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    • 1. 发明授权
    • Method for fabricating transistors
    • 晶体管制造方法
    • US06323103B1
    • 2001-11-27
    • US09175267
    • 1998-10-20
    • Rajesh RengarajanJochen BeintnerUlrike GrueningHans-Oliver Joachim
    • Rajesh RengarajanJochen BeintnerUlrike GrueningHans-Oliver Joachim
    • H01L218238
    • H01L21/823878H01L21/762
    • A method is provided for fabricating a first and second MOSFET transistors in different electrically isolated active areas of a semiconductor body, each one of the transistors having a plurality of layers. A first gate oxide layer and a first poly-crystalline silicon layer are deposited over the semiconductor body over the active areas. Trenches are etched in said first gate oxide and poly-crystalline silicon layers and said semiconductor body to delineate the first and second active areas, thereby forming first delineated gate oxide layer and poly-crystalline silicon layers coextensive with the first active area. Material is deposited in said trenches to form the active area isolations, the active area isolations having a top surface above said semiconductor body. A masking layer is then formed over said first and second active areas and selective portions of it are removed to expose said second active area. The masking layer and the active area isolations together form a mask defining an opening coextensive with the second active area with the active area isolations defining said opening. Material through the opening to form a second gate oxide layer and a second poly-crystalline layer, such second layer and second poly-crystalline layer being coextensive with the second active area. The first transistor with the first delineated gate oxide and poly-crystalline layer as a pair of the plurality of layers of the first transistor and the second transistor with the second gate oxide layer and second poly-crystalline layer as a pair of the plurality of layers of the second transistor.
    • 提供了一种用于在半导体主体的不同电隔离有源区中制造第一和第二MOSFET晶体管的方法,每个晶体管具有多个层。 第一栅极氧化物层和第一多晶硅层沉积在半导体主体上方的有源区域上。 在所述第一栅极氧化物和多晶硅层和所述半导体本体中蚀刻沟槽以描绘第一和第二有源区,从而形成与第一有源区共同延伸的第一划定的栅极氧化物层和多晶硅层。 材料沉积在所述沟槽中以形成有源区隔离,所述有源区隔离在所述半导体本体上方具有顶表面。 然后在所述第一和第二有源区上形成掩模层,并且去除其选择性部分以暴露所述第二有源区。 屏蔽层和有源区隔离一起形成掩模,其限定与第二有源区域共同延伸的开口,其中限定所述开口的有源区隔离。 通过开口的材料形成第二栅氧化层和第二多晶层,这种第二层和第二多晶层与第二有源区共同延伸。 第一晶体管,其具有第一划定的栅极氧化物和多晶层作为第一晶体管的多个层和第二晶体管的一对,其中第二栅极氧化物层和第二多晶层作为一对多个层 的第二晶体管。
    • 2. 发明授权
    • Memory cell structure and fabrication
    • 存储单元结构和制造
    • US06265742B1
    • 2001-07-24
    • US09317662
    • 1999-05-24
    • Ulrike GrueningJochen BeintnerHans-Oliver Joachim
    • Ulrike GrueningJochen BeintnerHans-Oliver Joachim
    • H01L27108
    • H01L27/10864H01L27/10841
    • A pair of memory cells for use in a DRAM are formed in a monocrystalline bulk portion of a silicon wafer by first forming a pair of vertical trenches spaced apart by a bulk portion of the wafer. After a dielectric layer is formed over the walls of each trench, the trenches are each filled with polycrystalline silicon. By a pair of recess forming and recess filling steps there is formed at the top of each trench a silicon region that was grown epitaxially with the intermediate bulk portion. Each epitaxial region is made to serve as the body of a separate transistor having its drain in the lower polysilicon fill of a trench, and its source in the monocrystalline bulk intermediate between the two epitaxial regions. The lower polysilicon fill of each trench is also made to serve as the storage node of the capacitor of each cell, with the bulk serving as the other plate of the capacitor.
    • 通过首先形成由晶片的主体部分隔开的一对垂直沟槽,在硅晶片的单晶体部分中形成用于DRAM中的一对存储单元。 在每个沟槽的壁之上形成电介质层之后,沟槽各自填充有多晶硅。 通过一对凹陷形成和凹陷填充步骤,在每个沟槽的顶部形成有与中间体部分外延生长的硅区域。 使每个外延区域用作在沟槽的下多晶硅填充物中具有其漏极的单独晶体管​​的主体,并且其源于在两个外延区域之间的单晶体体中间。 每个沟槽的较低多晶硅填充物也用作每个电池的电容器的存储节点,其体积用作电容器的另一个板。
    • 3. 发明授权
    • Memory cell structure and fabrication
    • 存储单元结构和制造
    • US6093614A
    • 2000-07-25
    • US34519
    • 1998-03-04
    • Ulrike GrueningJochen BeintnerHans-Oliver Joachim
    • Ulrike GrueningJochen BeintnerHans-Oliver Joachim
    • H01L21/8242H01L27/108H01L21/20
    • H01L27/10864H01L27/10841
    • A pair of memory cells for use in a DRAM are formed in a monocrystalline bulk portion of a silicon wafer by first forming a pair of vertical trenches spaced apart by a bulk portion of the wafer. After a dielectric layer is formed over the walls of each trench, the trenches are each filled with polycrystalline silicon. By a pair of recess forming and recess filling steps there is formed at the top of each trench a silicon region that was grown epitaxially with the intermediate bulk portion. Each epitaxial region is made to serve as the body of a separate transistor having its drain in the lower polysilicon fill of a trench, and its source in the monocrystalline bulk intermediate between the two epitaxial regions. The lower polysilicon fill of each trench is also made to serve as the storage node of the capacitor of each cell, with the bulk serving as the other plate of the capacitor.
    • 通过首先形成由晶片的主体部分隔开的一对垂直沟槽,在硅晶片的单晶体部分中形成用于DRAM中的一对存储单元。 在每个沟槽的壁之上形成电介质层之后,沟槽各自填充有多晶硅。 通过一对凹陷形成和凹陷填充步骤,在每个沟槽的顶部形成有与中间体部分外延生长的硅区域。 使每个外延区域用作在沟槽的下多晶硅填充物中具有其漏极的单独晶体管​​的主体,并且其源于在两个外延区域之间的单晶体体中间。 每个沟槽的较低多晶硅填充物也用作每个电池的电容器的存储节点,其体积用作电容器的另一个板。
    • 6. 发明授权
    • High performance CMOS word-line driver
    • 高性能CMOS字线驱动
    • US06236617B1
    • 2001-05-22
    • US09458878
    • 1999-12-10
    • Louis L. HsuHans-Oliver JoachimMatthew R. WordemanHing Wong
    • Louis L. HsuHans-Oliver JoachimMatthew R. WordemanHing Wong
    • G11C800
    • G11C8/08
    • A negative wordline DRAM array having n groups of m wordlines, in which one group is driven by a group decoder circuit (having a voltage swing between ground and a circuit high voltage (2 v)) and one driver circuit in each group is exposed to a boosted wordline high voltage (2.8 v) greater than the circuit high voltage, in which the wordline driver circuits have an output stage comprising a standard nfet in series with a high threshold voltage pfet, so that, during activation, the unselected driver circuits exposed to the boosted wordline high voltage have a very low leakage through the pfet, while the selected driver circuit has a high but tolerable leakage (2 &mgr;A) because Vqs on the nfet is nearly at the nfet threshold. The net active power from the entire array is less than that of a conventional configuration due to the reduced voltage swing, while the number of transistors exposed to high voltage stress is reduced from 9 to 1 and the number of buffer nfets required to reduce voltage drop across an active nfet is reduced from 8 to 1.
    • 具有n组m个字线的负字形DRAM阵列暴露于一组,其中一组由组解码器电路(具有地面之间的电压摆幅和电路高电压(2v))和每组中的一个驱动器电路驱动 提升的字线高电压(2.8V)大于电路高电压,其中字线驱动器电路具有包括与高阈值电压pfet串联的标准nfet的输出级,使得在激活期间,未选择的驱动器电路暴露 对于升压的字线高电压通过pfet具有非常低的泄漏,而所选择的驱动器电路具有高但可容许的泄漏(2μA),因为nfet上的Vqs几乎处于nfet阈值。 由于降低的电压摆幅,整个阵列的净有功功率小于传统配置的功率,而暴露于高电压应力的晶体管的数量从9减少到1,并且减少电压降所需的缓冲器数量 跨越一个活跃的nfet从8减少到1。
    • 10. 发明授权
    • LDD device having a high concentration region under the channel
    • LDD器件在通道下方具有高浓度区域
    • US5926703A
    • 1999-07-20
    • US785277
    • 1997-01-21
    • Yasuo YamaguchiHans-Oliver JoachimYasuo Inoue
    • Yasuo YamaguchiHans-Oliver JoachimYasuo Inoue
    • H01L29/40H01L21/336H01L27/12H01L29/417H01L29/78H01L29/786H01L21/44
    • H01L29/66757H01L27/1203H01L29/78606H01L29/78609H01L29/78621
    • It is an object to obtain a semiconductor device with the LDD structure having both operational stability and high speed and a manufacturing method thereof. A high concentration region (11) with boron of about 1.times.10.sup.18 /cm.sup.3 introduced therein is formed extending from under a channel formation region (4) to under a drain region (6) and a source region (6') in a silicon substrate (1). The high concentration region (11) is formed in the surface of the silicon substrate (1) under the channel formation region (4), and is formed at a predetermined depth from the surface of the silicon substrate (1) under the drain region (6) and the source region (6'). A low concentration region (10) is formed in the surface of the silicon substrate (1) under the drain region (6) and the source region (6'). The formation of the high concentration region only in the surface of the semiconductor substrate under the channel formation region surely suppresses an increase in the leakage current and an increase in the drain capacitance.
    • 本发明的目的是获得具有操作稳定性和高速度的LDD结构的半导体器件及其制造方法。 导入其中引入了约1×10 18 / cm 3的硼的高浓度区域(11)形成在沟道形成区域(4)下方延伸到漏极区域(6)下方的硅衬底(1)中的源极区域(6') )。 在硅衬底(1)的沟道形成区域(4)的表面上形成高浓度区域(11),并且形成在与硅衬底(1)的漏极区域 6)和源极区(6')。 在漏极区域(6)和源极区域(6')的下方的硅衬底(1)的表面中形成低浓度区域(10)。 仅在沟道形成区域的半导体衬底的表面形成高浓度区域确实地抑制了漏电流的增加和漏极电容的增加。