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    • 3. 发明授权
    • Capacitive magnetic field sensor
    • 电容式磁场传感器
    • US06765394B1
    • 2004-07-20
    • US09868538
    • 2001-11-26
    • Günter IgelUlrich SiebenJürgen Giehl
    • Günter IgelUlrich SiebenJürgen Giehl
    • G01R2726
    • G01R33/038
    • The invention relates to a capacitive magnetic field sensor. This sensor has a first electrode (2) and a second electrode (3), which are spaced apart from one another and which form a measurement capacitance. The first electrode (2) is situated on a first substrate body (4), and the second electrode (3) on a second substrate body (5). The second substrate body (5) is designed as a deformable membrane in the vicinity of the second electrode (3). A magnetic body (6) is situated in the vicinity of the second electrode (3) and the membrane, and is rigidly connected to the membrane and to the second electrode (3). As a result of this rigid connection, the influence of an external magnetic field on the magnetic body causes not only the magnetic body (6) to change its position but also causes the membrane and the second electrode (3) to change their position, since they are rigidly connected to said magnetic body. Because the second electrode (3) changes its position, its distance from the first electrode (2) changes, and thus the measurement capacitance, which acts as a measure of the externally applied magnetic field. This capacitive magnetic field sensor is distinguished by very small exterior dimensions, great mechanical stability, and low temperature dependence.
    • 本发明涉及电容式磁场传感器。 该传感器具有彼此间隔开并形成测量电容的第一电极(2)和第二电极(3)。 第一电极(2)位于第一基板主体(4)上,第二电极(3)位于第二基板主体(5)上。 第二基板体(5)被设计为在第二电极(3)附近的可变形膜。 磁体(6)位于第二电极(3)和膜附近,并且刚性地连接到膜和第二电极(3)。 作为这种刚性连接的结果,外部磁场对磁体的影响不仅使磁体(6)改变其位置,而且还使膜和第二电极(3)改变其位置,因为 它们刚性地连接到所述磁体。 因为第二电极(3)改变其位置,所以其与第一电极(2)的距离改变,因此测量电容用作外部施加的磁场的量度。 该电容式磁场传感器的外形尺寸非常小,机械稳定性好,温度依赖性低。
    • 6. 发明授权
    • Measuring device
    • 测量工具
    • US06413474B1
    • 2002-07-02
    • US09441769
    • 1999-11-17
    • Günter IgelUlrich SiebenJürgen GiehlBernhard Wolf
    • Günter IgelUlrich SiebenJürgen GiehlBernhard Wolf
    • G01N1506
    • G01L19/147H01L2224/16225H01L2924/00014H01L2224/0401
    • A measuring device (1) has a semiconductor arrangement, which includes a semiconductor chip (2) connected to a carrier (4) having at least one through-hole (3). The semiconductor chip (2) has at least one sensor (6) with an active sensor surface (5) facing the through-hole (3). The semiconductor chip (2) has electrical terminal points (9), which are connected using flip-chip connections (10) to terminal contacts (11) facing the terminal points (9) and located on the carrier (4). The carrier (4) has electrical strip conductors (12), which connect the terminal contacts (11) to contact elements (13) located on the carrier. To the rear side of the carrier (4) having the contact elements (13) a strip conductor carrier (16) is provided, which has strip conductors (12) connected to opposing contacts (14). The opposing contacts (14) are each electrically connected using flip-chip connections (17), to a contact element (13), which are allocated to each of them. The semiconductor chip (2) and the carrier (4) enclose a measuring chamber. Between the carrier (4) and the semiconductor chip (2) a seal (7) is arranged, which is constructed to be porous or semi-porous, at least in certain areas, or is constructed as a selectively permeable membrane, for bringing a substance into the measuring chamber.
    • 测量装置(1)具有半导体装置,其包括连接到具有至少一个通孔(3)的载体(4)的半导体芯片(2)。 半导体芯片(2)具有至少一个具有面向通孔(3)的有源传感器表面(5)的传感器(6)。 半导体芯片(2)具有电气端点(9),它们使用倒装芯片连接(10)连接到面向终端点(9)并位于载体(4)上的端子触点(11)。 载体(4)具有将端子触点(11)连接到位于载体上的接触元件(13)的电条导体(12)。 在具有接触元件(13)的载体(4)的后侧设置带状导体载体(16),该带状导体载体(16)具有连接到相对触点(14)的带状导体(12)。 每个相对的触点(14)都使用倒装芯片连接(17)电连接到分配给它们中的每一个的接触元件(13)。 半导体芯片(2)和载体(4)包围测量室。 在载体(4)和半导体芯片(2)之间,至少在某些区域中布置密封件(7),其被构造为多孔或半孔的,或被构造为选择性渗透膜,用于使 物质进入测量室。
    • 7. 发明授权
    • Semiconductor component
    • 半导体元件
    • US06369435B1
    • 2002-04-09
    • US09440913
    • 1999-11-16
    • Günter Igel
    • Günter Igel
    • H01L2984
    • G01L19/142G01L19/146G01L19/147
    • A semiconductor component (1) has a pressure sensor and a semiconductor chip (2) with a semiconductor structure (3) for at least one additional function of the semiconductor component (1). The semiconductor chip (2) is connected to a casing (5) by means of an elastic carrier arrangement (4) and can be deflected relative to the casing (5) against the restoring force of the material of the carrier arrangement (4) on the whole. For indirect measurement of a pressure acting on the semiconductor chip (2) and causing the deflection of the semiconductor chip (2), at least one position sensor that works together with the semiconductor chip (2) is provided.
    • 半导体部件(1)具有用于半导体部件(1)的至少一个附加功能的具有半导体结构(3)的压力传感器和半导体芯片(2)。 半导体芯片(2)通过弹性载体装置(4)连接到壳体(5),并且可以克服载体装置(4)的材料的恢复力而相对于壳体(5)偏转 整体。 为了间接测量作用在半导体芯片(2)上的压力并引起半导体芯片(2)的偏转,提供了与半导体芯片(2)一起工作的至少一个位置传感器。
    • 8. 发明授权
    • Method and production of a sensor
    • 传感器的方法和生产
    • US06964927B2
    • 2005-11-15
    • US10149560
    • 2001-12-07
    • Günter IgelMarkus Rogalla
    • Günter IgelMarkus Rogalla
    • H01L21/56H01L31/0203H01L31/0232H01L21/302
    • H01L31/0203H01L21/565H01L2924/0002H01L2924/00
    • The invention relates to a method for producing a sensor (1), wherein a carrier chip (2) is produced. Said chip is provided with a sensor structure (3) comprising an active sensor surface (4). A material (9) capable of flowing is applied onto carrier chips (2) in such a way that the sensor structure (3) has a thinner layer thickness on said active sensor surface (4) than on the area of the carrier chip (2) which borders on the active sensor surface (4). The material (9) which is capable of flowing is hardened thereafter. The hardened material (9) is subsequently removed by chemical means from the surface which faces said carrier chip (2) until the active sensor surface of the sensor structure is layed bare.
    • 本发明涉及一种制造传感器(1)的方法,其中制造了载体芯片(2)。 所述芯片设置有包括有源传感器表面(4)的传感器结构(3)。 将能够流动的材料(9)施加到载体芯片(2)上,使得传感器结构(3)在所述主动传感器表面(4)上具有比载体芯片(2)的区域更薄的层厚度 ),其接合在主动传感器表面(4)上。 能够流动的材料(9)之后被硬化。 随后通过化学方法从面向所述载体芯片(2)的表面去除硬化材料(9),直到传感器结构的有源传感器表面裸露。