acid, an oxidizing agent that oxidizes at least one metal, polyacrylic acid, optionally, a calcium-containing compound, optionally, a biocide, optionally, a pH adjusting agent, and water. The method uses the composition to chemically-mechanically polish a substrate.
摘要翻译：本发明提供了用于平坦化或抛光基材的组合物和方法。该组合物包含由任选用聚合物氧化的氧化铝颗粒，α-羟基羧酸，氧化至少一种金属的氧化剂，任选的含钙化合物，任选的含钙化合物，任选的杀生物剂，任选地， pH调节剂和水。该方法使用组合物对基材进行化学机械抛光。

6. 发明申请

US20110100956A1 METAL-PASSIVATING CMP COMPOSITIONS AND METHODS 有权
标题翻译：金属钝化CMP组合物和方法
公开(公告)号：US20110100956A1
公开(公告)日：2011-05-05
申请号：US13004113
申请日：2011-01-11
申请人： Jason KELEHER , Pankaj Singh , Vlasta Brusic
发明人： Jason KELEHER , Pankaj Singh , Vlasta Brusic
IPC分类号： C23F1/00 , C09K13/00 , C23F1/18 , C23F1/30
CPC分类号： C09G1/02 , C09K3/1409 , H01L21/3212
摘要： The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
摘要翻译：本发明提供用于抛光含铜和/或含银基材的化学机械抛光（CMP）组合物和方法。本发明的组合物在水性载体中包含颗粒磨料，初始成膜金属络合剂和二次成膜金属钝化剂。还公开了用本发明的组合物研磨衬底的方法。

7. 发明申请

US20080200098A1 POLISHING SLURRY FOR ALUMINUM AND ALUMINUM ALLOYS 有权
标题翻译：铝和铝合金抛光浆
公开(公告)号：US20080200098A1
公开(公告)日：2008-08-21
申请号：US12069495
申请日：2008-02-11
申请人： Kevin Moeggenborg , John Clark , Jeffrey Gilliland , Stanley Lesiak , Susan Wilson , Vlasta Brusic
发明人： Kevin Moeggenborg , John Clark , Jeffrey Gilliland , Stanley Lesiak , Susan Wilson , Vlasta Brusic
IPC分类号： B24B13/00
CPC分类号： B24B13/015 , B24B29/02 , B24B37/044 , B24B37/24 , C09G1/02 , C09K3/1454 , C23F3/02 , H01L31/054
摘要： The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7.
摘要翻译：本发明涉及一种抛光包括铝的物体的表面的方法。该方法包括使物体的表面与软抛光垫和抛光组合物接触的步骤。抛光组合物包括磨料颗粒，氧化铝的试剂和用于抛光物体表面的液体载体。抛光组合物包括悬浮在液体载体中的磨料颗粒，并且在高于约7的pH下施加。

8. 发明申请

US20050211950A1 Chemical-mechanical polishing composition and method for using the same 审中-公开
标题翻译：化学机械抛光组合物及其使用方法
公开(公告)号：US20050211950A1
公开(公告)日：2005-09-29
申请号：US10807944
申请日：2004-03-24
申请人： Francesco de Rege Thesauro , Kevin Moeggenborg , Vlasta Brusic , Benjamin Bayer
发明人： Francesco de Rege Thesauro , Kevin Moeggenborg , Vlasta Brusic , Benjamin Bayer
IPC分类号： C09G1/02 , H01L21/321 , C09K13/00 , B44C1/22 , H01L21/302
CPC分类号： C09G1/02
摘要： The invention provides a chemical-mechanical polishing composition comprising: (a) an abrasive comprising α-alumina, (b) about 0.05 to about 50 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water. The invention also provides a chemical-mechanical polishing composition comprising: (a) an abrasive selected from the group consisting of α-alumina, γ-alumina, δ-alumina, θ-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, magnesium, zinc, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water. The invention further provides methods of polishing a substrate using each of the above-described chemical-mechanical polishing compositions.
摘要翻译：本发明提供一种化学机械抛光组合物，其包括：（a）包含α-氧化铝的磨料，（b）约0.05至约50mmol / kg的选自钙，锶，钡中的至少一种金属的离子，及其混合物，基于抛光组合物的总重量，和（c）包含水的液体载体。本发明还提供一种化学机械抛光组合物，其包含：（a）选自α-氧化铝，γ-氧化铝，δ-氧化铝，θ-氧化铝，金刚石，碳化硼，碳化硅，碳化钨，氮化钛及其混合物，（b）基于总重量，约0.05至约3.5mmol / kg的选自钙，锶，钡，镁，锌及其混合物的至少一种金属的离子的抛光组合物，和（c）包含水的液体载体。本发明还提供了使用上述每种化学 - 机械抛光组合物抛光基材的方法。

9. 发明授权

US3939293A Method for passivating chromium 失效
标题翻译：钝化铬的方法
公开(公告)号：US3939293A
公开(公告)日：1976-02-17
申请号：US465657
申请日：1974-04-30
申请人： Vlasta Brusic , Robert O. Lussow
发明人： Vlasta Brusic , Robert O. Lussow
IPC分类号： C23C8/12 , H01J9/26 , C23F7/02
CPC分类号： C23C8/12 , H01J9/261
摘要： Chromium is passivated by forming a chromium oxide layer thereon by heating at temperatures of about 450.degree.C in an atmosphere containing oxygen. While useful, per se, the process finds particular application as an integral part of overall processing schemes where thermal cycles are used.
摘要翻译：通过在约450℃的温度下在含有氧的气氛中加热，在其上形成氧化铬层来钝化铬。尽管本身也是有用的，但是该过程将特定应用作为使用热循环的整体处理方案的组成部分。

10. 发明授权

US08101093B2 Chemical-mechanical polishing composition and method for using the same 有权
标题翻译：化学机械抛光组合物及其使用方法
公开(公告)号：US08101093B2
公开(公告)日：2012-01-24
申请号：US12393489
申请日：2009-02-26
申请人： Francesco de Rege Thesauro , Kevin J. Moeggenborg , Vlasta Brusic , Benjamin P. Bayer
发明人： Francesco de Rege Thesauro , Kevin J. Moeggenborg , Vlasta Brusic , Benjamin P. Bayer
IPC分类号： C03C15/00
CPC分类号： C09G1/02
摘要： The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising α-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of α-alumina, γ-alumina, δ-alumina, θ-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.
摘要翻译：本发明提供了用两种化学机械抛光组合物之一抛光含贵金属的基材的方法。第一化学机械抛光组合物包含（a）包含α-氧化铝的磨料，（b）约0.05至约50mmol / kg的钙，锶，钡或其混合物的离子，和（c）液体载体，水。第二化学机械抛光组合物包含（a）选自α-氧化铝，γ-氧化铝，δ-氧化铝，氧化铝，氧化铝，金刚石，碳化硼，碳化硅，碳化钨，氮化钛，（b）约0.05至约3.5mmol / kg的钙，锶，钡，镁，锌或其混合物的离子，和（c）包含水的液体载体。

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