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    • 1. 发明授权
    • Chip arrangement
    • 芯片布置
    • US06288440B1
    • 2001-09-11
    • US09342697
    • 1999-06-29
    • Ulrich SiebenGünter IgelMirko LehmannHans-Jürgen GahleBernhard WolfWerner BaumannRalf Ehret
    • Ulrich SiebenGünter IgelMirko LehmannHans-Jürgen GahleBernhard WolfWerner BaumannRalf Ehret
    • H01L23495
    • H01L23/5385A61B5/14532A61B5/1473G01N33/48707H01L2924/0002H01L2924/00
    • A chip arrangement (1) has a substrate board (2) with an opening (3), into which a carrier chip (4) is inserted, which has an electrical or electronic structural component (5). At least one conductor path (7) is integrated into the carrier chip (4), which connects the structural component (5) to the electrical connection contact (8). The carrier chip (4) is inserted into the opening (3) in such a way that its ends project beyond the opposite-facing, flat-sided surfaces (9, 9′) of the substrate board (2), and thereby form overhangs (10, 10′). Here, the structural component is arranged on the overhang (10) projecting beyond the one surface (9), and the connection contact (8) is arranged on the overhang (10′) projecting beyond the other surface (9′), and the conductor path (7) connecting the structural component (5) and the connection contact (8) passes through the opening (3). A seal is arranged between the substrate board (2) and the carrier chip (4).
    • 芯片装置(1)具有带有开口(3)的基板(2),其中插入有载体芯片(4),其具有电或电子结构部件(5)。 至少一个导体路径(7)集成到载体芯片(4)中,其将结构部件(5)连接到电连接触点(8)。 载体芯片(4)以这样的方式插入到开口(3)中,使得其端部突出超过衬底板(2)的相对面对的平坦表面(9,9'),从而形成突出部 (10,10')。 这里,结构部件布置在突出超过一个表面(9)的伸出部(10)上,并且连接触点(8)布置在突出超过另一个表面(9')的伸出部(10')上,并且 连接结构部件(5)和连接触点(8)的导体路径(7)穿过开口(3)。 在基板(2)和载体芯片(4)之间设置密封件。
    • 5. 发明授权
    • Method for examination of a surface layer
    • 表层检查方法
    • US06656678B1
    • 2003-12-02
    • US09585146
    • 2000-06-01
    • Bernhard WolfHans-Jürgen GahleGünter IgelWerner BaumannRalf EhretMirko Lehmann
    • Bernhard WolfHans-Jürgen GahleGünter IgelWerner BaumannRalf EhretMirko Lehmann
    • C12Q100
    • H01L22/24G01B11/30G01N21/94
    • In a method for examination of the surface of an object for a topographic and/or a chemical property, the object-surface is impinged with surface-structure selective biocomponents for examination of a topographic property and/or with chemoselective biocomponents for the examination of a chemical property, together with a nutrient medium and/or an osmotic protective medium for the biocomponents. The biocomponents contained in the nutrient medium and/or the osmotic protective medium are in contact with the object-surface or are spaced from the object surface by less than the detection range of the biocomponents. The object surface is then examined with the biocomponents contained in the nutrient medium and/or the osmotic protective medium by determining at least one examination measurement value. The examination measurement value is compared with a reference measurement value, and conclusions can be drawn about the topographic and/or chemical properties of the object from the result of the comparison. Using the method, an object surface can be examined for a topographic and/or chemical property in a simple manner with a high measuring sensitivity.
    • 在用于检查地形和/或化学性质的物体的表面的方法中,物体表面与表面结构选择性生物组分碰撞以检查地形性质和/或化学选择性生物成分用于检查 化学性质,以及生物组分的营养培养基和/或渗透保护介质。 包含在营养培养基和/或渗透保护介质中的生物成分与物体表面接触或与物体表面间隔小于生物成分的检测范围。 然后通过确定至少一个检查测量值用包含在营养培养基和/或渗透保护介质中的生物组分检查物体表面。 将检查测量值与参考测量值进行比较,并从比较结果中得出关于物体的地形和/或化学性质的结论。 使用该方法,可以以高测量灵敏度的简单方式检查物体表面的地形和/或化学特性。
    • 8. 发明授权
    • Coupling and method for its manufacture
    • 联轴器及其制造方法
    • US06346675B1
    • 2002-02-12
    • US09506635
    • 2000-02-18
    • Günter IgelHans-Jürgen GahleMirko Lehmann
    • Günter IgelHans-Jürgen GahleMirko Lehmann
    • H02G318
    • F16B21/088Y10T16/05
    • A coupling (1) has a coupling receiver (2) and a coupling counterpart (3) connectable with it, which in the coupling position is held in a receiver depression (6) of the coupling receiver. The receiver depression (6) is arranged in a layer stack (4) with at least two layers (5a, 5b, 5c, 5d, 5e). Proceeding from the flat surface of the layer stack (4) bordering upon the recess depression (6) to the interior of the receiver depression (6), the lateral boundary wall of the recess depression (6) has at least one cutback, which is formed by a receding layer (5a, 5c) or a receding layer area. The coupling counterpart (3) has at least one lateral guide and/or locking projection (9a, 9b), which engages into a cutback (8a, 8b) of the component (2) in the coupling position.
    • 耦合器(1)具有耦合接收器(2)和可与其连接的耦合对应器(3),其在耦合位置被保持在耦合接收器的接收器凹部(6)中。 接收器凹部(6)布置在具有至少两层(5a,5b,5c,5d,5e)的层叠体(4)中。 从凹陷(6)与接收器凹部(6)的内部接合的层叠体(4)的平坦表面开始,凹陷凹部(6)的侧边界壁具有至少一个切口 由后退层(5a,5c)或后退层区域形成。 耦合对应物(3)具有至少一个横向引导和/或锁定突起(9a,9b),其在联接位置处接合到部件(2)的切口(8a,8b)中。
    • 9. 发明授权
    • Measuring device and process for its manufacture
    • 测量装置及其制造工艺
    • US06471838B1
    • 2002-10-29
    • US09506646
    • 2000-02-18
    • Günter IgelHans-Jürgen GahleMirko Lehmann
    • Günter IgelHans-Jürgen GahleMirko Lehmann
    • G01N27327
    • G01N27/226G01N21/03G01N27/07
    • A measuring device (1), for examining a medium (2) that is liquid or free-flowing, has at least two electrically and/or optically conducting layers or layer areas (5a, 5b, 5c, 6a, 6b, 7a, 7b) located on a substrate layer (3), wherein these layers or layer areas are electrically and/or optically insulated from each other. At least one of these layers or layer areas (5a, 5b, 5c, 6a, 6b, 7a, 7b) is part of a layer stack (4), which has several layers arranged on top of each other on the substrate layer (3). The layer stack has, on its side facing away from the substrate layer (3), a recess that adjoins the electrically and/or optically conducting layers or layer areas (5a, 5b, 6a, 6b, 7a, 7b). At least one electrically and/or optically conducting layer or layer area (5a, 5b, 6a, 6b, 7a, 7b) located in the layer stack (4) is spaced at a distance from the bottom (11) of the recess (10).
    • 用于检查液体或自由流动的介质(2)的测量装置(1)具有至少两个电和/或光导电层或层区(5a,5b,5c,6a,6b,7a,7b) ),其中这些层或层区域彼此电隔离和/或光学绝缘。 这些层或层区域(5a,5b,5c,6a,6b,7a,7b)中的至少一个是层叠体(4)的一部分,其在基底层(3)上彼此顶部布置有多个层 )。 层叠体在其背离衬底层(3)的一侧具有邻接电和/或光传导层或层区(5a,5b,6a,6b,7a,7b)的凹部。 位于层叠体(4)中的至少一个电和/或光传导层或层区(5a,5b,6a,6b,7a,7b)与凹部(10)的底部(11) )。
    • 10. 发明授权
    • Measuring device
    • 测量工具
    • US06413474B1
    • 2002-07-02
    • US09441769
    • 1999-11-17
    • Günter IgelUlrich SiebenJürgen GiehlBernhard Wolf
    • Günter IgelUlrich SiebenJürgen GiehlBernhard Wolf
    • G01N1506
    • G01L19/147H01L2224/16225H01L2924/00014H01L2224/0401
    • A measuring device (1) has a semiconductor arrangement, which includes a semiconductor chip (2) connected to a carrier (4) having at least one through-hole (3). The semiconductor chip (2) has at least one sensor (6) with an active sensor surface (5) facing the through-hole (3). The semiconductor chip (2) has electrical terminal points (9), which are connected using flip-chip connections (10) to terminal contacts (11) facing the terminal points (9) and located on the carrier (4). The carrier (4) has electrical strip conductors (12), which connect the terminal contacts (11) to contact elements (13) located on the carrier. To the rear side of the carrier (4) having the contact elements (13) a strip conductor carrier (16) is provided, which has strip conductors (12) connected to opposing contacts (14). The opposing contacts (14) are each electrically connected using flip-chip connections (17), to a contact element (13), which are allocated to each of them. The semiconductor chip (2) and the carrier (4) enclose a measuring chamber. Between the carrier (4) and the semiconductor chip (2) a seal (7) is arranged, which is constructed to be porous or semi-porous, at least in certain areas, or is constructed as a selectively permeable membrane, for bringing a substance into the measuring chamber.
    • 测量装置(1)具有半导体装置,其包括连接到具有至少一个通孔(3)的载体(4)的半导体芯片(2)。 半导体芯片(2)具有至少一个具有面向通孔(3)的有源传感器表面(5)的传感器(6)。 半导体芯片(2)具有电气端点(9),它们使用倒装芯片连接(10)连接到面向终端点(9)并位于载体(4)上的端子触点(11)。 载体(4)具有将端子触点(11)连接到位于载体上的接触元件(13)的电条导体(12)。 在具有接触元件(13)的载体(4)的后侧设置带状导体载体(16),该带状导体载体(16)具有连接到相对触点(14)的带状导体(12)。 每个相对的触点(14)都使用倒装芯片连接(17)电连接到分配给它们中的每一个的接触元件(13)。 半导体芯片(2)和载体(4)包围测量室。 在载体(4)和半导体芯片(2)之间,至少在某些区域中布置密封件(7),其被构造为多孔或半孔的,或被构造为选择性渗透膜,用于使 物质进入测量室。