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1. 发明授权

US09343330B2 Compositions for polishing aluminum/copper and titanium in damascene structures 有权
标题翻译：用于在镶嵌结构中抛光铝/铜和钛的组合物
公开(公告)号：US09343330B2
公开(公告)日：2016-05-17
申请号：US11634576
申请日：2006-12-06
申请人： Vlasta Brusic , Renjie Zhou , Paul Feeney , Christopher Thompson
发明人： Vlasta Brusic , Renjie Zhou , Paul Feeney , Christopher Thompson
IPC分类号： C09K3/14 , H01L21/321 , C09G1/02
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1409 , C09K3/1436 , C09K3/1463
摘要： The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an oxidizing agent, calcium ion, an organic carboxylic acid, and water, wherein the polishing composition has a pH of about 1.5 to about 7. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
摘要翻译：本发明提供了一种用于抛光基材的化学机械抛光组合物。抛光组合物包含氧化剂，钙离子，有机羧酸和水，其中抛光组合物的pH为约1.5至约7.本发明还提供了用上述抛光对基材进行化学机械研磨的方法组成。

2. 发明授权

US08425797B2 Compositions for polishing aluminum/copper and titanium in damascene structures 有权
标题翻译：用于在镶嵌结构中抛光铝/铜和钛的组合物
公开(公告)号：US08425797B2
公开(公告)日：2013-04-23
申请号：US12052970
申请日：2008-03-21
申请人： Vlasta Brusic , Christopher Thompson , Jeffrey Dysard
发明人： Vlasta Brusic , Christopher Thompson , Jeffrey Dysard
IPC分类号： C09K13/04
CPC分类号： H01L21/30625 , B24B37/044 , B24D3/00 , C09G1/02 , C09K3/1436 , C09K3/1463 , C23F3/03 , C23F3/06
摘要： The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive consisting of alumina particles optionally treated with a polymer, an α-hydroxycarboxylic acid, an oxidizing agent that oxidizes at least one metal, polyacrylic acid, optionally, a calcium-containing compound, optionally, a biocide, optionally, a pH adjusting agent, and water. The method uses the composition to chemically-mechanically polish a substrate.
摘要翻译：本发明提供了用于平坦化或抛光基材的组合物和方法。该组合物包含由任选用聚合物氧化的氧化铝颗粒，α-羟基羧酸，氧化至少一种金属的氧化剂，任选的含钙化合物，任选的含钙化合物，任选的杀生物剂，任选地， pH调节剂和水。该方法使用组合物对基材进行化学机械抛光。

3. 发明申请

US20110100956A1 METAL-PASSIVATING CMP COMPOSITIONS AND METHODS 有权
标题翻译：金属钝化CMP组合物和方法
公开(公告)号：US20110100956A1
公开(公告)日：2011-05-05
申请号：US13004113
申请日：2011-01-11
申请人： Jason KELEHER , Pankaj Singh , Vlasta Brusic
发明人： Jason KELEHER , Pankaj Singh , Vlasta Brusic
IPC分类号： C23F1/00 , C09K13/00 , C23F1/18 , C23F1/30
CPC分类号： C09G1/02 , C09K3/1409 , H01L21/3212
摘要： The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
摘要翻译：本发明提供用于抛光含铜和/或含银基材的化学机械抛光（CMP）组合物和方法。本发明的组合物在水性载体中包含颗粒磨料，初始成膜金属络合剂和二次成膜金属钝化剂。还公开了用本发明的组合物研磨衬底的方法。

4. 发明授权

US07354530B2 Chemical mechanical polishing systems and methods for their use 有权
标题翻译：化学机械抛光系统及其使用方法
公开(公告)号：US07354530B2
公开(公告)日：2008-04-08
申请号：US11033068
申请日：2005-01-10
申请人： Shumin Wang , Vlasta Brusic Kaufman
发明人： Shumin Wang , Vlasta Brusic Kaufman
IPC分类号： C09K13/00
CPC分类号： C23F3/06 , C09G1/02 , C09K3/1463 , H01L21/3212
摘要： Alpha-amino acid containing chemical mechanical polishing compositions and slurries that are useful for polishing substrates including multiple layers of metals, or metals and dielectrics.
摘要翻译：含有α-氨基酸的化学机械抛光组合物和浆料，其可用于抛光包括多层金属或金属和电介质的基底。

5. 发明授权

US06867140B2 Method of polishing a multi-layer substrate 有权
标题翻译：抛光多层基材的方法
公开(公告)号：US06867140B2
公开(公告)日：2005-03-15
申请号：US10353512
申请日：2003-01-29
申请人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian
发明人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian
IPC分类号： C09G1/02 , H01L21/321 , H01L21/302
CPC分类号： H01L21/3212 , C09G1/02
摘要： The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, wherein the stopping compound is a cationically charged nitrogen containing compound selected from compounds comprising amines, imines, amides, imides, and mixtures thereof, and a polishing pad and/or an abrasive, and (ii) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.
摘要翻译：本发明提供了一种用于抛光一层或多层多层基材的方法，所述多层基材包括第一金属层和第二层，其包括（i）使第一金属层与包括液体载体，至少一种氧化剂至少一种抛光添加剂，其增加系统抛光至少一层基材的速率，至少一种具有至少约30:1的第一金属层的抛光选择性的停止化合物：第二层，其至少约30:1 停止化合物是选自包含胺，亚胺，酰胺，酰亚胺及其混合物的化合物的阳离子充氮的含氮化合物，以及抛光垫和/或研磨剂，和（ii）用系统抛光第一金属层直到至少从衬底去除第一金属层的一部分。

6. 发明授权

US06852632B2 Method of polishing a multi-layer substrate 有权
标题翻译：抛光多层基材的方法
公开(公告)号：US06852632B2
公开(公告)日：2005-02-08
申请号：US10353542
申请日：2003-01-29
申请人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian , Renjie Zhou
发明人： Shumin Wang , Vlasta Brusic Kaufman , Steven K. Grumbine , Isaac K. Cherian , Renjie Zhou
IPC分类号： B24B57/02 , B24D11/00 , C09G1/02 , C09K3/14 , H01L21/304 , H01L21/302 , C09K13/00
CPC分类号： C09G1/02
摘要： The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, wherein the polishing additive is selected from the group consisting of pyrophosphates, condensed phosphates, phosphonic acids and salts thereof, amines, amino alcohols, amides, imines, imino acids, nitriles, nitros, thiols thioesters, thioethers, carbothiolic acids, carbothionic acids, thiocarboxylic acids, thiosalicylic acids, and mixtures thereof, and a polishing pad and/or an abrasive, and (ii) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.
摘要翻译：本发明提供了一种用于抛光一层或多层多层基材的方法，所述多层基材包括第一金属层和第二层，其包括（i）使第一金属层与包括液体载体，至少一种氧化剂至少一种抛光添加剂，其增加系统抛光至少一层基材的速率，其中所述抛光添加剂选自焦磷酸盐，缩合磷酸盐，膦酸及其盐，胺，氨基醇，酰胺，亚胺，亚氨基酸，腈，亚硝基，硫醇硫酯，硫醚，硫代硫酸，碳硫酸，硫代羧酸，硫代水杨酸及其混合物，以及抛光垫和/或磨料，和（ii）层，直到第一金属层的至少一部分从衬底去除。

7. 发明授权

US06309560B1 Chemical mechanical polishing slurry useful for copper substrates 失效
标题翻译：用于铜基材的化学机械抛光浆料
公开(公告)号：US06309560B1
公开(公告)日：2001-10-30
申请号：US08944036
申请日：1997-09-29
申请人： Vlasta Brusic Kaufman , Rodney C. Kistler , Shumin Wang
发明人： Vlasta Brusic Kaufman , Rodney C. Kistler , Shumin Wang
IPC分类号： H01L21302
CPC分类号： C23F3/06 , C09G1/02 , C09K3/1409 , H01L21/3212
摘要： A chemical mechanical polishing slurry comprising a film forming agent, urea hydrogen peroxide, a complexing agent, an abrasive, and an optional surfactant, as well as a method for using the chemical mechanical polishing slurry to remove copper alloy, titanium, and titanium nitride containing layers from a substrate.
摘要翻译：包含成膜剂，尿素过氧化氢，络合剂，研磨剂和任选的表面活性剂的化学机械抛光浆料，以及使用化学机械抛光浆料去除含铜合金，钛和氮化钛的方法层。

8. 发明申请

US20080200098A1 POLISHING SLURRY FOR ALUMINUM AND ALUMINUM ALLOYS 有权
标题翻译：铝和铝合金抛光浆
公开(公告)号：US20080200098A1
公开(公告)日：2008-08-21
申请号：US12069495
申请日：2008-02-11
申请人： Kevin Moeggenborg , John Clark , Jeffrey Gilliland , Stanley Lesiak , Susan Wilson , Vlasta Brusic
发明人： Kevin Moeggenborg , John Clark , Jeffrey Gilliland , Stanley Lesiak , Susan Wilson , Vlasta Brusic
IPC分类号： B24B13/00
CPC分类号： B24B13/015 , B24B29/02 , B24B37/044 , B24B37/24 , C09G1/02 , C09K3/1454 , C23F3/02 , H01L31/054
摘要： The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7.
摘要翻译：本发明涉及一种抛光包括铝的物体的表面的方法。该方法包括使物体的表面与软抛光垫和抛光组合物接触的步骤。抛光组合物包括磨料颗粒，氧化铝的试剂和用于抛光物体表面的液体载体。抛光组合物包括悬浮在液体载体中的磨料颗粒，并且在高于约7的pH下施加。

9. 发明申请

US20080105652A1 CMP of copper/ruthenium/tantalum substrates 审中-公开
标题翻译：铜/钌/钽基板的CMP
公开(公告)号：US20080105652A1
公开(公告)日：2008-05-08
申请号：US11591730
申请日：2006-11-02
申请人： Vlasta Brusic , Renjie Zhou , Christopher C. Thompson , Paul M. Feeney
发明人： Vlasta Brusic , Renjie Zhou , Christopher C. Thompson , Paul M. Feeney
IPC分类号： C09K13/00 , B44C1/00
CPC分类号： C09K3/1409 , C09G1/02 , C09K3/1436 , C09K3/1463
摘要： The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an abrasive, an oxidizing agent, an amphiphilic nonionic surfactant, calcium ion or magnesium ion, a corrosion inhibitor for copper, and water, wherein the pH of the polishing composition is about 6 to about 12. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
摘要翻译：本发明提供了一种用于抛光基材的化学机械抛光组合物。抛光组合物包括研磨剂，氧化剂，两亲性非离子表面活性剂，钙离子或镁离子，铜的防腐蚀剂和水，其中抛光组合物的pH为约6至约12.本发明还提供了一种用上述抛光组合物对衬底进行化学机械研磨的方法。

10. 发明申请

US20050211950A1 Chemical-mechanical polishing composition and method for using the same 审中-公开
标题翻译：化学机械抛光组合物及其使用方法
公开(公告)号：US20050211950A1
公开(公告)日：2005-09-29
申请号：US10807944
申请日：2004-03-24
申请人： Francesco de Rege Thesauro , Kevin Moeggenborg , Vlasta Brusic , Benjamin Bayer
发明人： Francesco de Rege Thesauro , Kevin Moeggenborg , Vlasta Brusic , Benjamin Bayer
IPC分类号： C09G1/02 , H01L21/321 , C09K13/00 , B44C1/22 , H01L21/302
CPC分类号： C09G1/02
摘要： The invention provides a chemical-mechanical polishing composition comprising: (a) an abrasive comprising α-alumina, (b) about 0.05 to about 50 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water. The invention also provides a chemical-mechanical polishing composition comprising: (a) an abrasive selected from the group consisting of α-alumina, γ-alumina, δ-alumina, θ-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, magnesium, zinc, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water. The invention further provides methods of polishing a substrate using each of the above-described chemical-mechanical polishing compositions.
摘要翻译：本发明提供一种化学机械抛光组合物，其包括：（a）包含α-氧化铝的磨料，（b）约0.05至约50mmol / kg的选自钙，锶，钡中的至少一种金属的离子，及其混合物，基于抛光组合物的总重量，和（c）包含水的液体载体。本发明还提供一种化学机械抛光组合物，其包含：（a）选自α-氧化铝，γ-氧化铝，δ-氧化铝，θ-氧化铝，金刚石，碳化硼，碳化硅，碳化钨，氮化钛及其混合物，（b）基于总重量，约0.05至约3.5mmol / kg的选自钙，锶，钡，镁，锌及其混合物的至少一种金属的离子的抛光组合物，和（c）包含水的液体载体。本发明还提供了使用上述每种化学 - 机械抛光组合物抛光基材的方法。

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