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    • 1. 发明授权
    • Method for producing an acceleration sensor
    • 加速度传感器的制造方法
    • US5525549A
    • 1996-06-11
    • US49801
    • 1993-04-21
    • Tsuyoshi FukadaYoshimi YoshinoYukihiko Tanizawa
    • Tsuyoshi FukadaYoshimi YoshinoYukihiko Tanizawa
    • B81B3/00G01L9/00G01P15/08G01P15/12H01L21/3063H01L21/78H01L21/64
    • B81C1/00888B81C1/00158G01L9/0055G01P15/0802G01P15/123H01L21/3063H01L21/78B81B2201/0235B81C2201/0114B81C2201/053Y10S148/028Y10S148/159Y10S438/977
    • A method for producing a semiconductor device that is capable of solving problems related to dicing a metal thin film used for electrochemical etching. According to the method, an n type epitaxial thin layer is formed on a p type single-crystal silicon wafer. An n.sup.+ type diffusion layer is formed in a scribe line area on the epitaxial layer. An n.sup.+ type diffusion layer is formed in an area of the epitaxial layer which corresponds to a predetermined portion of the wafer. An aluminum film is formed over the diffusion layers. The aluminum film has a clearance for passing a dicing blade. Portions of the wafer are electrochemically etched by supplying electricity through the aluminum film and the diffusion layers, to leave portions of the epitaxial layer. The wafer is diced into chips along the scribe line area. Each of the chips forms a separate semiconductor device. The electrochemical etching of the wafer is carried out after the formation of the aluminum film by immersing the wafer in a KOH aqueous solution and by supplying electricity through the aluminum film. The electrochemical etching is terminated at an inflection point where an etching current inflects to a constant level from a peak level. During the electrochemical etching, the diffusion layer reduces horizontal resistance in the epitaxial layer, so that the etched parts receive a sufficient potential to perform the etching.
    • 一种能够解决与用于电化学蚀刻的金属薄膜切割相关的问题的半导体器件的制造方法。 根据该方法,在p型单晶硅晶片上形成n型外延薄层。 在外延层上的划线区域中形成n +型扩散层。 在对应于晶片的预定部分的外延层的区域中形成n +型扩散层。 在扩散层上形成铝膜。 铝膜具有用于通过切割刀片的间隙。 通过供电通过铝膜和扩散层对晶片的一部分进行电化学蚀刻,以留下外延层的部分。 晶片沿着划线区切成芯片。 每个芯片形成单独的半导体器件。 通过将晶片浸入KOH水溶液中并通过铝膜供电,在形成铝膜之后进行晶片的电化学蚀刻。 在蚀刻电流从峰值水平变为恒定水平的拐点处终止电化学蚀刻。 在电化学蚀刻期间,扩散层减小外延层中的水平电阻,使得蚀刻部分具有足够的电位进行蚀刻。
    • 2. 发明授权
    • Production method of a semiconductor dynamic sensor
    • 半导体动态传感器的制作方法
    • US5643803A
    • 1997-07-01
    • US122164
    • 1993-09-17
    • Tsuyoshi FukadaYoshimi YoshinoHiroshige SugitoMinekazu Sakai
    • Tsuyoshi FukadaYoshimi YoshinoHiroshige SugitoMinekazu Sakai
    • G01P15/08G01P15/12H01L21/3063C25F3/12
    • G01P15/0802G01P15/123G01P15/124H01L21/3063Y10S438/924
    • It is intended to provide an etching method for semiconductor devices in which the etching depth or the thickness of a thin thickness portion can be precisely controlled. According to experiment results, when a P-type substrate in which an N-type epitaxial layer is formed is immersed in an etching solution such as KOH or the like, and a voltage for reverse bias of PN junction is applied between an electrode plate opposing the substrate and the epitaxial layer to perform electrochemical etching, it has been found that the distance from the PN junction plane to the etching stop position is approximately equal to a depletion layer width at the substrate side of the PN junction portion. Namely, the etching stops at the forward end of the depletion layer. Therefore, the junction depletion layer width at the substrate side is controlled to be a size obtained by subtracting a necessary depth for etching from a thickness of the semiconductor substrate except for the semiconductor layer, so that the etching depth or the thickness of the thin thickness portion remaining after etching can be precisely controlled.
    • 旨在为半导体器件提供蚀刻方法,其中可以精确地控制蚀刻深度或厚度厚度部分的厚度。 根据实验结果,当将形成有N型外延层的P型衬底浸入诸如KOH等的蚀刻溶液中时,将PN结的反向偏压施加在相对的电极板之间 衬底和外延层进行电化学蚀刻,已经发现从PN结面到蚀刻停止位置的距离近似等于PN结部分的衬底侧的耗尽层宽度。 也就是说,蚀刻在耗尽层的前端停止。 因此,将衬底侧的结耗尽层宽度控制为通过从除了半导体层之外的半导体衬底的厚度减去所需的蚀刻深度获得的尺寸,使得蚀刻深度或厚度厚度 可以精确地控制蚀刻后残留的部分。
    • 4. 发明授权
    • Apparatus for optically detecting an extraneous matter on a translucent
shield
    • 用于光学检测半透明屏蔽上的外来物质的装置
    • US4867561A
    • 1989-09-19
    • US87168
    • 1987-08-18
    • Tetsuo FujiiHirohito ShioyaTiaki MizunoTadashi KamadaYasuaki MakinoYoshimi YoshinoSeiichiro Otake
    • Tetsuo FujiiHirohito ShioyaTiaki MizunoTadashi KamadaYasuaki MakinoYoshimi YoshinoSeiichiro Otake
    • B60H1/00B60S1/08
    • B60S1/0822B60H1/00785B60S1/0837G06K9/00791Y10S15/15
    • An apparatus for optically detecting the attachment state of extraneous matters to a translucent shield member. The optically detecting apparatus comprises a light-emitting unit having a plurality of light-emitting elements each emitting a light ray toward the translucent shield member, a photoelectric transducer unit having a plurality of transducer elements each receiving each of the light rays reflected on the translucent shield member, and a data processing unit coupled to the transducer unit. The transducer unit generates detection signals corresponding to the quantities of the received light rays and the data processing unit successively compares the level of each of the detection signals with a predetermined level to produce binary signals in accordance with the results of the comparison so that a binary signal pattern is defined at the respective transducer elements. The data processing unit determines the attachment state of the extraneous matters to the translucent shield member by comparing the defined binary signal pattern with a reference pattern.
    • 一种用于光学地检测外来物质到半透明屏蔽构件的附着状态的装置。 光学检测装置包括具有多个发光元件的发光单元,每个发光元件朝向半透明屏蔽构件发射光线;光电变换器单元,具有多个换能器元件,每个换能器元件接收在半透明屏蔽构件上反射的每个光线 屏蔽构件和耦合到换能器单元的数据处理单元。 换能器单元产生对应于接收光线的量的检测信号,并且数据处理单元根据比较结果将每个检测信号的电平与预定电平连续地进行比较,以产生二进制信号,使得二进制 在相应的换能器元件处限定信号图案。 数据处理单元通过将定义的二进制信号模式与参考模式进行比较来确定外部物质对半透明屏蔽构件的附着状态。