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    • 1. 发明申请
    • Integrated sensor arrangement
    • 集成传感器布置
    • US20070107514A1
    • 2007-05-17
    • US11545778
    • 2006-10-10
    • Ulrich SiebenHolger KlapprothMirko Lehmann
    • Ulrich SiebenHolger KlapprothMirko Lehmann
    • G01F15/14
    • G01N21/6454
    • An integrated sensor array has a substrates, at least one sensor element, and a signal processing device integrated in the substrate and connected or capable of being connected with the sensor elements. A layer having a measuring surface is capable of being detachably bonded to the substrate so that a signal emitted from the measuring surface is capable of being processed by the signal processing device when the layer is bonded to the substrate. The substrate has at least one feedthrough hole abutting with the layer, which feedthrough hole is connected or capable of being connected to a vacuum generating device in order to bond the layer to the substrate by suction.
    • 集成传感器阵列具有基板,至少一个传感器元件和集成在基板中并连接或能够与传感器元件连接的信号处理装置。 具有测量表面的层能够可拆卸地结合到基板,使得当该层与基板结合时,从测量表面发射的信号能够被信号处理装置处理。 衬底具有与该层邻接的至少一个馈通孔,所述馈通孔连接或能够连接到真空产生装置,以便通过抽吸将层粘合到衬底。
    • 7. 发明授权
    • Chip arrangement
    • 芯片布置
    • US06288440B1
    • 2001-09-11
    • US09342697
    • 1999-06-29
    • Ulrich SiebenGünter IgelMirko LehmannHans-Jürgen GahleBernhard WolfWerner BaumannRalf Ehret
    • Ulrich SiebenGünter IgelMirko LehmannHans-Jürgen GahleBernhard WolfWerner BaumannRalf Ehret
    • H01L23495
    • H01L23/5385A61B5/14532A61B5/1473G01N33/48707H01L2924/0002H01L2924/00
    • A chip arrangement (1) has a substrate board (2) with an opening (3), into which a carrier chip (4) is inserted, which has an electrical or electronic structural component (5). At least one conductor path (7) is integrated into the carrier chip (4), which connects the structural component (5) to the electrical connection contact (8). The carrier chip (4) is inserted into the opening (3) in such a way that its ends project beyond the opposite-facing, flat-sided surfaces (9, 9′) of the substrate board (2), and thereby form overhangs (10, 10′). Here, the structural component is arranged on the overhang (10) projecting beyond the one surface (9), and the connection contact (8) is arranged on the overhang (10′) projecting beyond the other surface (9′), and the conductor path (7) connecting the structural component (5) and the connection contact (8) passes through the opening (3). A seal is arranged between the substrate board (2) and the carrier chip (4).
    • 芯片装置(1)具有带有开口(3)的基板(2),其中插入有载体芯片(4),其具有电或电子结构部件(5)。 至少一个导体路径(7)集成到载体芯片(4)中,其将结构部件(5)连接到电连接触点(8)。 载体芯片(4)以这样的方式插入到开口(3)中,使得其端部突出超过衬底板(2)的相对面对的平坦表面(9,9'),从而形成突出部 (10,10')。 这里,结构部件布置在突出超过一个表面(9)的伸出部(10)上,并且连接触点(8)布置在突出超过另一个表面(9')的伸出部(10')上,并且 连接结构部件(5)和连接触点(8)的导体路径(7)穿过开口(3)。 在基板(2)和载体芯片(4)之间设置密封件。